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    Graphene transparent electrode and method for manufacturing the same
    11.
    发明授权
    Graphene transparent electrode and method for manufacturing the same 有权
    石墨烯透明电极及其制造方法

    公开(公告)号：US09105378B2

    公开(公告)日：2015-08-11

    申请号：US13656854

    申请日：2012-10-22

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Woon Chun Kim ,  Kang Heon Hur

    IPC: H01L21/30 ,  H01B13/34 ,  H01B1/24 ,  H01B1/04 ,  H01L31/0224 ,  H01L31/18 ,  B82Y40/00 ,  H01M4/1393 ,  H01M4/96 ,  B82Y30/00

    CPC classification number: H01B13/34 ,  B82Y30/00 ,  B82Y40/00 ,  H01B1/04 ,  H01B1/24 ,  H01L31/022466 ,  H01L31/1884 ,  H01M4/1393 ,  H01M4/96 ,  Y02E10/50

    Abstract: Disclosed herein are a method for manufacturing a graphene transparent electrode and a graphene transparent electrode manufactured by the method. The method includes: providing a graphene oxide solution: forming a metal thin film on a glass substrate; coating the graphene oxide solution on the metal thin film, followed by drying; primarily reducing the thus obtained graphene oxide by using a reducing agent, to obtain reduced graphene oxide; secondarily reducing the reduced graphene oxide by heat treatment under the inert atmosphere, to form a reduced layer; compressing a transparent film on the reduced layer; and etching the metal film by an etching solution. The method enables a graphene transparent electrode having economical feasibility and excellent electric conductivity to be manufactured.

    Abstract translation: 本文公开了通过该方法制造石墨烯透明电极和石墨烯透明电极的方法。 该方法包括：提供石墨烯氧化物溶液：在玻璃基板上形成金属薄膜; 将氧化石墨烯溶液涂覆在金属薄膜上，然后干燥; 通过使用还原剂主要还原由此获得的氧化石墨烯，以获得还原的氧化石墨烯; 通过在惰性气氛下热处理二次还原还原的石墨烯，形成还原层; 压缩还原层上的透明膜; 并通过蚀刻溶液蚀刻金属膜。 该方法能够制造具有经济可行性和优异的导电性的石墨烯透明电极。

    TOUCH SENSOR
    12.
    发明申请
    TOUCH SENSOR 审中-公开
    触摸传感器

    公开(公告)号：US20150015802A1

    公开(公告)日：2015-01-15

    申请号：US14062243

    申请日：2013-10-24

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Kee Su Jeon ,  Kang Heon Hur ,  Man Sub Shin ,  Jang Ho Park ,  Beom Seok Oh

    IPC: G06F3/041 ,  H05K3/10

    CPC classification number: H05K3/10 ,  G06F3/044 ,  G06F2203/04103 ,  Y10T29/49155

    Abstract: Disclosed herein is a touch sensor including: a window substrate; bezels formed along an edge of the window substrate; a first insulating layer stacked while being filled between the bezels to be formed on the window substrate; a second insulating layer applied or adhered onto the bezel and the first insulating layer; and an electrode pattern formed on the second insulating layer.

    Abstract translation: 这里公开了一种触摸传感器，包括：窗基板; 边框沿着窗口基板的边缘形成; 第一绝缘层，被填充在要形成在所述窗基板上的所述挡板之间; 施加或粘附在所述边框和所述第一绝缘层上的第二绝缘层; 以及形成在第二绝缘层上的电极图案。

    Chip inductor
    18.
    发明授权
    Chip inductor 有权
    芯片电感

    公开(公告)号：US09472608B2

    公开(公告)日：2016-10-18

    申请号：US13907808

    申请日：2013-05-31

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Hwan Soo Lee ,  Hye Yeon Cha ,  Jung Min Park ,  Kang Heon Hur ,  Moon Soo Park

    IPC: H01L27/08 ,  H01L49/02

    CPC classification number: H01L28/10 ,  H01F27/24 ,  H01F27/255 ,  H01F27/2804 ,  H01F27/292

    Abstract: Disclosed herein is a chip inductor. The chip inductor according to the present invention includes a substrate on which a through-hole is formed, a conductive coil that is formed on the substrate, an upper resin composite magnetic layer that is filled to surround the conductive coil so that a core is formed on a center portion of the substrate, a lower resin composite magnetic layer that is formed on a bottom portion of the substrate, and an external electrode that is formed on both sides of the upper and lower resin composite magnetic layers.

