公开(公告)号：US20200251433A1

公开(公告)日：2020-08-06

申请号：US16853252

申请日：2020-04-20

Applicant: ROHM CO., LTD.

Inventor： Koshun SAITO

IPC: H01L23/00 ,  H01L21/768 ,  H01L23/31 ,  H01L23/495

Abstract: A semiconductor device includes a predetermined number of leads, a semiconductor element electrically connected to the leads and supported by one of the leads, and a sealing resin that covers the semiconductor element and a part of each lead. Each lead includes some portions exposed from the sealing resin. A surface plating layer is formed on at least one of the exposed portions of the respective leads.

公开(公告)号：US20200251409A1

公开(公告)日：2020-08-06

申请号：US16744743

申请日：2020-01-16

Applicant: Rohm Co., Ltd.

Inventor： Koshun SAITO ,  Tsuyoshi TACHI

IPC: H01L23/495 ,  H01L29/20 ,  H01L29/778 ,  H01L23/31 ,  H01L23/00

Abstract: The semiconductor device includes a semiconductor element, a first lead, and a second lead. The semiconductor element has an element obverse surface and an element reverse surface spaced apart from each other in a thickness direction. The semiconductor element includes an electron transit layer disposed between the element obverse surface and the element reverse surface and formed of a nitride semiconductor, a first electrode disposed on the element obverse surface, and a second electrode disposed on the element reverse surface and electrically connected to the first electrode. The semiconductor element is mounted on the first lead, and the second electrode is joined to the first lead. The second lead is electrically connected to the first electrode. The semiconductor element is a transistor. The second lead is spaced apart from the first lead and is configured such that a main current to be subjected to switching flows therethrough.

公开(公告)号：US20180138134A1

公开(公告)日：2018-05-17

申请号：US15801999

申请日：2017-11-02

Applicant: ROHM CO., LTD.

Inventor： Kentaro CHIKAMATSU ,  Koshun SAITO ,  Kenichi YOSHIMOCHI

IPC: H01L23/64 ,  H01L23/495 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56

CPC classification number: H01L23/645 ,  H01L21/4825 ,  H01L21/4842 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/4951 ,  H01L23/49562 ,  H01L23/49568 ,  H01L29/2003 ,  H01L29/7787 ,  H02M3/155

Abstract: A semiconductor device includes a lead frame, a transistor, and an encapsulation resin. The lead frame includes a drain frame, a source frame, and a gate frame. The drain frame includes drain frame fingers. The source frame includes source frame fingers. The drain frame fingers and the source frame fingers are alternately arranged in a first direction and include overlapping portions as viewed from a first direction. In a region where each drain frame finger overlaps the source frame fingers as viewed in the first direction, at least either one of the drain frame fingers and the source frame fingers are not exposed from the back surface of the encapsulation resin.

公开(公告)号：US20240120261A1

公开(公告)日：2024-04-11

申请号：US18528149

申请日：2023-12-04

Applicant: ROHM CO., LTD.

Inventor： Daichi NIWA ,  Yuki SETA ,  Koshun SAITO

IPC: H01L23/495 ,  H01L23/31

CPC classification number: H01L23/49541 ,  H01L23/3107

Abstract: A semiconductor device capable of suppressing separation of a sealing resin at an internal reverse surface is provided. The semiconductor device includes a semiconductor element, a first lead on which the semiconductor element is mounted, and a sealing resin covering the semiconductor element and a part of the lead. The lead includes an obverse surface to which the semiconductor element is bonded, a reverse surface facing away from the obverse surface in a thickness direction of the first lead and exposed from the sealing resin, and an internal reverse surface facing the same side as a side that the reverse surface faces in the thickness direction and covered with the sealing resin. The internal reverse surface includes an irregular portion.

公开(公告)号：US20230268311A1

公开(公告)日：2023-08-24

申请号：US18005264

申请日：2021-07-05

Applicant: ROHM CO., LTD.

Inventor： Koshun SAITO

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/495

CPC classification number: H01L24/73 ,  H01L24/05 ,  H01L24/06 ,  H01L24/29 ,  H01L24/32 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/83 ,  H01L24/84 ,  H01L24/92 ,  H01L23/3107 ,  H01L23/49568 ,  H01L23/49513 ,  H01L2924/10272 ,  H01L2924/1033 ,  H01L2924/13091 ,  H01L2224/05553 ,  H01L2224/05552 ,  H01L2224/06051 ,  H01L2224/0603 ,  H01L2224/06181 ,  H01L2224/29111 ,  H01L2224/29116 ,  H01L2224/32245 ,  H01L2224/37147 ,  H01L2224/40108 ,  H01L2224/40245 ,  H01L2224/40499 ,  H01L2924/0105 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48108 ,  H01L2224/48245 ,  H01L2224/83815 ,  H01L2224/83192 ,  H01L2224/84815 ,  H01L2224/92157 ,  H01L2224/92246 ,  H01L2224/73221 ,  H01L2224/73263 ,  H01L2224/73265

Abstract: A semiconductor device includes a die pad, a semiconductor element, a joining layer, a first conductive member, and a second conductive member. The semiconductor element has a first electrode opposing an obverse surface of the die pad, and a second electrode and a third electrode that are opposite to the first electrode in a thickness direction. The first electrode is electrically joined to the obverse surface. The joining layer electrically joins the first electrode and the obverse surface to each other. The first conductive member is electrically joined to the second electrode. The second conductive member is electrically joined to the third electrode. The area of the third electrode is smaller than the area of the second electrode as viewed along the thickness direction. The Young's modulus of the second conductive member is smaller than the Young's modulus of the first conductive member.

