公开(公告)号：US20250149419A1

公开(公告)日：2025-05-08

申请号：US19016598

申请日：2025-01-10

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Yushuang YAO ,  Qing YANG ,  Lihu HOU

IPC: H01L23/498 ,  H01L21/48 ,  H01R12/58 ,  H01R43/02

Abstract: A casing for semiconductor packages that includes a plurality of press-fit pins is disclosed. Specific implementations include a shaft including a first end and a second end. The first end may include a head. The press-fit pin may include a bonding portion included at the second end. The bonding portion may include a first section extending substantially perpendicular from a longest length of the shaft. The bonding portion may also include an angled section coupled to a bonding foot. The bonding foot may be configured to be ultrasonically welded to a substrate.

公开(公告)号：US20230027138A1

公开(公告)日：2023-01-26

申请号：US17807749

申请日：2022-06-20

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Yushuang YAO ,  Chee Hiong CHEW ,  Vemmond Jeng Hung NG ,  Chuncao NIU ,  Sravan VANAPARTHY

IPC: H05K7/20 ,  H05K7/14

Abstract: A method includes attaching a power electronic substrate to a bottom of a frame. The frame has a box-like rectangular shape with an open top and an open bottom. The method further includes disposing an external conductive terminal on the frame. The external conductive terminal has at least one terminal stub that extends on to the front surface of the power electronic substrate. The method further includes welding the at least one terminal stub to at least one circuit trace disposed on the front surface of the power electronic substrate.

公开(公告)号：US20200373231A1

公开(公告)日：2020-11-26

申请号：US16502441

申请日：2019-07-03

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Chee Hiong CHEW ,  Yushuang YAO ,  Atapol PRAJUCKAMOL ,  Chuncao NIU

IPC: H01L23/498 ,  H05K1/18 ,  H01L23/40 ,  H01L23/538 ,  H01L23/00

Abstract: A semiconductor guide pin is disclosed. Specific implementations may include a heatsink, one or more substrates coupled together, one or more pressfit pins coupled to the one or more substrates, and two or more guide pins coupled to the one or more substrates, where the two or more guide pins may have a height greater than the one or more pressfit pins.

公开(公告)号：US20200176907A1

公开(公告)日：2020-06-04

申请号：US16783345

申请日：2020-02-06

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Yushuang YAO ,  Chee Hiong CHEW ,  Atapol PRAJUCKAMOL

IPC: H01R13/05 ,  H01R12/57 ,  H01R12/58 ,  H01R43/02 ,  H01R43/16

Abstract: Implementations of pins for semiconductor packages may include: an upper contact portion having a contact surface coupled with a pin receiver; a lower portion having a vertical stop and at least two curved legs; a horizontal base coupled directly to the at least two curved legs and configured to be soldered to a substrate to mechanically and electrically couple the pin to the substrate, the horizontal base having an upper contact surface, and; a gap between a bottom contact surface of the vertical stop and the upper contact surface of the horizontal base.

公开(公告)号：US20180228041A1

公开(公告)日：2018-08-09

申请号：US15945649

申请日：2018-04-04

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Atapol PRAJUCKAMOL ,  Chee Hiong CHEW ,  Yushuang YAO

IPC: H05K5/02 ,  H01L23/40 ,  H01L23/053

CPC classification number: H05K5/0213 ,  H01L23/053 ,  H01L23/40 ,  H01L23/4006 ,  H01L23/4093 ,  H01L2924/0002 ,  H05K5/0221 ,  H01L2924/00

Abstract: In one embodiment, a semiconductor package may be formed having a first side and a second side that is substantially opposite to the first side. An embodiment may include forming an attachment clip extending substantially laterally between the first and second sides wherein the attachment clip is positioned near a distal end of the first and second sides. An embodiment may also include forming the attachment clip to have a flexible main portion that can bend away from a plane of the main portion toward a bottom side of the semiconductor package.

