SEMICONDUCTOR DEVICES
    11.
    发明公开

    公开(公告)号:US20240268098A1

    公开(公告)日:2024-08-08

    申请号:US18510949

    申请日:2023-11-16

    Abstract: A semiconductor device includes a first active pattern protruding from a substrate; a gate structure including a gate insulation layer and a gate pattern laterally stacked on a first sidewall of the first active pattern, the gate pattern facing the first sidewall of the first active pattern and extending a first direction parallel to an upper surface of the substrate; and first conductive patterns contacting the gate insulation layer and protruding from a sidewall of the gate structure. The first conductive patterns may be disposed to face second and third sidewalls in the first direction of the first active pattern, and first conductive patterns may be spaced apart from the first active pattern.

    SEMICONDUCTOR MEASUREMENT APPARATUS
    12.
    发明公开

    公开(公告)号:US20230186460A1

    公开(公告)日:2023-06-15

    申请号:US18060830

    申请日:2022-12-01

    CPC classification number: G06T7/001 H04N23/56 H04N23/10 H01L27/108

    Abstract: A semiconductor measurement device may include an illumination apparatus having a polarizer on a propagation path of light output from a light source; an optical assembly including an objective lens configured to allow light passing through the polarizer to be incident on a sample and a beam splitter configured to transmit light reflected from the sample to first and second sensors; and a controller. The controller may be configured to determine an alignment state of patterns in a first region of the sample using a first original image output by the first sensor and an alignment state of patterns in a second region of the sample using a second original image output by the second sensor. The first sensor includes a first image sensor and a self-interference generator in a path along which light is incident on the first image sensor. The second sensor includes a second image sensor.

    SEMICONDUCTOR MEASUREMENT APPARATUS

    公开(公告)号:US20230114817A1

    公开(公告)日:2023-04-13

    申请号:US17857291

    申请日:2022-07-05

    Abstract: A semiconductor measurement apparatus includes an illumination unit including a light source, and a polarizer disposed on a propagation path of light emitted from the light source; an optical unit configured to direct the light passing through the polarizer to be incident onto a sample, and to transmit the light, reflected from the sample, to an image sensor; and a controller configured to process an original image, output by the image sensor, to determine a critical dimension of a structure included in a region of the sample on which the light is incident. The controller acquires a two-dimensional image. The controller orthogonally decomposes the two-dimensional image corresponding to a selected wavelength into a plurality of bases, generates one-dimensional data including a plurality of weights corresponding to the plurality of bases, and uses the one-dimensional data to determine a selected critical dimension among critical dimensions of the structure.

    INTEGRATED CIRCUIT DEVICES
    14.
    发明申请

    公开(公告)号:US20220076732A1

    公开(公告)日:2022-03-10

    申请号:US17245334

    申请日:2021-04-30

    Abstract: An integrated circuit device includes a sense amplifier configured to sense a voltage change of a bit line, wherein the sense amplifier includes: a sense amplifier unit connected to the bit line and a complementary bit line, configured to sense the voltage change of the bit line in response to a control signal, configured to adjust voltages of a sensing bit line and a complementary sensing bit line based on the sensed voltage change, and including a first PMOS transistor and a first NMOS transistor; and a first offset canceling unit connecting the bit line to the complementary sensing bit line in response to an offset canceling signal, and including a first offset canceling transistor arranged between the first NMOS transistor and the first PMOS transistor, wherein the first offset canceling transistor shares a common impurity region with the first NMOS transistor.

    SEMICONDUCTOR MEMORY DEVICE
    15.
    发明申请

    公开(公告)号:US20210408008A1

    公开(公告)日:2021-12-30

    申请号:US17471824

    申请日:2021-09-10

    Abstract: A method of manufacturing a semiconductor memory device and a semiconductor memory device, the method including providing a substrate that includes a cell array region and a peripheral circuit region; forming a mask pattern that covers the cell array region and exposes the peripheral circuit region; growing a semiconductor layer on the peripheral circuit region exposed by the mask pattern such that the semiconductor layer has a different lattice constant from the substrate; forming a buffer layer that covers the cell array region and exposes the semiconductor layer; forming a conductive layer that covers the buffer layer and the semiconductor layer; and patterning the conductive layer to form conductive lines on the cell array region and to form a gate electrode on the peripheral circuit region.

