公开(公告)号：US07368998B2

公开(公告)日：2008-05-06

申请号：US11608609

申请日：2006-12-08

申请人： Toshiyuki Abe ,  Yoshihiro Suzuki ,  Masashi Katsumata

发明人： Toshiyuki Abe ,  Yoshihiro Suzuki ,  Masashi Katsumata

IPC分类号： H03F3/14 ,  H03H7/00

CPC分类号： H05K1/0265 ,  H01L2924/1423 ,  H03F3/195 ,  H03F2200/294 ,  H05K1/165 ,  H05K3/243 ,  H05K3/4644 ,  H05K2201/0352 ,  H05K2201/09736 ,  H05K2201/09881 ,  H05K2203/0542

摘要： An inductor element containing circuit board of the present invention comprises a plurality of conductive layers, and a conductor having an inductor function (inductor conductor segment) in one or more of the conductive layers, wherein at least part of the inductor conductor segment is made thicker than other conductors disposed within the circuit board. The at least part of the inductor conductor segment extends through an insulating layer disposed between the conductive layers, or is embedded in the insulating layer, wherein the part of the inductor conductor segment has a thickness one-half or more the thickness of the insulating layer. A power amplifier module of the present invention comprises the multi-layer circuit board, a semiconductor amplifier fabricated in the multi-layer circuit board, and an impedance matching circuit coupled to the output of the semiconductor amplifier. The impedance matching circuit has a portion thereof formed of the inductor conductor segment.

摘要翻译： 本发明的电感器元件电路板包括多个导电层，以及在一个或多个导电层中具有电感器功能（电感器导体段）的导体，其中电感器导体段的至少一部分变厚 而不是设置在电路板内的其它导线。 电感器导体段的至少一部分延伸穿过设置在导电层之间的绝缘层，或者嵌入在绝缘层中，其中电感器导体段的一部分具有绝缘层的厚度的一半或更多的厚度 。 本发明的功率放大器模块包括多层电路板，在多层电路板中制造的半导体放大器和耦合到半导体放大器的输出的阻抗匹配电路。 阻抗匹配电路具有由电感器导体段形成的部分。

公开(公告)号：US20070057366A1

公开(公告)日：2007-03-15

申请号：US11521156

申请日：2006-09-14

申请人： Masashi Katsumata ,  Kenichi Kawabata ,  Toshikazu Endo

发明人： Masashi Katsumata ,  Kenichi Kawabata ,  Toshikazu Endo

IPC分类号： H01L23/34

CPC分类号： H01L25/18 ,  H01L23/5386 ,  H01L24/24 ,  H01L24/25 ,  H01L24/82 ,  H01L25/0655 ,  H01L2224/24137 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/0216 ,  H05K1/0218 ,  H05K1/0231 ,  H05K1/0233 ,  H05K1/0298 ,  H05K1/0373 ,  H05K1/185 ,  H05K3/4688 ,  H05K2201/0715 ,  H05K2201/086 ,  H05K2201/09236 ,  H05K2201/09245 ,  H05K2201/09618 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10674

摘要： A semiconductor IC-embedded module 100 comprises a multilayer substrate 101 having first and second insulating layers 101a and 101b, and a controller IC 012 and memory IC 103 that are embedded in the multilayer substrate 101. A wiring layer 104 is formed as an internal layer in the multilayer substrate 101. Part of the wiring layer 104 constitutes a bus line 104X. The controller IC 102 or memory IC 103 is embedded in the second insulating layer 101b. First and second ground layers 105a and 105b are provided respectively in the first and second insulating layers 101a and 101b. The effect of noise generated by bus lines is reduced, and an additional reduction in noise and a decrease in size and thickness are achieved by laying out bus lines that connect the semiconductor ICs so that distances are minimized.

摘要翻译： 半导体IC嵌入式模块100包括具有嵌入在多层基板101中的第一绝缘层101a和第二绝缘层101b以及控制器IC 012和存储器IC 103的多层基板101。 在多层基板101中形成布线层104作为内层。 布线层104的一部分构成总线104 X.控制器IC 102或存储器IC 103嵌入第二绝缘层101b中。 第一和第二接地层105a和105b分别设置在第一和第二绝缘层101a和101b中。 由总线产生的噪声的影响减小，通过布置连接半导体IC的总线，使距离最小化，可以实现额外的噪声降低和尺寸和厚度的减小。

