公开(公告)号：US20250129267A1

公开(公告)日：2025-04-24

申请号：US18924620

申请日：2024-10-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yoonseok KO ,  Jung Hoon LEE ,  Sang Soo JEE ,  Fedosya KALININA ,  Hyune Jea LEE

IPC: C09G1/02 ,  H01L21/321

Abstract: A polishing slurry, and a method of manufacturing a semiconductor device using the polishing slurry are provided. The polishing slurry includes nano-abrasive particles having a Mohs hardness greater than about 5, and soft particles having a Mohs hardness lower than the Mohs hardness of the nano-abrasive particles, and wherein the nano-abrasive particles and the soft particles have a same sign of zeta potentials as each other in the polishing slurry.

公开(公告)号：US20230357616A1

公开(公告)日：2023-11-09

申请号：US18312329

申请日：2023-05-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sang Soo JEE ,  Eun Sung Lee ,  Junghoon Lee ,  Youngnam Kwon

IPC: C09K3/14 ,  C09G1/02

CPC classification number: C09K3/1409 ,  C09G1/02

Abstract: Provided are a composite abrasive, a method of preparing same, polishing slurry including same, and a method of manufacturing a semiconductor device using the polishing slurry, the composite abrasive including a host material and abrasive particles protruding from the surface of the host material. The host material may have a Mohs hardness smaller than a Mohs hardness of the abrasive particles. The host material may have a two-dimensional planar structure and/or a layered structure. A binding force between the host material and the abrasive particles may be greater than or equal to about 200 nN.

公开(公告)号：US20170130004A1

公开(公告)日：2017-05-11

申请号：US15346876

申请日：2016-11-09

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  Samsung SDI Co., Ltd.

Inventor： Hongkyoon CHOI ,  Chanjae AHN ,  Hyunjeong JEON ,  Sang Soo JEE ,  Sungwon CHOI ,  Sung Woo HONG ,  Byunghee SOHN

IPC: C08G73/14 ,  C09J179/08 ,  C09D179/08

CPC classification number: C08G73/14 ,  C08G73/1039 ,  C08G73/1042 ,  C08G73/1067 ,  C09D179/08 ,  C09J179/08

Abstract: A poly(imide-amide) copolymer including a structural unit represented by Chemical Formula 1; a structural unit represented by Chemical Formula 2; and any one of a structural unit represented by Chemical Formula 3, an amic acid precursor of the structural unit represented by Chemical Formula 3, and a combination thererof; wherein a cured material of the poly(imide-amide) copolymer may have a tensile modulus of greater than or equal to about 5.5 GPa, and a yellowness index of less than or equal to about 5: wherein, groups and variables in Chemical Formulae 1 and 3 are the same as described in the specification.

公开(公告)号：US20160096927A1

公开(公告)日：2016-04-07

申请号：US14873376

申请日：2015-10-02

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sang Soo JEE ,  Young Jae KANG ,  Hyun Jeong JEON ,  Byung Hee SOHN

IPC: C08G73/10 ,  C09J179/08 ,  C09D179/08

CPC classification number: C08G73/106 ,  C08G73/1007 ,  C08G73/1039 ,  C08G73/1042 ,  C08K9/06 ,  C08L79/08 ,  C09D179/08 ,  C09J179/08

Abstract: A composition for preparing a polyimide-inorganic particle composite, including a tetracarboxylic acid dianhydride represented by Chemical Formula 1, a diamine represented by Chemical Formula 2, and an inorganic particle having an amino group on its surface: wherein the definitions of groups R1 and R2 in Chemical Formula 1 and Chemical Formula 2 are the same as described in the detailed description.

Abstract translation: 一种制备聚酰亚胺 - 无机颗粒复合材料的组合物，包括由化学式1表示的四羧酸二酐，由化学式2表示的二胺和其表面具有氨基的无机颗粒：其中基团R 1和R 2的定义 在化学式1和化学式2中，与详细描述中所述相同。

公开(公告)号：US20140312283A1

公开(公告)日：2014-10-23

申请号：US14146394

申请日：2014-01-02

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jin Man PARK ,  Keum Hwan PARK ,  Eun Sung LEE ,  Suk Jun KIM ,  Se Yun KIM ,  Sang Soo JEE ,  Do-hyang KIM

IPC: H01B1/22 ,  H01B1/02

CPC classification number: H01B1/023

Abstract: According to example embodiments, a metallic glass includes aluminum (Al), a first element group, and a second element group. The first element group includes at least one of a transition metal and a rare earth element. The second element group includes at least one of an alkaline metal, an alkaline-earth metal, a semi-metal, and a non-metal. The second element group and aluminum have an electronegativity difference of greater than or equal to about 0.25. The second element group is included less than or equal to about 3 at % of the metallic glass, based on the total amount of the aluminum (Al), the first element group, and the second element group. A conductive paste and/or an electrode of an electronic device may be formed using the metallic glass.

