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    Light emitting device
    12.
    发明授权
    Light emitting device 有权

    公开(公告)号：US11804566B2

    公开(公告)日：2023-10-31

    申请号：US17960097

    申请日：2022-10-04

    Applicant: Seoul Viosys Co., Ltd.

    Inventor： Jong Min Jang ,  Chang Yeon Kim ,  Myoung Hak Yang

    IPC: H01L33/00 ,  H01L27/15 ,  H01L33/38 ,  H01L33/14

    CPC classification number: H01L33/0016 ,  H01L27/156 ,  H01L33/14 ,  H01L33/387

    Abstract: A light emitting device includes a first light emitting part including a first n-type semiconductor layer, and a first mesa structure including a first active layer, a first p-type semiconductor layer, and a first transparent electrode vertically stacked one over another and exposing a portion of a first surface of the first n-type semiconductor layer, a second light emitting part spaced apart from the first mesa structure, and including a second n-type semiconductor layer, a second active layer, a second p-type semiconductor layer, and a second transparent electrode and exposing a portion of a first surface of the second n-type semiconductor layer, and a first bonding layer on which the first and second light emitting parts are disposed and electrically coupling the first n-type semiconductor layer and the second n-type semiconductor layer to each other.

    Light emitting diode
    13.
    发明授权
    Light emitting diode 有权

    公开(公告)号：US10256387B2

    公开(公告)日：2019-04-09

    申请号：US15663219

    申请日：2017-07-28

    Applicant: Seoul Viosys Co., Ltd.

    Inventor： Se Hee Oh ,  Mae Yi Kim ,  Seom Geun Lee ,  Myoung Hak Yang ,  Yeo Jin Yoon

    IPC: H01L27/15 ,  H01L33/08 ,  H01L33/14 ,  H01L33/38 ,  H01L33/42 ,  H01L33/62

    Abstract: A light emitting diode including a first light emitting cell and a second light emitting cell separated from each other on a substrate, a first transparent electrode layer electrically connected to the first light emitting cell, an interconnection electrically connecting the first light emitting cell to the second light emitting cell, and a first insulation layer. The first transparent electrode layer is disposed on an upper surface of the first light emitting cell and partially covers a side surface of the first light emitting cell. The first insulation layer separates the first transparent electrode layer from the side surface of the first light emitting cell, and includes an opening to expose a lower semiconductor layer of the first light emitting cell.

    Light emitting diode and method of fabricating the same
    15.
    发明授权
    Light emitting diode and method of fabricating the same 有权
    发光二极管及其制造方法

    公开(公告)号：US09356212B2

    公开(公告)日：2016-05-31

    申请号：US14459887

    申请日：2014-08-14

    Applicant: SEOUL VIOSYS CO., LTD.

    Inventor： Se Hee Oh ,  Mae Yi Kim ,  Seom Geun Lee ,  Myoung Hak Yang ,  Yeo Jin Yoon

    IPC: H01L33/62 ,  H01L33/38 ,  H01L33/14 ,  H01L27/15

    CPC classification number: H01L33/62 ,  H01L27/15 ,  H01L27/156 ,  H01L33/08 ,  H01L33/14 ,  H01L33/385 ,  H01L33/387 ,  H01L33/42 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A light emitting diode includes light emitting cells disposed on a substrate and interconnections connecting the light emitting cells to each other. Each of the light emitting cells includes a first semiconductor layer, a second semiconductor layer, an active layer disposed between the first semiconductor layer and the second semiconductor layer, and a transparent electrode layer disposed on the second semiconductor layer, wherein the first and second semiconductor layers have different conductivity types. The interconnections include a common cathode commonly connecting first and second light emitting cells of the light emitting cells, the first and second light emitting cells share the first semiconductor layer, the transparent electrode layer is continuously disposed between the first and second light emitting cells, and the common cathode is electrically connected to the first and second light emitting cells through the transparent electrode layer.

    Abstract translation: 发光二极管包括设置在基板上的发光单元和将发光单元彼此连接的互连。 每个发光单元包括第一半导体层，第二半导体层，设置在第一半导体层和第二半导体层之间的有源层，以及设置在第二半导体层上的透明电极层，其中第一和第二半导体 层具有不同的导电类型。 互连包括通常连接发光单元的第一和第二发光单元的公共阴极，第一和第二发光单元共享第一半导体层，透明电极层连续地设置在第一和第二发光单元之间，以及 公共阴极通过透明电极层电连接到第一和第二发光单元。

    LED CHIP PACKAGE AND MANUFACTURING METHOD OF THE SAME
    16.
    发明公开
    LED CHIP PACKAGE AND MANUFACTURING METHOD OF THE SAME 审中-公开

    公开(公告)号：US20230387178A1

    公开(公告)日：2023-11-30

    申请号：US18232371

    申请日：2023-08-10

    Applicant: SEOUL VIOSYS CO., LTD.

