公开(公告)号：US20240387486A1

公开(公告)日：2024-11-21

申请号：US18584905

申请日：2024-02-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dahee Kim ,  Hongwon Kim ,  Jae-Ean Lee ,  Taehoon Lee ,  Gyujin Choi

IPC: H01L25/16 ,  H01L23/00 ,  H01L23/31 ,  H01L23/48 ,  H01L23/498

Abstract: An example semiconductor package includes a substrate, a first semiconductor chip mounted on the substrate, a mold layer on the substrate to cover the first semiconductor chip, and outer terminals positioned below the substrate. The substrate includes a first interconnection layer, a second interconnection layer on the first interconnection layer, a passive device mounted on a bottom surface of the second interconnection layer, and a connection member at a side of the passive device and between the first interconnection layer and the second interconnection layer to connect the first interconnection layer to the second interconnection layer. The outer terminals are coupled to a bottom surface of the first interconnection layer, the passive device includes a first pad on a top surface of the passive device, and an interconnection pattern of the second interconnection layer contacts the first pad.

公开(公告)号：US20240347487A1

公开(公告)日：2024-10-17

申请号：US18368640

申请日：2023-09-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jaeean Lee ,  Dahee Kim ,  Taehoon Lee ,  Gyujin Choi

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/498

CPC classification number: H01L24/05 ,  H01L23/3128 ,  H01L23/49822 ,  H01L23/49833 ,  H01L24/06 ,  H01L24/08 ,  H01L23/49838 ,  H01L24/03 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/03462 ,  H01L2224/05548 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/0601 ,  H01L2224/08225 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48225 ,  H01L2224/73265 ,  H01L2924/1815

Abstract: An upper redistribution wiring layer of a semiconductor package includes a protective layer provided on at least one upper insulating layer and having an opening that exposes at least a portion of an uppermost redistribution wiring among second redistribution wirings, and a bonding pad provided on the uppermost redistribution wiring through the opening. The bonding pad includes a first plating pattern formed on the uppermost redistribution wiring, the first plating pattern including a via pattern provided in the opening and a pad pattern formed on the via pattern to be exposed from the opening, a second plating pattern on the second plating pattern, and a third plating pattern on the second plating pattern.

公开(公告)号：US20240063131A1

公开(公告)日：2024-02-22

申请号：US18203239

申请日：2023-05-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jaeean Lee ,  Dahee Kim ,  Taehoon Lee ,  Gyujin Choi

IPC: H01L23/538 ,  H10B80/00 ,  H01L25/18 ,  H01L25/00 ,  H01L23/00

CPC classification number: H01L23/5385 ,  H10B80/00 ,  H01L25/18 ,  H01L25/50 ,  H01L24/19 ,  H01L24/20 ,  H01L24/32 ,  H01L24/29 ,  H01L2224/19 ,  H01L2224/211 ,  H01L24/16 ,  H01L2224/16227 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29194 ,  H01L2924/0665 ,  H01L2224/32225 ,  H01L24/73 ,  H01L2224/73204 ,  H01L24/33 ,  H01L2224/33181 ,  H01L2224/73267 ,  H01L2224/32221 ,  H01L2924/1431 ,  H01L2924/1432 ,  H01L2924/1436 ,  H01L2924/1437 ,  H01L2924/1443 ,  H01L2924/1441 ,  H01L2924/14335 ,  H01L23/3128

Abstract: A semiconductor package includes a first substrate having a first surface and a second surface, and having a cavity extending from the first surface to the second surface in a vertical direction, a first chip disposed in the cavity of the first substrate, a redistribution structure on the first surface of the first substrate, a second chip on the redistribution structure, a third chip spaced apart from the second chip in a horizontal direction and disposed on the redistribution structure, and a bridge chip embedded in the redistribution structure, wherein the redistribution structure includes a first redistribution pattern, a second redistribution pattern, and a third redistribution pattern.