Abstract translation: 根据示例性实施例，金属玻璃包括铝（Al），第一元件组和第二元件组。 第一元素组包括过渡金属和稀土元素中的至少一种。 第二元素组包括碱金属，碱土金属，半金属和非金属中的至少一种。 第二元素组和铝的电负性差异大于或等于约0.25。 基于铝（Al），第一元素基团和第二元素基团的总量，第二元素组包括小于或等于金属玻璃的约3at％。 可以使用金属玻璃形成电子器件的导电糊和/或电极。

公开(公告)号：US20130118572A1

公开(公告)日：2013-05-16

申请号：US13673359

申请日：2012-11-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Se Yun KIM ,  Suk Jun KIM ,  Eun Sung LEE ,  Sang Soo JEE ,  Jeong Na HEO

IPC: H01L31/0224 ,  H01L31/18

CPC classification number: H01L31/0224 ,  B22F1/0059 ,  B22F3/10 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/0261 ,  B23K35/286 ,  B23K35/3006 ,  B23K35/302 ,  B23K35/3033 ,  C22C21/00 ,  C22C45/00 ,  C22C45/08 ,  H01B1/22 ,  H01L31/022425 ,  H01L31/0682 ,  H01L31/18 ,  Y02E10/547

Abstract: A conductive paste includes a conductive powder, a metallic glass having a glass transition temperature of less than or equal to about 600° C. and a supercooled liquid region of greater than or equal to 0 K, and an organic vehicle, and an electronic device and a solar cell include an electrode formed using the conductive paste.

Abstract translation: 导电浆料包括导电粉末，玻璃化转变温度小于或等于约600℃的金属玻璃和大于或等于0K的过冷液体区域，以及有机载体，以及电子装置 并且太阳能电池包括使用导电糊形成的电极。

公开(公告)号：US20220278256A1

公开(公告)日：2022-09-01

申请号：US17677064

申请日：2022-02-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sang Soo JEE ,  Shang Hyeun PARK ,  Shin Ae JUN

IPC: H01L33/44 ,  H01L33/00 ,  C09K11/02

Abstract: A luminescent nanostructure, a production method for making the luminescent nanostructure, and an electronic device including the luminescent nanostructure. The luminescent nanostructure includes a semiconductor nanocrystal including a Group 13 metal nitride. The luminescent nanostructure has an aspect ratio of greater than or equal to about 1, and an organic compound having an M-O moiety, wherein M is Ti, Al, Zr, Sn, or Si that is bound to at least a portion of the surface of the luminescent nanostructure.

公开(公告)号：US20220267632A1

公开(公告)日：2022-08-25

申请号：US17678246

申请日：2022-02-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sang Soo JEE ,  Shang Hyeun PARK ,  Shin Ae JUN

IPC: C09D11/50 ,  C09D11/037 ,  C09D11/033 ,  C09D11/107 ,  C09D11/322 ,  C09K11/88 ,  C09K11/08 ,  H01L27/32 ,  G02F1/1339 ,  B41M5/00

Abstract: An ink composition and luminescent nanostructure composite, and an electronic device including the luminescent nanostructure composite. The ink composition includes a plurality of titanium oxide particles, a plurality of luminescent nanostructures (e.g., quantum dots), a monomer including a carbon-carbon unsaturated bond, and optionally an organic solvent. The titanium oxide particles have an average size of greater than or equal to about 10 nm and less than or equal to about 900 nm, and the titanium oxide particles comprise an organosilane compound. The ink composition has a total solid content (TSC) of greater than or equal to about 90 wt %, and an amount of the titanium oxide particles in the ink composition is greater than or equal to about 1 wt % based on the total weight of the ink composition. The ink composition is configured to emit a first light.

公开(公告)号：US20200223983A1

公开(公告)日：2020-07-16

申请号：US16837193

申请日：2020-04-01

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  Samsung SDI Co., Ltd.

Inventor： Sung Woo HONG ,  Chanjae AHN ,  Hyunjeong JEON ,  Sang Soo JEE ,  Hongkyoon CHOI ,  Byunghee SOHN ,  Sungwon CHOI

IPC: C08G73/14 ,  C08G73/10

Abstract: A poly(imide-amide) copolymer, which is a product of a reaction between a diamine including an amide structural unit-containing oligomer represented by Chemical Formula 1 and a dianhydride represented by Chemical Formula 3: wherein, groups and variables in Chemical Formulae 1 and 3 are the same as described in the specification.

公开(公告)号：US20170218200A1

公开(公告)日：2017-08-03

申请号：US15419019

申请日：2017-01-30

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  Samsung SDI Co., Ltd.

Inventor： Chanjae AHN ,  Sungwon CHOI ,  Byunghee SOHN ,  A Ra JO ,  Kyeong-sik JU ,  Sang Soo JEE ,  Hongkyoon CHOI

IPC: C08L79/08 ,  C08G73/10 ,  C08G73/14

Abstract: A composition for preparing an article including a polyimide or poly(imide-amide) copolymer, the composition including (1) a solution including at least one of (i) a polymer including at least one selected from a structural unit represented by Chemical Formula 1 and a structural unit represented by Chemical Formula 2; and (ii) a copolymer including at least one selected from a structural unit represented by Chemical Formula 1 and a structural unit represented by Chemical Formula 2, and a structural unit represented by Chemical Formula 3, and (2) a metallic salt soluble in the solution of the polymer and/or the copolymer, wherein the metallic salt is a salt of a metal selected from a Group 1 element, a Group 11 element, a Group 13 element, and a Group 14 element: wherein in Chemical Formulae 1 to 3, A, B, D, and E are the same as defined in the detailed description.