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133 条记录 (耗时 0.048 秒)

    Simultaneous testing of semiconductor components on a wafer
    12.
    发明授权
    Simultaneous testing of semiconductor components on a wafer 有权
    同时测试晶圆上的半导体元件

    公开(公告)号：US09002673B2

    公开(公告)日：2015-04-07

    申请号：US13025657

    申请日：2011-02-11

    申请人： Arya Reza Behzad ,  Ahmadreza Rofougaran ,  Sam Ziqun Zhao ,  Jesus Alfonso Castaneda ,  Michael Boers

    发明人： Arya Reza Behzad ,  Ahmadreza Rofougaran ,  Sam Ziqun Zhao ,  Jesus Alfonso Castaneda ,  Michael Boers

    IPC分类号： G01R31/14 ,  G01R31/28 ,  G01R31/302 ,  G01R31/311

    CPC分类号： G01R31/2834 ,  G01R31/3025 ,  G01R31/311

    摘要： Methods and apparatus are disclosed to simultaneously, wirelessly test semiconductor components formed on a semiconductor wafer. The semiconductor components transmit respective outcomes of a self-contained testing operation to wireless automatic test equipment via a common communication channel. Multiple receiving antennas observe the outcomes from multiple directions in three dimensional space. The wireless automatic test equipment determines whether one or more of the semiconductor components operate as expected and, optionally, may use properties of the three dimensional space to determine a location of one or more of the semiconductor components. The wireless testing equipment may additionally determine performance of the semiconductor components by detecting infrared energy emitted, transmitted, and/or reflected by the semiconductor wafer before, during, and/or after a self-contained testing operation.

    摘要翻译： 公开了同时无线地测试形成在半导体晶片上的半导体元件的方法和装置。 半导体部件通过公共通信信道将各自的测试结果传送到无线自动测试设备。 多个接收天线在三维空间中观察多个方向的结果。 无线自动测试设备确定一个或多个半导体组件是否按预期运行，并且可选地，可以使用三维空间的属性来确定一个或多个半导体组件的位置。 无线测试设备还可以通过检测在独立测试操作之前，期间和/或之后由半导体晶片发射，传输和/或反射的红外能量来确定半导体组件的性能。

    Simultaneously tagging of semiconductor components on a wafer
    14.
    发明授权
    Simultaneously tagging of semiconductor components on a wafer 有权
    同时在晶片上标记半导体元件

    公开(公告)号：US08866502B2

    公开(公告)日：2014-10-21

    申请号：US13029653

    申请日：2011-02-17

    申请人： Arya Reza Behzad ,  Ahmadreza Rofougaran ,  Sam Ziqun Zhao ,  Jesus Alfonso Castaneda ,  Michael Boers

    发明人： Arya Reza Behzad ,  Ahmadreza Rofougaran ,  Sam Ziqun Zhao ,  Jesus Alfonso Castaneda ,  Michael Boers

    IPC分类号： G01R31/36 ,  G01R31/319 ,  G01R31/302 ,  G01R31/311 ,  G01R31/28

    CPC分类号： G01R31/319 ,  G01R31/2834 ,  G01R31/3025 ,  G01R31/311 ,  H01L23/544 ,  H01L2223/54433 ,  H01L2924/0002 ,  Y10T29/49121 ,  H01L2924/00

    摘要： Methods and apparatus are disclosed to simultaneously, wirelessly test semiconductor components formed on a semiconductor wafer. The semiconductor components transmit respective outcomes of a self-contained testing operation to wireless automatic test equipment via a common communication channel. Multiple receiving antennas observe the outcomes from multiple directions in three dimensional space. The wireless automatic test equipment determines whether one or more of the semiconductor components operate as expected and, optionally, may use properties of the three dimensional space to determine a location of one or more of the semiconductor components. The wireless testing equipment may additionally determine performance of the semiconductor components by detecting infrared energy emitted, transmitted, and/or reflected by the semiconductor wafer before, during, and/or after a self-contained testing operation.

