公开(公告)号：US10403582B2

公开(公告)日：2019-09-03

申请号：US15805150

申请日：2017-11-07

Applicant: TDK Corporation

Inventor： Kenichi Kawabata

IPC: H01L23/52 ,  H01L23/552 ,  H01L23/31 ,  H01L23/538 ,  H01L21/56 ,  H01L21/48 ,  H01L21/78 ,  H01F1/147 ,  C08K3/08 ,  H01L23/29 ,  H01L23/00

Abstract: Disclosed herein is an electronic circuit package includes a substrate having a power supply pattern, an electronic component mounted on a surface of the substrate, and a composite molding member having conductivity that covers the surface of the substrate so as to embed the electronic component and that is connected to the power supply pattern. The composite molding member includes a resin material and a first filler blended in the resin material and containing 32 to 39 wt. % of a metal material composed mainly of Ni in Fe.

公开(公告)号：US10373917B2

公开(公告)日：2019-08-06

申请号：US15832769

申请日：2017-12-05

Applicant: TDK Corporation

Inventor： Kenichi Kawabata

IPC: H01L23/552 ,  H01L21/48 ,  H01L21/56 ,  H01L23/29 ,  H01L23/498 ,  H01L23/00 ,  H01L23/31

Abstract: Disclosed herein is an electronic circuit package that includes a substrate having a power supply pattern, an electronic component mounted on a surface of the substrate; and a molding member having conductivity that covers the surface of the substrate so as to embed the electronic component therein. The power supply pattern includes a first power supply pattern exposed to the surface of the substrate, and the molding member contacts the first power supply pattern.

公开(公告)号：US10269727B2

公开(公告)日：2019-04-23

申请号：US15919991

申请日：2018-03-13

Applicant: TDK Corporation

Inventor： Kenichi Kawabata

IPC: H01L23/34 ,  H01L23/552 ,  H01L23/29 ,  H01L25/16 ,  H01L25/00 ,  H01L21/56 ,  H01F1/147 ,  H01L23/31

Abstract: Disclosed herein is a composite magnetic sealing material includes a resin material and a filler blended in the resin material in a blend ratio of 50 vol. % or more and 85 vol. % or less. The filler includes a first magnetic filler containing Fe and 32 wt. % or more and 39 wt. % or less of a metal material composed mainly of Ni, the first magnetic filler having a first grain size distribution, and a second magnetic filler having a second grain size distribution different from the first grain size distribution.

公开(公告)号：US10242954B2

公开(公告)日：2019-03-26

申请号：US15366219

申请日：2016-12-01

Applicant: TDK Corporation

Inventor： Kenichi Kawabata

IPC: H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L23/29 ,  H01L23/31 ,  H01L23/498 ,  H01L23/552

Abstract: Disclosed herein is an electronic circuit package includes: a substrate having a power supply pattern; an electronic component mounted on a surface of the substrate; a magnetic mold resin that covers the surface of the substrate so as to embed the electronic component therein, the magnetic mold resin comprising a composite magnetic material containing a thermosetting resin material and a magnetic filler; and a laminated film including at least a metal film and a magnetic film, the laminated film covering at least an top surface of the magnetic mold resin. The metal film is connected to the power supply pattern, and the magnetic film has a higher effective permeability than that of the magnetic mold resin.

公开(公告)号：US09972579B1

公开(公告)日：2018-05-15

申请号：US15478419

申请日：2017-04-04

Applicant: TDK Corporation

Inventor： Kenichi Kawabata

IPC: H01L23/34 ,  H01L23/552 ,  H01L23/29 ,  H01L25/16 ,  H01L25/00 ,  H01L21/56 ,  H01F1/147

CPC classification number: H01L23/552 ,  H01F1/14708 ,  H01L21/561 ,  H01L21/563 ,  H01L23/295 ,  H01L25/16 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2224/97 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/00012

Abstract: Disclosed herein is a composite magnetic sealing material includes a resin material and a filler blended in the resin material in a blend ratio of 50 vol. % or more and 85 vol. % or less. The filler includes a first magnetic filler containing Fe and 32 wt. % or more and 39 wt. % or less of a metal material composed mainly of Ni, the first magnetic filler having a first grain size distribution, and a second magnetic filler having a second grain size distribution different from the first grain size distribution.

公开(公告)号：US20180108617A1

公开(公告)日：2018-04-19

申请号：US15844176

申请日：2017-12-15

Applicant: TDK Corporation

Inventor： Kenichi Kawabata

IPC: H01L23/552 ,  H01L23/29 ,  B29C45/14 ,  H01L23/31 ,  H01L23/498 ,  B29C33/00 ,  H01L23/00 ,  H01L21/56 ,  B29L31/00

CPC classification number: H01L23/552 ,  B29C45/14336 ,  B29C45/14655 ,  B29K2995/0008 ,  B29L2031/712 ,  H01L21/561 ,  H01L21/565 ,  H01L23/295 ,  H01L23/3114 ,  H01L23/3121 ,  H01L23/49822 ,  H01L24/16 ,  H01L24/97 ,  H01L2224/131 ,  H01L2224/16104 ,  H01L2224/16227 ,  H01L2224/97 ,  H01L2924/15159 ,  H01L2924/15192 ,  H01L2924/15313 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2924/3511 ,  H01L2224/81 ,  H01L2924/014 ,  H01L2924/00014

Abstract: Disclosed herein is an electronic circuit package includes a substrate, an electronic component mounted on a surface of the substrate, and a magnetic mold resin covering the surface of the substrate so as to embed therein the electronic component. The magnetic mold resin includes a resin material and a filler blended in the resin material in a blended ratio of 30 vol. % or more to 85 vol. % or less. The filler includes a magnetic filler containing Fe and 32 wt. %or more and 39 wt. % or less of a metal material contained mainly of Ni, thereby a thermal expansion coefficient of the magnetic mold resin is 15 ppm/° C. or less.

