公开(公告)号：US20170086299A1

公开(公告)日：2017-03-23

申请号：US15092043

申请日：2016-04-06

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Myung-Sam KANG ,  Sam-Dae PARK ,  Tae-Hong MIN ,  Il-Jong SEO ,  Young-Gwan KO

IPC: H05K1/18 ,  H05K1/02 ,  H05K1/11 ,  H05K3/46 ,  H05K3/06 ,  H01G4/008 ,  H01G4/12 ,  H05K3/40 ,  H05K1/03 ,  H05K1/09

CPC classification number: H01G4/1227 ,  H01G2/10 ,  H01G4/008 ,  H01G4/0085 ,  H01G4/232 ,  H01G4/30 ,  H01G4/33 ,  H05K1/162 ,  H05K3/4605 ,  H05K3/4629 ,  H05K3/4688 ,  H05K2201/096

Abstract: A printed circuit board and a method for manufacturing the same are provided. A printed circuit board according to an example includes a core formed by laminating dielectric substance layers; a capacitor including an internal electrode layer formed between the dielectric substance layers which are adjacent with each other and a connection via alternately connecting the internal electrode layers which are adjacent with each other to provide an electric charge having a different polarity to the internal electrode layers which are adjacent with each other and formed on the core; and a through via passing through the core.

公开(公告)号：US20160302298A1

公开(公告)日：2016-10-13

申请号：US15002720

申请日：2016-01-21

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Tae-Hong MIN ,  Myung-Sam KANG ,  Young-Gwan KO

IPC: H05K1/02 ,  H05K1/11 ,  H05K3/06 ,  H05K1/18

CPC classification number: H05K1/0204 ,  H05K1/0207 ,  H05K1/0218 ,  H05K1/0271 ,  H05K3/4608 ,  H05K2201/0323 ,  H05K2201/0338 ,  H05K2201/066 ,  H05K2201/10416

Abstract: Disclosed are a circuit board and a method of manufacturing the same. The circuit board includes an insulating part, a heat-transfer structure disposed in the insulating part, the heat-transfer structure including a thermally conductive material formed in a column shape, and a function hole penetrating the heat-transfer structure between a top surface and a bottom surface of the heat-transfer structure.

Abstract translation: 公开了一种电路板及其制造方法。 电路板包括绝缘部分，设置在绝缘部分中的传热结构，所述传热结构包括形成为柱状的导热材料，以及穿透所述传热结构的功能孔，所述导热材料在顶表面和 传热结构的底面。

公开(公告)号：US20160249457A1

公开(公告)日：2016-08-25

申请号：US15045544

申请日：2016-02-17

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Tae-Hong MIN ,  Myung-Sam KANG ,  Young-Gwan KO ,  Min-Jae SEONG

IPC: H05K1/18 ,  H05K1/02 ,  H05K1/11

CPC classification number: H05K1/0298 ,  H01L23/13 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/00 ,  H05K1/113 ,  H05K3/4608 ,  H05K2201/0195 ,  H05K2201/0367 ,  H05K2201/09672 ,  H05K2201/09872 ,  H05K2201/10674

Abstract: A circuit board and an assembly including the circuit board are provided. The circuit board includes a first insulation layer, a first conductive pattern disposed on the first insulation layer, an insulation film disposed on the first conductive pattern, and a second conductive pattern disposed on the insulation film. The insulation film includes an insulation thin film contacting the first conductive pattern, and a function film disposed on the insulation thin film and contacting the second conductive pattern.

Abstract translation: 提供电路板和包括电路板的组件。 电路板包括第一绝缘层，设置在第一绝缘层上的第一导电图案，设置在第一导电图案上的绝缘膜，以及布置在绝缘膜上的第二导电图案。 绝缘膜包括与第一导电图案接触的绝缘薄膜和设置在绝缘薄膜上并与第二导电图案接触的功能膜。

公开(公告)号：US20160249450A1

公开(公告)日：2016-08-25

申请号：US15000398

申请日：2016-01-19

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Tae-Hong MIN ,  Myung-Sam KANG ,  Jin-Hyuk JANG ,  Young-Gwan KO

IPC: H05K1/02 ,  H05K3/40 ,  H05K1/18 ,  H05K1/11 ,  H05K1/03

CPC classification number: H05K1/185 ,  H01L2224/16225 ,  H01L2924/15311 ,  H05K3/4608 ,  H05K3/4644 ,  H05K3/4697 ,  H05K2201/0323 ,  H05K2201/049 ,  H05K2201/096 ,  H05K2201/10378

Abstract: A circuit board and a related manufacturing method are disclosed. The circuit board includes a core part that includes a first core layer that is formed of graphite or graphene material and that has a through hole that penetrates from one surface through to the other surface of the first core layer, and a second core layer and a third core layer that are formed of a metallic material and disposed respectively on the one surface and the other surface of the first core layer. The through hole is filled with the metallic material that forms the second core layer and the third core layer.

Abstract translation: 公开了电路板和相关的制造方法。 电路板包括芯部，其包括由石墨或石墨烯材料形成的第一芯层，并且具有从第一芯层的一个表面穿过至另一个表面的通孔，以及第二芯层和 第三芯层由金属材料形成并且分别设置在第一芯层的一个表面和另一个表面上。 通孔填充有形成第二芯层和第三芯层的金属材料。

公开(公告)号：US20160143132A1

公开(公告)日：2016-05-19

申请号：US14937625

申请日：2015-11-10

Applicant: Samsung Electro-Mechanics Co., Ltd

Inventor： Tae-Hong MIN ,  Myung-Sam KANG ,  Jung-Han LEE ,  Young-Gwan KO

IPC: H05K1/02 ,  H05K3/00 ,  H05K3/18 ,  H05K1/11

CPC classification number: H05K1/0207 ,  H05K1/0272 ,  H05K3/002 ,  H05K3/445 ,  H05K3/4608 ,  H05K2201/064 ,  H05K2201/09136 ,  H05K2201/09827 ,  H05K2201/09854 ,  H05K2203/1105 ,  H05K2203/1338 ,  H05K2203/1361 ,  H05K2203/1572 ,  H05K2203/308

Abstract: A circuit board includes: a core portion comprising a fluid path, the fluid path being open toward an outside of the circuit board to allow a fluid outside the circuit board to pass through the fluid path; and insulation layers disposed above and below the core portion.

Abstract translation: 电路板包括：芯部，包括流体路径，所述流体路径朝向所述电路板的外部开口，以允许所述电路板外部的流体通过所述流体路径; 以及设置在芯部上方和下方的绝缘层。