    摘要翻译： 公开了同时无线地测试形成在半导体晶片上的半导体元件的方法和装置。 半导体部件通过公共通信信道将各自的测试结果传送到无线自动测试设备。 多个接收天线在三维空间中观察多个方向的结果。 无线自动测试设备确定一个或多个半导体组件是否按预期运行，并且可选地，可以使用三维空间的属性来确定一个或多个半导体组件的位置。 无线测试设备还可以通过检测在独立测试操作之前，期间和/或之后由半导体晶片发射，传输和/或反射的红外能量来确定半导体组件的性能。

    Passive probing of various locations in a wireless enabled integrated circuit (IC)
    17.
    发明授权
    Passive probing of various locations in a wireless enabled integrated circuit (IC) 有权
    无线使能集成电路（IC）中的各种位置的被动探测

    公开(公告)号：US09075105B2

    公开(公告)日：2015-07-07

    申请号：US13248779

    申请日：2011-09-29

    申请人： Jesus Alfonso Castaneda ,  Arya Reza Behzad ,  Ahmadreza Rofougaran ,  Sam Ziqun Zhao ,  Michael Boers

    发明人： Jesus Alfonso Castaneda ,  Arya Reza Behzad ,  Ahmadreza Rofougaran ,  Sam Ziqun Zhao ,  Michael Boers

    IPC分类号： G01R31/26 ,  G01R31/303 ,  G01R31/302 ,  G01R31/28

    CPC分类号： G01R31/2834 ,  G01R31/2822 ,  G01R31/2831 ,  G01R31/3025 ,  G01R31/303 ,  H01L2224/16225 ,  H01L2924/15311

    摘要： Methods and apparatus are disclosed for wirelessly communicating among integrated circuits and/or functional modules within the integrated circuits. A semiconductor device fabrication operation uses a predetermined sequence of photographic and/or chemical processing steps to form one or more functional modules onto a semiconductor substrate. The functional modules are coupled to an integrated waveguide that is formed onto the semiconductor substrate and/or attached thereto to form an integrated circuit. The functional modules communicate with each other as well as to other integrated circuits using a multiple access transmission scheme via the integrated waveguide. One or more integrated circuits may be coupled to an integrated circuit carrier to form Multichip Module. The Multichip Module may be coupled to a semiconductor package to form a packaged integrated circuit.

    摘要翻译： 公开了用于在集成电路内的集成电路和/或功能模块之间进行无线通信的方法和装置。 半导体器件制造操作使用预定的照相和/或化学处理步骤顺序在半导体衬底上形成一个或多个功能模块。 功能模块耦合到形成在半导体衬底上和/或连接到其上以形成集成电路的集成波导。 功能模块通过集成波导使用多址传输方案彼此通信以及其他集成电路。 一个或多个集成电路可以耦合到集成电路载体以形成多芯片模块。 多芯片模块可以耦合到半导体封装以形成封装的集成电路。

    SIGNAL DISTRIBUTION AND RADIATION IN A WIRELESS ENABLED INTEGRATED CIRCUIT (IC)
    19.
    发明申请
    SIGNAL DISTRIBUTION AND RADIATION IN A WIRELESS ENABLED INTEGRATED CIRCUIT (IC) 审中-公开
    无线使能集成电路（IC）中的信号分配和辐射

    公开(公告)号：US20130082767A1

    公开(公告)日：2013-04-04

    申请号：US13248466

    申请日：2011-09-29

    申请人： Michael Boers ,  Arya Reza Behzad ,  Ahmadreza Rofougaran ,  Sam Ziqun Zhao ,  Jesus Alfonso Castaneda

    发明人： Michael Boers ,  Arya Reza Behzad ,  Ahmadreza Rofougaran ,  Sam Ziqun Zhao ,  Jesus Alfonso Castaneda