公开(公告)号：US20230030063A1

公开(公告)日：2023-02-02

申请号：US17960632

申请日：2022-10-05

Applicant: ROHM CO., LTD.

Inventor： Koshun SAITO

IPC: H01L23/31

Abstract: A semiconductor device includes a semiconductor element, first and second leads, and a sealing resin. The semiconductor element includes first and second electrodes. The first lead includes a mounting base having a main face to which the first electrode is bonded and a back face, and includes a first terminal connected to the first electrode. The second lead includes a second terminal connected to the second electrode. The sealing resin includes a main face and a back face opposite to each other, and includes an end face oriented in the protruding direction of the terminals. The back face of the mounting base is exposed from the back face of the resin. The sealing resin includes a groove formed in its back face and disposed between the back face of the mounting base and a boundary between the second terminal and the end face of the resin.

公开(公告)号：US20220246551A1

公开(公告)日：2022-08-04

申请号：US17725111

申请日：2022-04-20

Applicant: ROHM CO., LTD.

Inventor： Kentaro CHIKAMATSU ,  Koshun SAITO ,  Kenichi YOSHIMOCHI

IPC: H01L23/64 ,  H01L23/495 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56

Abstract: A semiconductor device includes a lead frame, a transistor, and an encapsulation resin. The lead frame includes a drain frame, a source frame, and a gate frame. The drain frame includes drain frame fingers. The source frame includes source frame fingers. The drain frame fingers and the source frame fingers are alternately arranged in a first direction and include overlapping portions as viewed from a first direction. In a region where each drain frame finger overlaps the source frame fingers as viewed in the first direction, at least either one of the drain frame fingers and the source frame fingers are not exposed from the back surface of the encapsulation resin.

公开(公告)号：US20210159162A1

公开(公告)日：2021-05-27

申请号：US17166102

申请日：2021-02-03

Applicant: Rohm Co., Ltd.

Inventor： Kota ISE ,  Koshun SAITO

IPC: H01L23/498 ,  H01L23/31 ,  H01L23/00

Abstract: A semiconductor device includes a semiconductor element, a first lead supporting the semiconductor element, a second lead separated from the first lead, and a connection lead electrically connecting the semiconductor element to the second lead. The connection lead has an end portion soldered to the second lead. This connection-lead end portion has a first surface facing the semiconductor element and a second surface opposite to the first surface. The second lead is formed with a recess that is open toward the semiconductor element. The recess has a side surface facing the second surface of the connection-lead end portion. A solder contact area of the second surface of the connection-lead end portion is larger than a solder contact area of the first surface of the connection-lead end portion.

公开(公告)号：US20200091060A1

公开(公告)日：2020-03-19

申请号：US16573244

申请日：2019-09-17

Applicant: Rohm Co., Ltd.

Inventor： Koshun SAITO ,  Yasufumi MATSUOKA

IPC: H01L23/498 ,  H01L23/00 ,  H01L23/31 ,  H01L25/07

Abstract: A semiconductor device includes a semiconductor element, a first lead including a mounting portion for the semiconductor element and a first terminal portion connected to the mounting portion, and a sealing resin covering the semiconductor element and a portion of the first lead. The mounting portion has a mounting-portion front surface and a mounting-portion back surface opposite to each other in a thickness direction, with the semiconductor element mounted on the mounting-portion front surface. The sealing resin includes a resin front surface, a resin back surface and a resin side surface connecting the resin front surface and the resin back surface. The mounting-portion back surface of the first lead is flush with the resin back surface. The first terminal portion includes a first-terminal-portion back surface exposed from the resin back surface, in a manner such that the first-terminal-portion back surface extends to the resin side surface.

公开(公告)号：US20200035587A1

公开(公告)日：2020-01-30

申请号：US16491499

申请日：2018-03-05

Applicant: ROHM CO., LTD.

Inventor： Koshun SAITO ,  Keiichi TAKAHASHI

IPC: H01L23/495 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56

Abstract: A semiconductor device includes a semiconductor element, a packaging material that encapsulates the semiconductor element, and a metal member electrically connected to the semiconductor element and having a protruding portion protruding from an end face of the packaging material, in which the protruding portion has a lateral peripheral edge along the end face of the packaging material, a longitudinal peripheral edge along the normal direction of the end face, and a corner peripheral edge formed by side portions that are disposed at the corners of the protruding portion and continue to the lateral peripheral edge and the longitudinal peripheral edge, and in which the corner peripheral edge includes a first side portion intersecting substantially orthogonally with the lateral peripheral edge and extending toward the end face of the packaging material and a second side portion with one end thereof intersecting substantially orthogonally with the first side portion and the other end intersecting substantially orthogonally with the longitudinal peripheral edge.