Real-time semiconductor radiation detector
    13.
    发明授权
    Real-time semiconductor radiation detector 失效
    实时半导体辐射探测器

    公开(公告)号:US5757040A

    公开(公告)日:1998-05-26

    申请号:US667453

    申请日:1996-06-21

    摘要: Semiconductor radial rays detector is provided that improves a breakdown voltage yield of a gate insulating film of a semiconductor radial rays detector and prevents an increase in resistance of a gate electrode caused by the improvement in the breakdown voltage yield. In the inventive semiconductor radial rays detector, material used as a gate electrode 1 of a reading condenser is not an Al film (aluminum film) but a POLY Si film (a polycrystalline silicon film), or silicide or metal including silicide with a high melting point such as WSi (tungsten silicide) (strictly its composition is indefinite as expressed as W.sub.x Si.sub.y) or TiSi (titan silicide) (expressed as Ti.sub.x Si, in the same manner). Further, a contact hole 2 is provided on the gate electrode 1 through an inter-insulating film 4 as the inter-insulating film for wiring, and an Al electrode 3 coupled to an output terminal is provided over the contact

    摘要翻译: 提供半导体径向射线检测器,其提高半导体径向射线检测器的栅极绝缘膜的击穿电压产生,并且防止由于击穿电压产量的提高而引起的栅电极的电阻增加。 在本发明的半导体径向射线检测器中,用作读取冷凝器的栅电极1的材料不是Al膜(铝膜),而是POLY Si膜(多晶硅膜),或者包含高熔点的硅化物的硅化物或金属 (硅化钨)(严格地说,其组成如WxSiy所表示的不定)或TiSi(钛硅化物)(以相同的方式表示为TixSi)。 此外,通过作为布线用绝缘膜的绝缘膜4在栅电极1上设置接触孔2,并且在触点上设置耦合到输出端子的Al电极3

    Motor driven bell
    14.
    发明授权
    Motor driven bell 失效
    电机铃

    公开(公告)号:US4952907A

    公开(公告)日:1990-08-28

    申请号:US437077

    申请日:1989-11-14

    申请人: Yoshikazu Kojima

    发明人: Yoshikazu Kojima

    IPC分类号: G10K1/064

    CPC分类号: G10K1/064

    摘要: In a motor driven bell, a pair of cam members are operatively connected to a drive shaft of a motor. One of the cam members acts directly on a leaf spring for moving a hammer attached to the leaf spring generally in parallel relation to the axis of rotation of the cam member to thereby allow the hammer to strike against an associated gong. The other cam member is disposed generally parallel to the cam member so that the leaf spring interposes therebetween. Therefore, the cam members define an amplitude of the leaf spring, whereby the hammer is able to strike against the gong without mis-striking.

    摘要翻译: 在马达驱动的钟罩中,一对凸轮件与马达的驱动轴可操作地连接。 一个凸轮部件直接作用在板簧上,用于使与弹簧的旋转轴线平行的锤子附着在板簧上移动,从而允许锤子撞击相关联的锣。 另一个凸轮构件大致平行于凸轮构件设置,使得片簧间隔开。 因此,凸轮构件限定了板簧的振幅,由此锤子能够在不发生打击的情况下撞击锣。

    Photoelectric conversion type rotational position detector
    16.
    发明授权
    Photoelectric conversion type rotational position detector 失效
    光电转换型旋转位置检测器

    公开(公告)号:US4902885A

    公开(公告)日:1990-02-20

    申请号:US286008

    申请日:1988-12-19

    IPC分类号: G01D5/347 G01D5/36

    CPC分类号: G01D5/366

    摘要: A photoelectric conversion-type rotational position indicator for indicating the rotational position of a rotating body, including a light receiving member having one or more identically shaped light receiving portions made from a photoelectric converting material at predetermined spacings on the light receiving member to generate sinusoidal signals out of phase from each other, and a light shielding member operably connected to the rotating body such that the light shielding member rotates with the rotating body, the light shielding member having windows shaped with an inner curve and an outer curve such that the visible area of each light receiving portion through each of the windows varies in a sinusoidal form of one cycle as the light shielding member rotates, and means for obtaining the phased separated sinusoidal signals by connecting groups of light receiving portions in parallel or series.

    摘要翻译: 一种用于指示旋转体的旋转位置的光电转换型旋转位置指示器,包括具有由光接收部件上的预定间隔由光电转换材料制成的具有一个或多个相同形状的光接收部分的光接收部件,以产生正弦信号 彼此异相,以及遮光构件,其可操作地连接到所述旋转体,使得所述遮光构件与所述旋转体一起旋转,所述遮光构件具有形成有内曲面的窗口和外曲线,使得所述可见光区域 通过每个窗口的每个光接收部分在遮光构件旋转时以一个周期的正弦形式变化,以及用于通过平行或串联连接光接收部分组来获得相位分离的正弦信号的装置。

    Method of manufacturing a semiconductor chip
    19.
    发明授权
    Method of manufacturing a semiconductor chip 失效
    制造半导体芯片的方法

    公开(公告)号:US6107163A

    公开(公告)日:2000-08-22

    申请号:US81987

    申请日:1998-05-20

    摘要: In a method of manufacturing a semiconductor chip, a wire is traveled in one way to cut a wafer into a plurality of chips while a wire train where wires are arranged by pitches of scribe lines is brought into contact with the scribe lines of the wafer linearly, and an abrasive solution is supplied to a contact portion thereof.

    摘要翻译: 在制造半导体芯片的方法中,将导线以一种方式移动以将晶片切割成多个芯片,同时通过划线的间距布置导线的线串与晶片的划线线性地接触 并且将磨料溶液供应到其接触部分。