    IPC分类号： H01L27/00

    CPC分类号： H01P3/12 ,  H01L23/5222 ,  H01L23/66 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/0657 ,  H01L2223/6627 ,  H01L2224/16225 ,  H01L2225/06517 ,  H01L2225/06531 ,  H01L2225/06572 ,  H01L2924/1461 ,  H01L2924/00

    摘要： Methods and apparatus are disclosed for wirelessly communicating among integrated circuits and/or functional modules within the integrated circuits. A semiconductor device fabrication operation uses a predetermined sequence of photographic and/or chemical processing steps to form one or more functional modules onto a semiconductor substrate. The functional modules are coupled to an integrated waveguide that is formed onto the semiconductor substrate and/or attached thereto to form an integrated circuit. The functional modules communicate with each other as well as to other integrated circuits using a multiple access transmission scheme via the integrated waveguide. One or more integrated circuits may be coupled to an integrated circuit carrier to form Multichip Module. The Multichip Module may be coupled to a semiconductor package to form a packaged integrated circuit.

    摘要翻译： 公开了用于在集成电路内的集成电路和/或功能模块之间进行无线通信的方法和装置。 半导体器件制造操作使用预定的照相和/或化学处理步骤顺序在半导体衬底上形成一个或多个功能模块。 功能模块耦合到形成在半导体衬底上和/或连接到其上以形成集成电路的集成波导。 功能模块通过集成波导使用多址传输方案彼此通信以及其他集成电路。 一个或多个集成电路可以耦合到集成电路载体以形成多芯片模块。 多芯片模块可以耦合到半导体封装以形成封装的集成电路。

    Passive Probing of Various Locations in a Wireless Enabled Integrated Circuit (IC)
    20.
    发明申请
    Passive Probing of Various Locations in a Wireless Enabled Integrated Circuit (IC) 有权
    无线使能集成电路（IC）中各种位置的被动探测

    公开(公告)号：US20130082730A1

    公开(公告)日：2013-04-04

    申请号：US13248779

    申请日：2011-09-29

    申请人： Jesus Alfonso Castaneda ,  Arya Reza Behzad ,  Ahmadreza Rofougaran ,  Sam Ziqun Zhao ,  Michael Boers

    发明人： Jesus Alfonso Castaneda ,  Arya Reza Behzad ,  Ahmadreza Rofougaran ,  Sam Ziqun Zhao ,  Michael Boers

    IPC分类号： G01R31/26

    CPC分类号： G01R31/2834 ,  G01R31/2822 ,  G01R31/2831 ,  G01R31/3025 ,  G01R31/303 ,  H01L2224/16225 ,  H01L2924/15311

    摘要： Methods and apparatus are disclosed for wirelessly communicating among integrated circuits and/or functional modules within the integrated circuits. A semiconductor device fabrication operation uses a predetermined sequence of photographic and/or chemical processing steps to form one or more functional modules onto a semiconductor substrate. The functional modules are coupled to an integrated waveguide that is formed onto the semiconductor substrate and/or attached thereto to form an integrated circuit. The functional modules communicate with each other as well as to other integrated circuits using a multiple access transmission scheme via the integrated waveguide. One or more integrated circuits may be coupled to an integrated circuit carrier to form Multichip Module. The Multichip Module may be coupled to a semiconductor package to form a packaged integrated circuit.

    摘要翻译： 公开了用于在集成电路内的集成电路和/或功能模块之间进行无线通信的方法和装置。 半导体器件制造操作使用预定的照相和/或化学处理步骤顺序在半导体衬底上形成一个或多个功能模块。 功能模块耦合到形成在半导体衬底上和/或连接到其上以形成集成电路的集成波导。 功能模块通过集成波导使用多址传输方案彼此通信以及其他集成电路。 一个或多个集成电路可以耦合到集成电路载体以形成多芯片模块。 多芯片模块可以耦合到半导体封装以形成封装的集成电路。