公开(公告)号：US20150057393A1

公开(公告)日：2015-02-26

申请号：US14095864

申请日：2013-12-03

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jin Seok Moon ,  Hyun Jun Lee ,  Seong Hyun Yoo ,  Jin Young Kim ,  Geum Hee Yun

IPC: H05K1/03 ,  H05K3/00

CPC classification number: H05K1/0373 ,  H05K1/0353 ,  H05K3/4602 ,  H05K3/4676 ,  H05K2201/0141 ,  H05K2201/0191 ,  H05K2201/0209 ,  H05K2201/09627

Abstract: Disclosed herein are an insulating resin composition for a printed circuit board and products manufactured by using the same, and more particularly, an insulating resin composition for a printed circuit board including a 4-functional naphthalene-based epoxy resin and having improved coefficient of thermal expansion and glass transition temperature properties, and a prepreg and a printed circuit board as products manufactured by using the same.

Abstract translation: 本发明公开了一种用于印刷电路板的绝缘树脂组合物和使用该绝缘树脂组合物的产品，更具体地说，涉及一种用于印刷电路板的绝缘树脂组合物，该印刷电路板包括4-官能的萘基环氧树脂并具有改善的热膨胀系数 和玻璃化转变温度性质，以及作为通过使用它们制造的产品的预浸料和印刷电路板。

公开(公告)号：US20140063427A1

公开(公告)日：2014-03-06

申请号：US13683037

申请日：2012-11-21

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jeong Kyu LEE ,  Seong Hyun Yoo ,  Hyun Jun Lee ,  Jin Seok Moon ,  Keun Yong Lee

IPC: C08K3/00 ,  C08L63/00 ,  G02F1/1337

CPC classification number: C08K3/10 ,  C08G59/3227 ,  C08K3/20 ,  H05K1/0203 ,  H05K1/0366 ,  H05K1/0373 ,  H05K2201/0209 ,  C08L63/00

Abstract: There is provided a resin composition for a thermal radiation board including: 20 wt % to 50 wt % of a liquid crystal oligomer represented by particular Chemical Formulas; 10 wt % to 40 wt % of an epoxy resin; and 10 wt % to 40 wt % of an inorganic filter.

Abstract translation: 提供了一种用于热辐射板的树脂组合物，其包括：20重量％至50重量％的由特定化学式表示的液晶低聚物; 10重量％〜40重量％的环氧树脂; 和10重量％〜40重量％的无机过滤器。

公开(公告)号：US20150104630A1

公开(公告)日：2015-04-16

申请号：US14149567

申请日：2014-01-07

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Jin Seok Moon ,  Sa Yong Lee ,  Keun Yong Lee ,  Seong Hyun Yoo

IPC: H05K1/03 ,  B32B38/10 ,  B32B38/08 ,  H05K3/00 ,  B32B37/24

CPC classification number: H05K1/0366 ,  B32B37/26 ,  B32B38/08 ,  B32B2037/243 ,  B32B2037/268 ,  B32B2309/02 ,  B32B2309/04 ,  B32B2309/12 ,  B32B2457/08 ,  H05K3/007 ,  H05K3/4602 ,  H05K2201/0209 ,  H05K2201/029 ,  H05K2203/0191

Abstract: Disclosed herein are a prepreg for a printed circuit board, a manufacturing method thereof, and a printed circuit board including the same. More particularly, the manufacturing method of a prepreg for a printed circuit board includes: coating an insulating composition on each of the two carrier films to form an insulating layer and drying the coated insulating composition to form first and second carrier substrates; disposing glass fiber between the insulating layers of the first and second carrier substrates and bonding the first and second carrier substrates to each other to form a laminated substrate; pressing the laminated substrate; and removing the carrier film from the laminated substrate subjected to the pressing.The prepreg may be manufactured so as to have the desired thickness or maintain a uniform thickness, such that thickness quality may be stabilized, and a coefficient of thermal expansion property may be improved.

