公开(公告)号：US20200274310A1

公开(公告)日：2020-08-27

申请号：US15931109

申请日：2020-05-13

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Chee Hiong CHEW ,  Atapol PRAJUCKAMOL ,  Yusheng LIN

IPC: H01R43/16 ,  H01R13/415 ,  H01R12/58 ,  H01R43/26 ,  H01R13/05

Abstract: A press-fit pin for a semiconductor package includes a shaft terminating in a head. A pair of arms extends away from a center of the head. Each arm includes a curved shape and the arms together form an s-shape. A length of the s-shape is longer than the shaft diameter. An outer extremity of each arm includes a contact surface configured to electrically couple to and form a friction fit with a pin receiver. In implementations the press-fit pin has only two surfaces configured to contact an inner sidewall of the pin receiver and is configured to contact the inner sidewall at only two locations. The shaft may be a cylinder. The s-shape formed by the pair of arms is visible from a view facing a top of the press-fit pin along a direction parallel with the longest length of the shaft. Versions include a through-hole extending through the head.

公开(公告)号：US20200176907A1

公开(公告)日：2020-06-04

申请号：US16783345

申请日：2020-02-06

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Yushuang YAO ,  Chee Hiong CHEW ,  Atapol PRAJUCKAMOL

IPC: H01R13/05 ,  H01R12/57 ,  H01R12/58 ,  H01R43/02 ,  H01R43/16

Abstract: Implementations of pins for semiconductor packages may include: an upper contact portion having a contact surface coupled with a pin receiver; a lower portion having a vertical stop and at least two curved legs; a horizontal base coupled directly to the at least two curved legs and configured to be soldered to a substrate to mechanically and electrically couple the pin to the substrate, the horizontal base having an upper contact surface, and; a gap between a bottom contact surface of the vertical stop and the upper contact surface of the horizontal base.

公开(公告)号：US20180228041A1

公开(公告)日：2018-08-09

申请号：US15945649

申请日：2018-04-04

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Atapol PRAJUCKAMOL ,  Chee Hiong CHEW ,  Yushuang YAO

IPC: H05K5/02 ,  H01L23/40 ,  H01L23/053

CPC classification number: H05K5/0213 ,  H01L23/053 ,  H01L23/40 ,  H01L23/4006 ,  H01L23/4093 ,  H01L2924/0002 ,  H05K5/0221 ,  H01L2924/00

Abstract: In one embodiment, a semiconductor package may be formed having a first side and a second side that is substantially opposite to the first side. An embodiment may include forming an attachment clip extending substantially laterally between the first and second sides wherein the attachment clip is positioned near a distal end of the first and second sides. An embodiment may also include forming the attachment clip to have a flexible main portion that can bend away from a plane of the main portion toward a bottom side of the semiconductor package.

公开(公告)号：US20170117211A1

公开(公告)日：2017-04-27

申请号：US15094022

申请日：2016-04-08

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Chee Hiong CHEW ,  Atapol PRAJUCKAMOL ,  Yushuang YAO

IPC: H01L23/495 ,  H01L29/739 ,  H01L23/00

CPC classification number: H01L24/83 ,  H01L23/49524 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/37 ,  H01L24/40 ,  H01L24/84 ,  H01L25/0655 ,  H01L25/072 ,  H01L2224/27312 ,  H01L2224/2732 ,  H01L2224/27418 ,  H01L2224/291 ,  H01L2224/29294 ,  H01L2224/293 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/37012 ,  H01L2224/37111 ,  H01L2224/37124 ,  H01L2224/37147 ,  H01L2224/37155 ,  H01L2224/3716 ,  H01L2224/40139 ,  H01L2224/40175 ,  H01L2224/40499 ,  H01L2224/45124 ,  H01L2224/73263 ,  H01L2224/83101 ,  H01L2224/83193 ,  H01L2224/83385 ,  H01L2224/83438 ,  H01L2224/83447 ,  H01L2224/8384 ,  H01L2224/84385 ,  H01L2224/84438 ,  H01L2224/84447 ,  H01L2224/8484 ,  H01L2224/92246 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/0103 ,  H01L2924/014 ,  H01L2924/01047 ,  H01L2924/00012 ,  H01L2924/01014

Abstract: A clip for a semiconductor package. Implementations may include: an electrically conductive clip having a first end and a second end and a middle section between the first end and the second end. The first end may be configured to couple to a first die through a bonding material. The second end may be configured to couple to a second die through a bonding material. The middle section may be configured to couple to an emitter structure through a bonding material. The clip may include an integrally formed electrically conductive material and include an M-shape. A middle of the M-shape may be coupled to the emitter structure.