    Inventor： Jong Min JANG ,  Chang Yeon Kim ,  Myoung Hak Yang

    IPC: H01L27/15 ,  H01L33/56 ,  H01L33/38 ,  H01L33/48 ,  H01L33/44

    CPC classification number: H01L27/15 ,  H01L33/56 ,  H01L33/38 ,  H01L33/486 ,  H01L33/44

    Abstract: A light emitting module including a substrate, a first light emitter, a second light emitter, and a third light emitter, in which at least two of the first, second, and third emitters are disposed one over another, connection electrodes electrically connected to at least one of the first, second, and third light emitters, a passivation layer covering at least one side surface of the connection electrodes and exposing at least a region of the first light emitter, and a first electrode electrically connected to at least one of the connection electrodes, in which the first electrode is electrically connected to at least one of the first, second, and third electrodes through the at least one of the connection electrodes, and at least one of connection electrodes overlaps side surfaces of two or more of the first, second, and third light emitters in a plan view.

    LED chip package and manufacturing method of the same
    17.
    发明授权
    LED chip package and manufacturing method of the same 有权

    公开(公告)号：US11756980B2

    公开(公告)日：2023-09-12

    申请号：US16858674

    申请日：2020-04-26

    Applicant: SEOUL VIOSYS CO., LTD.

    Inventor： Jong Min Jang ,  Chang Yeon Kim ,  Myoung Hak Yang

    IPC: H01L27/15 ,  H01L33/44 ,  H01L33/56 ,  H01L33/48 ,  H01L33/38

    CPC classification number: H01L27/15 ,  H01L33/38 ,  H01L33/44 ,  H01L33/486 ,  H01L33/56

    Abstract: A light emitting package includes a first LED sub-unit having first and second opposed surfaces, a second LED sub-unit disposed on the second surface of the first LED sub-unit, a third LED sub-unit disposed on the second LED sub-unit, a plurality of connection electrodes having side surfaces and electrically connected to at least one of the LED sub-units, the connection electrodes covering a side surface of at least one of the LED sub-units, a first passivation layer surrounding at least the sides surfaces of the connection electrodes, the first passivation layer exposing at least a portion of the first surface of the first LED sub-unit, a substrate having first and second opposed surfaces, with the first surface of the substrate facing the LED sub-units, and a first electrode disposed on the first surface of the substrate and connected to at least one of the connection electrodes.

    LED chip and manufacturing method of the same
    18.
    发明授权
    LED chip and manufacturing method of the same 有权

    公开(公告)号：US11587914B2

    公开(公告)日：2023-02-21

    申请号：US16852522

    申请日：2020-04-19

    Applicant: SEOUL VIOSYS CO., LTD.

    Inventor： Jong Min Jang ,  Chang Yeon Kim ,  Myoung Hak Yang

    IPC: H01L25/075 ,  H01L33/62 ,  H01L27/15 ,  H01L23/31

    Abstract: A light emitting chip including a first LED sub-unit, a second LED sub-unit disposed on the first LED sub-unit, a third LED sub-unit disposed on the second LED sub-unit, a passivation layer disposed on the third LED sub-unit, and a first connection electrode electrically connected to at least one of the first, second, and third LED sub-units, in which the first connection electrode and the third LED sub-unit form a first angle defined between an upper surface of the third LED sub-unit and an inner surface of the first connection electrode that is less than about 80°.

    Light emitting device
    19.
    发明授权
    Light emitting device 有权

    公开(公告)号：US11469342B2

    公开(公告)日：2022-10-11

    申请号：US17110368

    申请日：2020-12-03

    Applicant: Seoul Viosys Co., Ltd.

    Inventor： Jong Min Jang ,  Chang Yeon Kim ,  Myoung Hak Yang

    IPC: H01L33/00 ,  H01L27/15 ,  H01L33/38 ,  H01L33/14

    Abstract: A method of manufacturing a light emitting device including forming first light emitting parts on a first substrate, the first light emitting part including a first n-type semiconductor layer and a first mesa structure including a first active layer, a first p-type semiconductor layer, and a first electrode and exposing a portion of the first n-type semiconductor layer, forming second light emitting parts on a second substrate, the second light emitting part including a second n-type semiconductor layer and a second mesa structure including a second active layer, a second p-type semiconductor layer, and a second electrode and exposing a portion of the second n-type semiconductor layer, attaching a first removable carrier onto the second light emitting parts and enclosing the second light emitting parts, removing the second substrate from the second light emitting parts, and bonding the second light emitting parts to the first light emitting parts.

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