Abstract translation: 本发明公开了一种用于印刷电路板的预浸料，其制造方法和包括该预浸料的印刷电路板。 更具体地，印刷电路板用预浸料的制造方法包括：在两个载体膜的每一个上涂覆绝缘组合物以形成绝缘层，并干燥涂覆的绝缘组合物以形成第一和第二载体基板; 在第一和第二载体基板的绝缘层之间布置玻璃纤维，并将第一和第二载体基板彼此接合以形成层压基板; 按压层压基板; 并从经受压制的叠层基板上除去载体膜。 可以制造预浸料以具有期望的厚度或保持均匀的厚度，使得厚度质量可以稳定，并且可以提高热膨胀性能。

公开(公告)号：US20140367147A1

公开(公告)日：2014-12-18

申请号：US14172242

申请日：2014-02-04

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Jin Seok Moon ,  Hyun Jun Lee ,  Seong Hyun Yoo ,  Jin Young Klm ,  Geum Hee Yun

IPC: H05K1/03 ,  H05K1/02

CPC classification number: H05K1/0373 ,  H05K1/0353 ,  H05K3/4602 ,  H05K3/4676 ,  H05K2201/0141 ,  H05K2201/0209

Abstract: Disclosed herein are an insulating resin composition for a printed circuit board, an insulating film, a prepreg, and a printed circuit board. More specifically, disclosed herein are an insulating resin composition for a printed circuit board including a maleimide resin having three or more maleimide groups, and the like so that a glass transition temperature and a mechanical strength are improved, an insulating film and a prepreg prepared using the insulating resin composition, and a printed circuit board including the insulating film or the prepreg.

Abstract translation: 本文公开了用于印刷电路板，绝缘膜，预浸料和印刷电路板的绝缘树脂组合物。 更具体地，本文公开了一种用于印刷电路板的绝缘树脂组合物，其包括具有三个或更多个马来酰亚胺基团的马来酰亚胺树脂等，使得玻璃化转变温度和机械强度得到改善，绝缘膜和使用 绝缘树脂组合物和包括绝缘膜或预浸料的印刷电路板。

公开(公告)号：US20140127483A1

公开(公告)日：2014-05-08

申请号：US13761613

申请日：2013-02-07

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jin Seok Moon ,  Sa Yong Lee ,  Seong Hyun Yoo

IPC: H05K3/00 ,  B32B3/10 ,  B32B17/04 ,  H05K1/03 ,  B32B7/02 ,  B32B15/08

CPC classification number: B32B7/02 ,  B32B15/20 ,  B32B17/04 ,  B32B2255/06 ,  B32B2255/26 ,  B32B2457/08 ,  H05K1/0366 ,  H05K3/022 ,  H05K2201/029 ,  H05K2201/0358 ,  Y10T29/49117 ,  Y10T428/24917 ,  Y10T428/2495

Abstract: Disclosed herein are a method for manufacturing a copper-clad laminate (CCL) for a printed circuit board, a CCL manufactured by the method, and a printed circuit board having the CCL applied thereto, the method including: forming a first resin coated copper foil (first RCC foil) and a second resin coated copper foil (second RCC foil) by coating an insulating composition on one surface of each of two copper foils to form insulating layers, respectively, followed by drying of the first and second RCC foils; forming a copper-clad laminate (CCL) by laminating and pressing the first RCC foil and the second RCC foil while the insulating layers of the first and second RCC foils face each other and a glass fiber is placed therebetween; and hardening the copper-clad laminate.

Abstract translation: 本发明公开了一种制造用于印刷电路板的覆铜层压板（CCL），通过该方法制造的CCL以及具有CCL的印刷电路板的方法，该方法包括：将第一树脂涂覆的铜箔 （第一RCC箔）和第二树脂涂覆铜箔（第二RCC箔），通过在两个铜箔的每一个的一个表面上涂覆绝缘组合物以分别形成绝缘层，然后干燥第一和第二RCC箔; 通过层压和压制第一RCC箔和第二RCC箔，同时第一和第二RCC箔的绝缘层彼此面对并且在其间放置玻璃纤维来形成覆铜层压板（CCL）; 并硬化覆铜层压板。

公开(公告)号：US20140077129A1

公开(公告)日：2014-03-20

申请号：US13780988

申请日：2013-02-28

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jin Seok Moon ,  Seong Hyun Yoo ,  Keun Yong Lee ,  Hyun Jun Lee

IPC: H01B3/40

CPC classification number: H01B3/40 ,  C08G59/621 ,  Y10T428/31511

Abstract: Disclosed herein are an epoxy resin composition for a printed circuit board, an insulating film, a prepreg, and a multilayer printed circuit board, the epoxy resin composition for a printed circuit board including a liquid crystal oligomer, an epoxy resin, an amino triazine novolac hardener, and an inorganic filler; the insulating film and the prepreg each being manufactured by using the resin composition; and the multilayer printed circuit board including the insulating film or the prepreg.