公开(公告)号：US20050140434A1

公开(公告)日：2005-06-30

申请号：US11010327

申请日：2004-12-14

申请人： Toshiyuki Abe ,  Yoshihiro Suzuki ,  Masashi Katsumata

发明人： Toshiyuki Abe ,  Yoshihiro Suzuki ,  Masashi Katsumata

IPC分类号： H01L23/12 ,  H03F3/195 ,  H03F3/60 ,  H03G3/30 ,  H05K1/02 ,  H05K1/16 ,  H05K3/24 ,  H05K3/46 ,  H03F1/00

CPC分类号： H05K1/0265 ,  H01L2924/1423 ,  H03F3/195 ,  H03F2200/294 ,  H05K1/165 ,  H05K3/243 ,  H05K3/4644 ,  H05K2201/0352 ,  H05K2201/09736 ,  H05K2201/09881 ,  H05K2203/0542

摘要： An inductor element containing circuit board of the present invention comprises a plurality of conductive layers, and a conductor having an inductor function (inductor conductor segment) in one or more of the conductive layers, wherein at least part of the inductor conductor segment is made thicker than other conductors disposed within the circuit board. The at least part of the inductor conductor segment extends through an insulating layer disposed between the conductive layers, or is embedded in the insulating layer, wherein the part of the inductor conductor segment has a thickness one-half or more the thickness of the insulating layer. A power amplifier module of the present invention comprises the multi-layer circuit board, a semiconductor amplifier fabricated in the multi-layer circuit board, and an impedance matching circuit coupled to the output of the semiconductor amplifier. The impedance matching circuit has a portion thereof formed of the inductor conductor segment.

摘要翻译： 本发明的电感器元件电路板包括多个导电层，以及在一个或多个导电层中具有电感器功能（电感器导体段）的导体，其中电感器导体段的至少一部分变厚 而不是设置在电路板内的其它导线。 电感器导体段的至少一部分延伸穿过设置在导电层之间的绝缘层，或者嵌入在绝缘层中，其中电感器导体段的一部分具有绝缘层的厚度的一半或更多的厚度 。 本发明的功率放大器模块包括多层电路板，在多层电路板中制造的半导体放大器和耦合到半导体放大器的输出的阻抗匹配电路。 阻抗匹配电路具有由电感器导体段形成的部分。

公开(公告)号：US6144263A

公开(公告)日：2000-11-07

申请号：US249134

申请日：1999-02-12

申请人： Masashi Katsumata ,  Takeshi Endo

发明人： Masashi Katsumata ,  Takeshi Endo

IPC分类号： H01P7/08 ,  H03B1/00 ,  H03B5/12 ,  H03B5/18

CPC分类号： H03B5/1231 ,  H03B5/1203 ,  H03B5/1243 ,  H03B5/1293 ,  H03B2201/014 ,  H03B2201/0258

摘要： A voltage-controlled oscillator and a method capable of precisely adjusting a frequency shift amount are provided irrespective of a fluctuation in characteristics of elements such as a strip-line. A center tap 19 is formed in a strip-line 16 of a resonator. A switching element 20 is connected to the center tap 19, and this switching element 20 is turned ON, so that the center tap is shortcircuited to the ground so as to vary the oscillating frequency. A slit A1 is conducted in the vicinity of the center tap 19 along the strip-line 16 and directed toward a shortcircuited end 17 of the strip-line, so that a frequency shift amount is adjusted. Also, a slit B1 is conducted in the vicinity of the shortcircuited end 17 along the strip-line 16 and directed toward the center tap 19, so that a frequency shift amount is adjusted. Also, trimming points are provided on the side of a hot terminal 18 from the center tap 19, and also provided on the side of the shortcircuited end 17 from the center tap 19, and further a slit is conducted along an intersecting direction of the strip-line 16, so that a shift amount is adjusted.

摘要翻译： 提供压控振荡器和能够精确地调整频移量的方法，而不管诸如带状线的元件的特性波动。 中心抽头19形成在谐振器的带状线16中。 开关元件20连接到中心抽头19，并且该开关元件20导通，使得中心抽头短路到地，以便改变振荡频率。 狭缝A1沿着带状线16在中心龙头19附近被引导并且指向带状线的短路端17，从而调整频移量。 此外，狭缝B1沿着带状线16在短路端17附近被引导并指向中心抽头19，从而调整频移量。 此外，修剪点从中心抽头19设置在热端子18的侧面上，并且还从中心抽头19设置在短路端17的一侧，并且还沿着条带的相交方向引导狭缝 线16，使得移动量被调整。