    Abstract translation: 这里公开了一种芯片电感器。 根据本发明的芯片电感器包括形成有通孔的基板，形成在基板上的导电线圈，被填充以包围导电线圈以形成芯的上部树脂复合磁性层 在基板的中心部分上，形成在基板的底部的下部树脂复合磁性层和形成在上部和下部树脂复合磁性层两侧的外部电极。

    Coil parts and method of manufacturing the same
    19.
    发明授权
    Coil parts and method of manufacturing the same 有权
    线圈零件及其制造方法

    公开(公告)号：US09236173B2

    公开(公告)日：2016-01-12

    申请号：US13707526

    申请日：2012-12-06

    Applicant: Samsung Electro-Mechanics Co., Ltd.

    Inventor： Young Seuck Yoo ,  Young Ghyu Ahn ,  Yong Suk Kim ,  Sang Moon Lee ,  Jeong Bok Kwak ,  Kang Heon Hur ,  Sung Kwon Wi

    IPC: H01F5/00 ,  H01F27/28 ,  H01F41/04 ,  H01F19/04 ,  H01F17/00

    CPC classification number: H01F5/003 ,  H01F19/04 ,  H01F41/041 ,  H01F41/046 ,  H01F2017/0066 ,  H01F2017/0093 ,  Y10T29/49075

    Abstract: The present invention discloses a coil part including: a lower magnetic body; primary and secondary lower patterns formed on the lower magnetic body in a spiral shape in parallel to each other; a lower insulating layer covering the primary and secondary lower patterns; primary and secondary upper patterns electrically connected to the primary and secondary lower patterns, respectively, and formed on the lower insulating layer in a spiral shape in parallel to each other to correspond to the primary and secondary lower patterns; and an upper magnetic body formed on the primary and secondary upper patterns, wherein the primary and secondary upper patterns have portions which cross the primary and secondary lower patterns on the plane, and a method of manufacturing the same.

    Abstract translation: 本发明公开了一种线圈部件，包括：下磁体; 在下部磁体上形成的平行于螺旋形状的一次和二次下部图形; 覆盖主要和次要下部图案的下部绝缘层; 初级和次级上部图案分别电连接到初级和次级下部图案，并且形成在彼此平行的螺旋形状的下部绝缘层上，以对应于初级和次级下部图案; 以及形成在一次和二次上部图案上的上部磁体，其中主要和次要上部图案具有穿过平面上的主要和次要下部图案的部分及其制造方法。

    STAMP FOR MANUFACTURING CONDUCTOR LINE AND VIA AND METHOD FOR MANUFACTURING COIL PARTS
    20.
    发明申请
    STAMP FOR MANUFACTURING CONDUCTOR LINE AND VIA AND METHOD FOR MANUFACTURING COIL PARTS 审中-公开
    制造导线的印章及制造线圈部件的方法

    公开(公告)号：US20130113594A1

    公开(公告)日：2013-05-09

    申请号：US13666863

    申请日：2012-11-01

    Applicant: Samsung Electro-Mechanics Co., Ltd.

    Inventor： Sang Moon Lee ,  Young Seuck Yoo ,  Jeong Bok Kwak ,  Yong Suk Kim ,  Kang Heon Hur ,  Sung Kwon Wi

    IPC: B29C59/00 ,  H01F5/00

    CPC classification number: B29C59/002 ,  H01F5/003 ,  H01F41/041

    Abstract: The present invention discloses a stamp for manufacturing a conductor line and a via including: an imprint body portion having a plate shape; a line imprint portion continuing in a spiral shape from an outer side to a center side of the imprint body portion while projecting from one surface of the imprint body portion; and a via imprint portion projecting from an end portion of the line imprint portion positioned on the center side of the imprint body portion while projecting from one surface of the imprint body portion, and a method for manufacturing coil parts using the same.According to the present invention, it is possible to improve productivity of coil parts and reduce manufacturing costs by simplifying manufacturing processes of a conductor line and a via and implement a fine line width of the conductor line.

    Abstract translation: 本发明公开了一种用于制造导线和通孔的印模，包括：具有板形的印版本体部分; 从压印本体部的一个表面突出地从压印体部的外侧向中心侧呈螺旋状延伸的行印记部; 以及从压印体部分的一个表面突出的位于压印体部分的中心侧的线压痕部分的端部突出的通孔压印部分，以及使用该压印部分的线圈部件的制造方法。 根据本发明，通过简化导体线路和通孔的制造工艺，可以提高线圈部件的生产率并降低制造成本，并且实现导体线的细线宽度。

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