    PLASMA MONITORING SYSTEM AND METHOD OF MONITORING PLASMA

    公开(公告)号:US20240274419A1

    公开(公告)日:2024-08-15

    申请号:US18529011

    申请日:2023-12-05

    CPC classification number: H01J37/32972 H01J37/32926

    Abstract: A plasma monitoring system includes a chamber with an internal space configured to perform a plasma process on a semiconductor substrate, the chamber including a view window and a substrate stage, a light transmitter on the view window and including optical fibers configured to obtain a first light generated during the plasma process, a detachable reflection mirror between the view window and the optical fibers, a light generator configured to irradiate a second light onto the reflection mirror through the optical fibers and to irradiate a third light onto the view window through the optical fibers, and a light analyzer configured to obtain a light spectrum from the first light, to correct the light spectrum based on the second light reflected from the reflection mirror, and to correct the light spectrum based on the third light reflected from the view window.

    SEMICONDUCTOR DEVICE INCLUDING A PERIPHERAL CIRCUIT DEVICE

    公开(公告)号:US20240268105A1

    公开(公告)日:2024-08-08

    申请号:US18391804

    申请日:2023-12-21

    CPC classification number: H10B12/50 H10B12/315

    Abstract: A semiconductor device includes: a substrate including a cell region and a peripheral circuit region; an active region; a cell word line extending across the active region in a first horizontal direction within the cell region; a cell bit line extending in a second horizontal crossing the first horizontal direction in the cell region; a peripheral circuit gate structure extending in the second horizontal direction on the substrate; a peripheral circuit spacer structure disposed on a sidewall of the peripheral circuit gate structure; a peripheral circuit etch stop layer disposed on the substrate, and separated from the peripheral circuit gate structure and the peripheral circuit spacer structure; and a peripheral circuit contact connected to the substrate by penetrating the peripheral circuit etch stop layer. The peripheral circuit etch stop layer has an end portion positioned between the peripheral circuit contact and the peripheral circuit spacer structure.

    SEMICONDUCTOR MEASUREMENT APPARATUS
    18.
    发明公开

    公开(公告)号:US20240230314A9

    公开(公告)日:2024-07-11

    申请号:US18317395

    申请日:2023-05-15

    CPC classification number: G01B9/02044 G01B9/02097 G01B2210/56 G01B2290/70

    Abstract: A semiconductor measurement apparatus may include an illumination unit configured to irradiate light to the sample, an image sensor configured to receive light reflected from the sample and output multiple interference images representing interference patterns of polarization components of light, an optical unit in a path through which the image sensor receives light and including an objective lens above the sample, and a control unit configured to obtain, by processing the multi-interference image, measurement parameters determined from the polarization components at each of a plurality of azimuth angles defined on a plane perpendicular to a path of light incident to the image sensor. The control unit may be configured to determine a selected critical dimension to be measured from a structure in the sample based on measurement parameters. The illumination unit and/or the optical unit may include a polarizer and a compensator having a ¼ wave plate.

    SEMICONDUCTOR MEASUREMENT APPARATUS
    19.
    发明公开

    公开(公告)号:US20240133673A1

    公开(公告)日:2024-04-25

    申请号:US18317395

    申请日:2023-05-14

    CPC classification number: G01B9/02044 G01B9/02097 G01B2210/56 G01B2290/70

    Abstract: A semiconductor measurement apparatus may include an illumination unit configured to irradiate light to the sample, an image sensor configured to receive light reflected from the sample and output multiple interference images representing interference patterns of polarization components of light, an optical unit in a path through which the image sensor receives light and including an objective lens above the sample, and a control unit configured to obtain, by processing the multi-interference image, measurement parameters determined from the polarization components at each of a plurality of azimuth angles defined on a plane perpendicular to a path of light incident to the image sensor. The control unit may be configured to determine a selected critical dimension to be measured from a structure in the sample based on measurement parameters. The illumination unit and/or the optical unit may include a polarizer and a compensator having a ¼ wave plate.

    SEMICONDUCTOR PROCESS DEVICE
    20.
    发明公开

    公开(公告)号:US20240047247A1

    公开(公告)日:2024-02-08

    申请号:US18184418

    申请日:2023-03-15

    CPC classification number: H01L21/67253 H01J37/32944 H01J2237/221

    Abstract: A semiconductor process device includes a chamber housing defining an internal region and a plurality of electrostatic chucks within the internal region. The chamber housing includes a window, and a light collection unit including a first optical system and a second optical system located at different positions on the window. A plurality of first optical pickup units are connected to the first optical system, and a plurality of second optical pickup units are connected to the second optical system. A sensor includes a plurality of photodetectors that are configured to convert a first optical signal transmitted by the plurality of first optical pickup units and a second optical signal transmitted by the plurality of second optical pickup units into electrical signals. A processor is configured to generate a spatial image of the internal region of the chamber housing using the electrical signals output by the plurality of photodetectors, and determine a location at which an arc occurs in the internal region of the chamber housing based on the spatial image.

Patent Agency Ranking