摘要:
To provide a solder alloy, a solder ball and an electronic member having a solder bump, used for connection with a mother board or the like, having a melting temperature of less than 250° C. for the solder alloy, achieving high drop impact resistance required in mobile devices or the like. A solder alloy is used which consists of not less than 0.1 mass ppm of boron and not greater than 200 mass ppm of boron and a remainder comprising substantially not less than 40% by mass of Sn, in which its melting temperature is less than 250° C.
摘要:
To provide a solder alloy, a solder ball and an electronic member having a solder bump, used for connection with a mother board or the like, having a melting temperature of less than 250° C. for the solder alloy, achieving high drop impact resistance required in mobile devices or the like. A solder alloy is used which consists of not less than 0.1 mass ppm of boron and not greater than 200 mass ppm of boron and a remainder comprising substantially not less than 40% by mass of Sn, in which its melting temperature is less than 250° C.
摘要:
The purpose of the present invention is to provide an interconnector for solar cells, which reduces the stress acting on a solar cell and suppresses warping and cracking of the solar cell. An interconnector for solar cells of the present invention is characterized by comprising an electrically conductive wire part and a surface layer that is formed on at least one wide surface of the electrically conductive wire part. The interconnector for solar cells is also characterized in that the surface layer has a function of reducing the stress that is caused by the difference between the thermal expansion coefficient of the electrically conductive part and the thermal expansion coefficient of a solar cell, said stress being generated when the interconnector is joined to the solar cell.
摘要:
Provided are a metal tape material improved in characteristics to be low in Young's modulus, low in yield stress and high in break elongation and a metal tape material for semiconductor packaging, such as a current-collection interconnector, comprising the same.The metal tape material comprises a metal having face centered cubic lattice structure, in which metal tape material an area fraction A1 of a preferentially oriented region in which crystal axes of a unit lattice of the face centered cubic structure are within an orientation difference of 15° relative to a thickness direction of the metal tape material and further within an orientation difference of 15° relative to a first in-plane direction of the metal tape material is 60% or greater and not greater than 100%, and, where an area fraction of a preferentially oriented region in which crystal axes of the unit lattice of the face centered cubic structure are within an orientation difference of 15° relative to the thickness direction of the metal tape material and further within an orientation difference of 15° relative to the first in-plane direction of the metal tape material is defined as A2, the total of the area fraction of the preferentially oriented region and the area fraction of the preferentially oriented region, A1+A2, is greater than 70% and not greater than 100%.
摘要:
The present invention relates to an oxide superconductor comprising a composite oxide of RE , Ba and Cu, wherein the superconductor comprises a micro structure comprised of a monocrystalline REBa.sub.2 Cu.sub.3 O.sub.7-x phase (123 phase) and a RE.sub.2 BaCuO.sub.5 phase (211 phase) finely dispersed therein, the 123 phase being formed in a plurality of domains respectively for individual RE compositions and in the order of the 123 phase forming temperatures in respective layers. The present invention relates also to a process for the preparation of an oxide superconductor, characterized by forming a layer from a mixed powder of the RE, Ba and Cu compounds, forming another layer(s) of a mixed powder of RE, Ba and Cu compounds having another RE composition(s) different from the above-mentioned RE composition in the 123 phase forming temperature to form a multi layer structure, putting said plurality of layers on top of one another so that the 123 phase forming temperatures in respective layers continue towards a higher temperature side or a lower temperature side, subjecting the assembly to press molding to form a precursor, putting said precursor on a supporting material with the layer having the highest 123 phase forming temperature being located at the highest position, heating said precursor to a temperature range in a solid liquid coexisting region to bring said precursor into a semi molten state, and either gradually cooling said precursor in a 123 phase temperature range or inoculating the precursor with a seed crystal and gradually cooling the inoculated precursor in the above mentioned temperature range to grow a 123 phase crystal at a growth rate of 5 mm/hr or less.
摘要:
A metal tape material contains a metal having face centered cubic lattice structure, in which metal tape material an area fraction A1 of a preferentially oriented region are within an orientation difference of 15° C. relative to a thickness direction of the metal tape material and further within an orientation difference of 15° C. relative to a first in-plane direction of the metal tape material is 60% or greater and not greater than 100%, and, where an area fraction of a preferentially oriented region are within an orientation difference of 15° relative to the thickness direction and further within an orientation difference of 15° relative to the first in-plane direction is defined as A2, the total of the area fraction of the preferentially oriented region and the area fraction of the preferentially oriented region, A1+A2, is greater than 70% and not greater than 100%.
摘要:
A manufacturing method of minute metallic spheres of the present invention comprises a heating means for heating and melting a metal to form a metallic sphere, a measurement means for measuring the injected molten metal into a predetermined volume, and a cooling means for cooling the molten metal discharged from the measurement means, to a temperature less than the melting point. The measurement means has a gauger of a predetermined volume in which the molten metal is injected, and is constructed such that the molten metal is cut by rubbing by the predetermined volume by sliding this gauger in contact. The molten metal is injected in the gauger of the predetermined volume to measure, and the measured molten metal is discharged from the gauger to cool to a temperature less than the melting point, and solidified into a sphere in the cooling process.
摘要:
There are provided a fixed-abrasive grain saw wire with a superior cutting performance and a manufacturing method thereof. Particularly, there are provided a fixed-abrasive grain saw wire with abrasive grains adhered to a metal wire via a Zn-based or Sn-based low-melting-point metal and a high-melting-point metal having a melting point higher than that of the low-melting-point metal, and a manufacturing method thereof.
摘要:
A manufacturing method of minute metallic spheres of the present invention comprises a heating means for heating and melting a metal to form a metallic sphere, a measurement means for measuring the injected molten metal into a predetermined volume, and a cooling means for cooling the molten metal discharged from the measurement means, to a temperature less than the melting point. The measurement means has a gauger of a predetermined volume in which the molten metal is injected, and is constructed such that the molten metal is cut by rubbing by the predetermined volume by sliding this gauger in contact. The molten metal is injected in the gauger of the predetermined volume to measure, and the measured molten metal is discharged from the gauger to cool to a temperature less than the melting point, and solidified into a sphere in the cooling process.