公开(公告)号：US20170117211A1

公开(公告)日：2017-04-27

申请号：US15094022

申请日：2016-04-08

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Chee Hiong CHEW ,  Atapol PRAJUCKAMOL ,  Yushuang YAO

IPC: H01L23/495 ,  H01L29/739 ,  H01L23/00

CPC classification number: H01L24/83 ,  H01L23/49524 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/37 ,  H01L24/40 ,  H01L24/84 ,  H01L25/0655 ,  H01L25/072 ,  H01L2224/27312 ,  H01L2224/2732 ,  H01L2224/27418 ,  H01L2224/291 ,  H01L2224/29294 ,  H01L2224/293 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/37012 ,  H01L2224/37111 ,  H01L2224/37124 ,  H01L2224/37147 ,  H01L2224/37155 ,  H01L2224/3716 ,  H01L2224/40139 ,  H01L2224/40175 ,  H01L2224/40499 ,  H01L2224/45124 ,  H01L2224/73263 ,  H01L2224/83101 ,  H01L2224/83193 ,  H01L2224/83385 ,  H01L2224/83438 ,  H01L2224/83447 ,  H01L2224/8384 ,  H01L2224/84385 ,  H01L2224/84438 ,  H01L2224/84447 ,  H01L2224/8484 ,  H01L2224/92246 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/0103 ,  H01L2924/014 ,  H01L2924/01047 ,  H01L2924/00012 ,  H01L2924/01014

Abstract: A clip for a semiconductor package. Implementations may include: an electrically conductive clip having a first end and a second end and a middle section between the first end and the second end. The first end may be configured to couple to a first die through a bonding material. The second end may be configured to couple to a second die through a bonding material. The middle section may be configured to couple to an emitter structure through a bonding material. The clip may include an integrally formed electrically conductive material and include an M-shape. A middle of the M-shape may be coupled to the emitter structure.

公开(公告)号：US20250054839A1

公开(公告)日：2025-02-13

申请号：US18925813

申请日：2024-10-24

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Yushuang YAO ,  Vemmond Jeng Hung NG

IPC: H01L23/492 ,  H01L21/48

Abstract: Implementations described herein are related to a semiconductor device package having an improved baseplate. In such an improved baseplate, there is a recess cut out of a region of a surface of the baseplate such that the recess has a first sidewall having a first thickness above a recess base and a second sidewall having a second thickness above the recess base. A substrate, e.g., a direct bonded copper (DBC) substrate, may be attached to the baseplate at a recess base using, e.g., a solder layer between the recess base and a surface of the substrate.

公开(公告)号：US20220130740A1

公开(公告)日：2022-04-28

申请号：US16949262

申请日：2020-10-22

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Qing YANG ,  Yong LIU ,  Yushuang YAO

IPC: H01L23/498 ,  H01L25/18 ,  H01L21/48 ,  H01L25/07 ,  H01L23/00 ,  H01L23/32 ,  H01L23/373

Abstract: A power module can include a casing mounted to a baseplate that contains a substrate with circuitry. The circuitry can include pins for coupling signals to/from the circuitry. These pins can extend through a cover portion of the casing so that an electronic substrate, such as a printed circuit board (PCB) can be press-fit onto the pins. When press-fit, the electronic substrate is supported and positioned by support pillars that extend from the base plate to above the cover portion of the casing. If the pins and the support pillars have different coefficients of thermal expansion, damage to connection points between the pins and the circuitry may occur. Here, a power module is disclosed that has thermally matched pins and support pillars so that when the system is thermally cycled over a range of temperatures, the connection points are not damaged by forces induced by thermal expansion.

公开(公告)号：US20210265248A1

公开(公告)日：2021-08-26

申请号：US16796260

申请日：2020-02-20

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Yushuang YAO ,  Qing YANG ,  Lihu HOU

IPC: H01L23/498 ,  H01R12/58 ,  H01L21/48 ,  H01R43/02

Abstract: A casing for semiconductor packages that includes a plurality of press-fit pins is disclosed. Specific implementations include a shaft including a first end and a second end. The first end may include a head. The press-fit pin may include a bonding portion included at the second end. The bonding portion may include a first section extending substantially perpendicular from a longest length of the shaft. The bonding portion may also include an angled section coupled to a bonding foot. The bonding foot may be configured to be ultrasonically welded to a substrate.

公开(公告)号：US20210090975A1

公开(公告)日：2021-03-25

申请号：US17247200

申请日：2020-12-03

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Atapol PRAJUCKAMOL ,  Chee Hiong CHEW ,  Yushuang YAO

IPC: H01L23/495 ,  H01L23/00

Abstract: A semiconductor package assembly having a connecting clip disposed on both a first material stack and a second material stack having different thicknesses and disposed on a conducting substrate. This connecting clip has a first portion disposed on to the first material stack and second portion disposed on the second material stack, such that the surfaces of the first portion and second portion opposite the conducting substrate are at the same perpendicular distance from the conducting substrate. For example, in some implementations, when the thickness of the second material stack is smaller than the thickness of the first material stack, the second portion of the connecting clip may include a vertical support disposed on the second material stack to equalize the heights of the surfaces of the first portion and second portion of the connecting clip.