公开(公告)号：US09907179B2

公开(公告)日：2018-02-27

申请号：US15137106

申请日：2016-04-25

Applicant: TDK Corporation

Inventor： Kenichi Kawabata

IPC: H05K1/18 ,  H01F1/03 ,  H05K1/02

CPC classification number: H05K1/182 ,  H01F1/0306 ,  H01F1/26 ,  H01L2224/16225 ,  H01L2224/97 ,  H01L2924/181 ,  H01L2924/19105 ,  H05K1/0216 ,  H05K1/0298 ,  H05K1/181 ,  H05K3/284 ,  H05K9/003 ,  H05K2201/083 ,  H05K2203/1316 ,  H01L2924/00012

Abstract: Disclosed herein is an electronic circuit package includes: a substrate having a power supply pattern; an electronic component mounted on a surface of the substrate; a magnetic mold resin formed of a composite magnetic material including a thermosetting resin material and a magnetic filler, the magnetic mold resin covering the surface of the substrate so as to embed therein the electronic component; and a metal film connected to the power supply pattern and covering at least a top surface of the magnetic mold resin. A volume resistance value of the magnetic mold resin is equal to or larger than 1010Ω, and a resistance value at an interface between the top surface of the magnetic mold resin and the metal film is equal to or larger than 106Ω.

公开(公告)号：US09472428B2

公开(公告)日：2016-10-18

申请号：US14334965

申请日：2014-07-18

Applicant: TDK Corporation

Inventor： Kenichi Kawabata ,  Seiko Komatsu

IPC: H01L21/58 ,  H01L21/67

CPC classification number: H01L21/67092 ,  Y10T29/49124

Abstract: A manufacturing method of electronic module components according to the present invention includes: forming a plurality of module components on a principal surface of a substrate; forming a groove by dicing between the module components; spraying a conductive paste toward the principal surface of the substrate; and separating the module components. The spraying is performed so that an angle formed between a spray direction and the principal surface is an angle θ. The angle θ is set so as to satisfy the following expression (1), assuming that a depth of the groove is D and a width of the groove is w. The expression (1) is tan−1(D/2w)≦θ≦tan−1(2D/w)

公开(公告)号：US09381595B2

公开(公告)日：2016-07-05

申请号：US14923853

申请日：2015-10-27

Applicant: TDK CORPORATION

Inventor： Tsutomu Yasui ,  Kenichi Kawabata

IPC: H05K1/09 ,  B23K35/26 ,  H05K1/11 ,  H05K1/18 ,  C22C13/02 ,  C22C19/03 ,  B23K35/02

CPC classification number: B23K35/262 ,  B22F2998/10 ,  B23K35/0244 ,  C22C1/0433 ,  C22C1/0483 ,  C22C13/02 ,  C22C19/03 ,  H05K1/11 ,  H05K1/181 ,  H05K3/3463 ,  H05K3/3478 ,  H05K3/3494 ,  H05K2203/0415 ,  B22F1/0003 ,  B22F9/082 ,  B22F2201/01

Abstract: A Pb-free solder includes a first metal including at least Sn and Bi, and a second metal including at least an Ni—Fe alloy. In the first metal, the sum of Sn and Bi is 90 mass % or more, and a ratio of Bi is 5 to 15 mass %. A ratio of the second metal to the sum of mass of the first metal and mass of the second metal is 5 to 30 mass %.

Abstract translation: 无铅焊料包括至少包含Sn和Bi的第一金属和至少包含Ni-Fe合金的第二金属。 在第一金属中，Sn和Bi的总和为90质量％以上，Bi的比例为5〜15质量％。 第二金属与第一金属的质量和第二金属的质量之和为5〜30质量％。

公开(公告)号：US11765874B2

公开(公告)日：2023-09-19

申请号：US16932046

申请日：2020-07-17

Applicant: TDK CORPORATION

Inventor： Takashi Yamada ,  Miyuki Yanagida ,  Atsushi Sato ,  Kenichi Kawabata

IPC: C25D3/56 ,  H05K9/00 ,  C25D7/00

CPC classification number: H05K9/0083 ,  C25D3/562 ,  H05K9/0088 ,  C25D7/001

Abstract: A method of forming a metal magnetic film includes forming the metal magnetic film by a plating process, wherein the metal magnetic film comprises a permalloy and carbon atoms and a content of the carbon atoms is 0.3 to 3.0 at % based on a total amount of the carbon atoms and metal elements.