公开(公告)号：US11586298B2

公开(公告)日：2023-02-21

申请号：US17330568

申请日：2021-05-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Taehoon Lee

IPC: G09G5/00 ,  G06F3/03 ,  G02F1/1333 ,  G06T3/60 ,  G06F1/16

Abstract: A display apparatus and a controlling method thereof are provided. The display apparatus includes: a display panel; at least one sensor configured to detect a distance to an external object; a driver configured to rotate the display panel while a front surface of the display panel maintains a facing direction; and a processor configured to: based on an event for rotating the display panel occurring, control the driver to rotate the display panel, and based on detecting, via the at least one sensor, the object within a predetermined distance in a rotating direction of the display panel while the display panel rotates, control the driver to stop rotating the display panel, wherein the predetermined distance has different values according to a rotating angle by which the display panel has rotated from a position of the display panel before the event occurred.

公开(公告)号：US11372323B2

公开(公告)日：2022-06-28

申请号：US16814580

申请日：2020-03-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hwanseok Seo ,  SeongSue Kim ,  Taehoon Lee ,  Roman Chalykh

IPC: G03F1/22 ,  G03F1/26 ,  G03F1/52 ,  G03F1/24 ,  G03F1/34

Abstract: A phase-shift mask for extreme ultraviolet (EUV) lithography may be provided. The phase-shift mask may include a substrate, a reflection layer on the substrate, and phase-shift patterns including at least one metal nitride on the reflection layer. The at least one metal nitride may include at least one of TaN, TiN, ZrN, HfN, CrN, VN, NbN, MoN, WN, AlN, GaN, ScN, and YN.

公开(公告)号：US20250140771A1

公开(公告)日：2025-05-01

申请号：US18668868

申请日：2024-05-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dahee Kim ,  Taehoon Lee ,  Gyujin Choi

IPC: H01L25/18 ,  H01L21/48 ,  H01L23/00 ,  H01L23/31 ,  H01L23/367 ,  H01L23/498

Abstract: A semiconductor package using a core layer to reduce the total thickness of the semiconductor package and to maximize heat dissipation characteristics is provided. The semiconductor package includes a first redistribution layer, a first semiconductor device disposed on the first redistribution layer, a second semiconductor device disposed on the first redistribution layer and adjacent to the first semiconductor device, a support member disposed at side surfaces of the first semiconductor device and the second semiconductor device, a third semiconductor device disposed above the second semiconductor device, and a heat dissipation structure disposed above the first semiconductor device and adjacent to the third semiconductor device.

公开(公告)号：US11379175B2

公开(公告)日：2022-07-05

申请号：US16588354

申请日：2019-09-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sungmin Lim ,  Taehoon Lee ,  Hanjin Park ,  Changwon Choi

IPC: G06F3/147 ,  G09G5/373 ,  G09G5/38

Abstract: A display apparatus and a control method thereof are provided. The display apparatus includes: a display, a driver configured to rotate the display between a horizontal arrangement state in which a width of the display is greater than a height of the display, and a vertical arrangement state in which the height of the display is greater than the width of the display; and a processor configured to execute instructions to: identify an object included in an image, identify whether the image is an image of a horizontal type or an image of a vertical type based on the identified object, and based on an arrangement state of the display and the identified type of the image, control the driver to rotate the display.

公开(公告)号：US10949160B2

公开(公告)日：2021-03-16

申请号：US16588128

申请日：2019-09-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Taehoon Lee

IPC: G06F3/14 ,  G06F3/0484 ,  G09G5/38

Abstract: A display apparatus and a controlling method thereof are provided. The display apparatus includes: a display; a communicator including circuitry configured to communicate with an electronic apparatus; a processor configured to execute instructions to: identify whether blank regions are included in an image for mirroring based on the image for mirroring being received from the electronic apparatus through the communicator, and control to display, on the display, an image of a remaining region excluding the blank regions in the received image based on the blank regions being identified in the received image in a state in which the display is oriented in a predetermined direction.