Abstract translation: 本发明公开了一种用于印刷电路板，绝缘膜，预浸料和多层印刷电路板的环氧树脂组合物，用于印刷电路板的环氧树脂组合物包括液晶低聚物，环氧树脂，氨基三嗪酚醛清漆 硬化剂和无机填料; 绝缘膜和预浸料均使用树脂组合物制造; 以及包括绝缘膜或预浸料的多层印刷电路板。

公开(公告)号：US20140034367A1

公开(公告)日：2014-02-06

申请号：US13893223

申请日：2013-05-13

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jeong Kyu Lee ,  Seong Hyun Yoo ,  Hyun Jun Lee ,  Jin Seok Moon ,  Keun Yong Lee

IPC: H05K1/03

CPC classification number: H05K1/0373 ,  C08G59/3218 ,  C08G63/685 ,  C08G63/692 ,  C08L63/00 ,  C08L67/03 ,  H05K1/0353 ,  H05K3/4602 ,  H05K3/4655 ,  H05K2201/0129 ,  H05K2201/0209 ,  H05K2201/029 ,  H05K2201/0358

Abstract: Disclosed herein are an epoxy resin composition, an insulating film using the same, and a multilayer printed circuit board; more particularly, an epoxy resin composition including a liquid crystal capable of lowering the coefficient of thermal expansion, improving chemical resistance, and increasing the glass transition temperature, an insulating film or prepreg manufactured by using the epoxy resin composition, and a multilayer printed circuit board including the insulating film or prepreg.

Abstract translation: 本文公开了环氧树脂组合物，使用该环氧树脂组合物的绝缘膜和多层印刷电路板; 更具体地说，涉及包含能够降低热膨胀系数，提高耐化学性，提高玻璃化转变温度的液晶的环氧树脂组合物，使用该环氧树脂组合物制造的绝缘膜或预浸料，以及多层印刷电路板 包括绝缘膜或预浸料。

公开(公告)号：US20130146344A1

公开(公告)日：2013-06-13

申请号：US13664901

申请日：2012-10-31

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jeong Kyu LEE ,  Jin Seok Moon ,  Keun Yong Lee

IPC: C08L67/00 ,  C08L65/00 ,  H05K1/02 ,  C08L63/00

CPC classification number: C08L67/00 ,  C08G59/08 ,  C08G59/3227 ,  C08G59/621 ,  C08G63/6856 ,  C08G63/6926 ,  C08G69/42 ,  C08G2261/3424 ,  C08J5/24 ,  C08J2363/00 ,  C08L63/00 ,  C08L65/00 ,  C08L77/10 ,  C08L77/12 ,  H05K1/0213 ,  H05K1/0346 ,  H05K1/0353 ,  H05K2201/0141 ,  H05K2201/068 ,  Y10T428/31522 ,  C08L79/04

Abstract: Disclosed herein is an insulating resin composition for a printed circuit board, including 40 to 70 wt % of a liquid crystal oligomer shown in formula 1, 10 to 30 wt % of an epoxy resin, 10 to 30 wt % of a cyanate-based resin, and 0.1 to 0.5 wt % of a curing catalyst, and a printed circuit board including the same.According to an exemplary embodiment of the present invention, the printed circuit board has electric, thermal, and mechanical stabilities even though the printed circuit board is reduced in weight, thickness, and size. Further, a stable driving property is ensured, dielectricity is low, and attachment strength, chemical resistance, and warpage property are excellent during a board process in the related art.

Abstract translation: 本发明公开了一种用于印刷电路板的绝缘树脂组合物，其包含40至70重量％的式1所示的液晶低聚物，10至30重量％的环氧树脂，10至30重量％的氰酸酯基树脂 ，和0.1〜0.5重量％的固化催化剂，以及包含该固化催化剂的印刷电路板。 根据本发明的示例性实施例，即使印刷电路板的重量，厚度和尺寸减小，印刷电路板也具有电，热和机械稳定性。 此外，相关技术中的板工艺中，确保了稳定的驱动性能，电介质性低，附着强度，耐化学性和翘曲性优异。