公开(公告)号：US20170345768A1

公开(公告)日：2017-11-30

申请号：US15609183

申请日：2017-05-31

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ki-hyuk KIM ,  Sang-hyun LEE ,  Sung-jin KIM ,  Yong-cheol SEO ,  Jin-kuk BAE

IPC: H01L23/544 ,  H01L21/78 ,  H01L23/31 ,  H01L23/00

CPC classification number: H01L23/544 ,  H01L21/76874 ,  H01L21/78 ,  H01L21/784 ,  H01L21/822 ,  H01L23/3157 ,  H01L23/3171 ,  H01L23/562 ,  H01L23/585 ,  H01L24/06 ,  H01L24/14 ,  H01L2223/5446

Abstract: A semiconductor device includes a semiconductor substrate including a main chip region and a remaining scribe lane region surrounding the main chip region, a passivation layer on the main chip region, the passivation layer including a plurality of bridge patterns extending from the main chip region in a first direction across the remaining scribe lane region, a plurality of bump pads exposed by the passivation layer on the main chip region, a plurality of dam structures along edges of the main chip region on the remaining scribe lane region, the plurality of bridge patterns arranged on the plurality of dam structures at a first pitch in the first direction, a seed layer on the plurality of bump pads, and bumps on the seed layer.

公开(公告)号：US20160163663A1

公开(公告)日：2016-06-09

申请号：US14958922

申请日：2015-12-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： Gi-bum KIM ,  Sang-hyun LEE ,  Ho-seob LEE

IPC: H01L23/00

CPC classification number: H01L24/05 ,  H01L24/13 ,  H01L27/156 ,  H01L33/62 ,  H01L2224/02126 ,  H01L2224/02375 ,  H01L2224/02377 ,  H01L2224/0392 ,  H01L2224/0401 ,  H01L2224/05008 ,  H01L2224/05022 ,  H01L2224/05023 ,  H01L2224/0508 ,  H01L2224/05171 ,  H01L2224/05178 ,  H01L2224/0518 ,  H01L2224/05552 ,  H01L2224/05571 ,  H01L2224/05572 ,  H01L2224/05576 ,  H01L2224/0558 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/13021 ,  H01L2224/13024 ,  H01L2224/13027 ,  H01L2224/13111 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/01083 ,  H01L2924/01079

Abstract: An embodiment includes a semiconductor light-emitting device comprising: an electrode pad; a first under-barrier metal (UBM) layer stacked on the electrode pad; a second UBM layer stacked on the first UBM layer and having a multilayered structure including at least two layers; and a solder bump disposed on the second UBM layer, wherein adhesion between the second UBM layer and the first UBM layer is higher than adhesion between the first UBM layer and the solder bump.

Abstract translation: 实施例包括半导体发光器件，包括：电极焊盘; 堆叠在所述电极焊盘上的第一下阻挡金属（UBM）层; 第二UBM层，堆叠在第一UBM层上并且具有包括至少两层的多层结构; 以及设置在所述第二UBM层上的焊料凸块，其中所述第二UBM层和所述第一UBM层之间的粘附性高于所述第一UBM层和所述焊料凸块之间的粘附。

公开(公告)号：US20150255694A1

公开(公告)日：2015-09-10

申请号：US14716835

申请日：2015-05-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sang-hyun LEE ,  Dong-hyuck KAM ,  Gam-han YONG ,  Jin-gi HONG ,  Seong-deok HWANG

IPC: H01L33/62 ,  H01L27/15 ,  H01L33/58 ,  H01L33/60 ,  H01L33/50

CPC classification number: H01L33/62 ,  H01L27/153 ,  H01L33/46 ,  H01L33/502 ,  H01L33/505 ,  H01L33/54 ,  H01L33/58 ,  H01L33/60 ,  H01L2224/13 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/0002 ,  H01L2924/12044 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The present application relates to a light emitting device package. The light emitting device package includes a package substrate in which a via hole is formed. An electrode layer extends to both surfaces of the package substrate after passing through the via hole. A light emitting device is arranged on the package substrate and is connected to the electrode layer. A fluorescence film includes a first part that fills at least a part of an internal space of the via hole and a second part that covers at least a part of the light emitting device.

Abstract translation: 本申请涉及发光器件封装。 发光器件封装包括其中形成有通孔的封装衬底。 电极层在通过通孔之后延伸到封装衬底的两个表面。 发光器件布置在封装衬底上并连接到电极层。 荧光膜包括填充通孔的内部空间的至少一部分的第一部分和覆盖发光器件的至少一部分的第二部分。