公开(公告)号：US20160276772A1

公开(公告)日：2016-09-22

申请号：US14662591

申请日：2015-03-19

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Chee Hiong CHEW ,  Atapol PRAJUCKAMOL ,  Yusheng LIN

IPC: H01R13/415 ,  H01R43/26 ,  H01R12/58

CPC classification number: H01R43/16 ,  H01R12/585 ,  H01R13/052 ,  H01R13/415 ,  H01R43/26

Abstract: A press-fit pin for a semiconductor package includes a shaft terminating in a head. A pair of arms extends away from a center of the head. Each arm includes a curved shape and the arms together form an s-shape. A length of the s-shape is longer than the shaft diameter. An outer extremity of each arm includes a contact surface configured to electrically couple to and form a friction fit with a pin receiver. In implementations the press-fit pin has only two surfaces configured to contact an inner sidewall of the pin receiver and is configured to contact the inner sidewall at only two locations. The shaft may be a cylinder. The s-shape formed by the pair of arms is visible from a view facing a top of the press-fit pin along a direction parallel with the longest length of the shaft. Versions include a through-hole extending through the head.

Abstract translation: 用于半导体封装的压配销包括终止在头部中的轴。 一对手臂远离头部的中心。 每个臂包括弯曲的形状，并且臂一起形成s形。 s形的长度比轴的直径长。 每个臂的外部末端包括被配置为电耦合到销接收器并与销接收器形成摩擦配合的接触表面。 在实施中，压配合销仅具有两个构造成接触销接收器的内侧壁的表面，并且构造成仅在两个位置处接触内侧壁。 轴可以是圆筒。 由一对臂形成的s形状从与压配合销的顶部相对的视图可以沿着与轴的最长长度平行的方向看到。 版本包括延伸穿过头部的通孔。

公开(公告)号：US20230317579A1

公开(公告)日：2023-10-05

申请号：US18329203

申请日：2023-06-05

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Chee Hiong CHEW ,  Yushuang YAO ,  Atapol PRAJUCKAMOL ,  Chuncao NIU

IPC: H01L23/498 ,  H01L23/538 ,  H01L23/00 ,  H05K1/18 ,  H01L23/40

CPC classification number: H01L23/49811 ,  H01L23/40 ,  H01L23/49838 ,  H01L23/5385 ,  H01L23/562 ,  H05K1/184 ,  H01L2023/4087

Abstract: A semiconductor guide pin is disclosed. Specific implementations may include a heatsink, one or more substrates coupled together, one or more pressfit pins coupled to the one or more substrates, and two or more guide pins coupled to the one or more substrates, where the two or more guide pins may have a height greater than the one or more pressfit pins.

公开(公告)号：US20220246486A1

公开(公告)日：2022-08-04

申请号：US17660319

申请日：2022-04-22

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Yushuang YAO ,  Chee CHEW ,  Atapol PRAJUCKAMOL

IPC: H01L23/053 ,  H01L23/498 ,  H01L25/00 ,  H01L21/52 ,  H01L23/00 ,  H01L25/065 ,  H01L25/07 ,  H01L25/18

Abstract: Implementations of a semiconductor package may include: a substrate, a case coupled to the substrate and a plurality of press-fit pins. The press-fit pins are molded into and fixedly coupled with the case. The pins are also electrically and mechanically coupled to the substrate.

公开(公告)号：US20220199502A1

公开(公告)日：2022-06-23

申请号：US17126433

申请日：2020-12-18

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Atapol PRAJUCKAMOL ,  Chee Hiong CHEW ,  Yusheng LIN

IPC: H01L23/498 ,  H01L25/18 ,  H01L23/538 ,  H01L23/31 ,  H01L21/48

Abstract: Implementations of a semiconductor package may include a first substrate including a first group of leads physically coupled thereto and a second group of leads physically coupled thereto; a second substrate coupled over the first substrate and physically coupled to the first group of leads and the second group of leads; and one or more semiconductor die coupled between the first substrate and the second substrate. The second group of leads may be electrically isolated from the first substrate.

公开(公告)号：US20210219448A1

公开(公告)日：2021-07-15

申请号：US17216069

申请日：2021-03-29

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Atapol PRAJUCKAMOL ,  Chee Hiong CHEW ,  Yushuang YAO

IPC: H05K5/06 ,  H05K7/20

Abstract: A fin frame baseplate is disclosed. Specific implementations include a baseplate configured to be coupled to a substrate, a fin frame including a base portion coupled to the baseplate, and a plurality of fins extending from the base portion, the plurality of fins protruding from the base portion. The fin frame may include a plurality of openings therethrough.

公开(公告)号：US20210193551A1

公开(公告)日：2021-06-24

申请号：US16721375

申请日：2019-12-19

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Atapol PRAJUCKAMOL ,  Chee Hiong CHEW

IPC: H01L23/367 ,  H01L23/31 ,  H01L25/07

Abstract: In a general aspect, a semiconductor device assembly can include a substrate, a semiconductor die disposed on the substrate, a thermally conductive spacer having a first side and a second side, the second side being opposite the first side. The first side of the thermally conductive spacer can include a plurality of steps that are coupled with the substrate. The first side of the thermally conductive spacer can also include a surface that is disposed between the plurality of steps, where the surface can be coupled with the semiconductor die.