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    Method for fabricating semiconductor device and semiconductor device
    11.
    发明授权
    Method for fabricating semiconductor device and semiconductor device 有权
    制造半导体器件和半导体器件的方法

    公开(公告)号：US08034707B2

    公开(公告)日：2011-10-11

    申请号：US12897416

    申请日：2010-10-04

    申请人： Tetsuya Ueda

    发明人： Tetsuya Ueda

    IPC分类号： H01L21/4763

    CPC分类号： H01L21/76801 ,  H01L21/76802 ,  H01L21/7682 ,  H01L21/76849 ,  H01L23/5222 ,  H01L23/53238 ,  H01L23/53295 ,  H01L2924/0002 ,  H01L2924/12044 ,  H01L2924/00

    摘要： A method for fabricating a semiconductor device includes the steps of forming a plurality of lower interconnections at intervals in a first insulating film; removing a portion of the first insulating film located between the lower interconnections, thereby forming an interconnection-to-interconnection gap; forming a second insulating film over the first insulating film in which the lower interconnections and the interconnection-to-interconnection gap are formed such that an air gap is formed out of the interconnection-to-interconnection gap; and forming, in the second insulating film, a connection portion connected to one of the lower interconnections and an upper interconnection connected to the connection portion. The connection portion is formed to be connected to one of the lower interconnections not adjacent to the air gap.

    摘要翻译： 一种制造半导体器件的方法包括以下步骤：在第一绝缘膜中间隔地形成多个下互连; 去除位于下互连之间的第一绝缘膜的一部分，从而形成互连互连间隙; 在所述第一绝缘膜上形成第二绝缘膜，其中所述下互连和互连互连间隙形成为使得从所述互连互连间隙形成气隙; 以及在所述第二绝缘膜中形成连接到所述下部互连中的一个的连接部分和连接到所述连接部分的上部互连件。 连接部分形成为连接到不邻近气隙的下互连中的一个。

    Semiconductor device with a low dielectric constant film between lower interconnections
    12.
    发明授权
    Semiconductor device with a low dielectric constant film between lower interconnections 有权
    在低互连之间具有低介电常数膜的半导体器件

    公开(公告)号：US07622807B2

    公开(公告)日：2009-11-24

    申请号：US12277933

    申请日：2008-11-25

    申请人： Tetsuya Ueda

    发明人： Tetsuya Ueda

    IPC分类号： H01L29/40

    CPC分类号： H01L21/76801 ,  H01L21/76802 ,  H01L21/7682 ,  H01L21/76849 ,  H01L23/5222 ,  H01L23/53238 ,  H01L23/53295 ,  H01L2924/0002 ,  H01L2924/12044 ,  H01L2924/00

    摘要： A method for fabricating a semiconductor device includes the steps of: forming a plurality of lower interconnections at intervals in a first insulating film; removing a portion of the first insulating film located between the lower interconnections, thereby forming an interconnection-to-interconnection gap; forming a second insulating film over the first insulating film in which the lower interconnections and the interconnection-to-interconnection gap are formed such that an air gap is formed out of the interconnection-to-interconnection gap; and forming, in the second insulating film, a connection portion connected to one of the lower interconnections and an upper interconnection connected to the connection portion. The connection portion is formed to be connected to one of the lower interconnections not adjacent to the air gap.

    摘要翻译： 一种制造半导体器件的方法包括以下步骤：在第一绝缘膜中间隔地形成多个下互连; 去除位于下互连之间的第一绝缘膜的一部分，从而形成互连互连间隙; 在所述第一绝缘膜上形成第二绝缘膜，其中所述下互连和互连互连间隙形成为使得从所述互连互连间隙形成气隙; 以及在所述第二绝缘膜中形成连接到所述下部互连中的一个的连接部分和连接到所述连接部分的上部互连件。 连接部分形成为连接到不邻近气隙的下互连中的一个。

    Semiconductor device and method for fabricating the same
    13.
    发明授权
    Semiconductor device and method for fabricating the same 有权
    半导体装置及其制造方法

    公开(公告)号：US07265450B2

    公开(公告)日：2007-09-04

    申请号：US10900272

    申请日：2004-07-28

    申请人： Takato Handa ,  Hiroyuki Umimoto ,  Tetsuya Ueda

    发明人： Takato Handa ,  Hiroyuki Umimoto ,  Tetsuya Ueda

    IPC分类号： H01L23/48

    CPC分类号： H01L21/76843 ,  H01L21/76801 ,  H01L21/76816 ,  H01L21/76832 ,  H01L21/76834 ,  H01L21/76865 ,  H01L21/76877 ,  H01L21/76886 ,  H01L23/5283 ,  H01L23/53238 ,  H01L23/53295 ,  H01L2924/0002 ,  H01L2924/00

    摘要： An inventive semiconductor device includes: a lower interlayer dielectric film provided on a substrate; a lower interconnect made up of a lower barrier metal layer formed along a wall surface of a lower interconnect groove in the lower interlayer dielectric film, and a copper film; and an upper plug and an upper interconnect. The upper plug passes through a silicon nitride film and comes into contact with the copper film of the lower interconnect. The lower interconnect is provided with a large number of convex portions buried in concave portions of the lower interconnect groove. Thus, voids in the lower interconnect are also gettered by the convex portions. Accordingly, the concentration of voids in the contact area between the lower interconnect and the upper plug is relieved, and an increase in contact resistance is suppressed.

    摘要翻译： 本发明的半导体器件包括：设置在基板上的下层间绝缘膜; 由沿下层间电介质膜的下互连槽的壁面形成的下阻挡金属层和铜膜构成的下互连件; 以及上部插头和上部互连件。 上塞通过氮化硅膜并与下互连的铜膜接触。 下部互连件设置有埋在下部互连槽的凹部中的大量凸部。 因此，下部互连件中的空隙也被凸起部分吸收。 因此，下部布线和上部插塞之间的接触区域中的空隙的浓度被释放，并且抑制了接触电阻的增加。

    Dust removing apparatus
    16.
    发明授权
    Dust removing apparatus 失效
    除尘装置

    公开(公告)号：US5603742A

    公开(公告)日：1997-02-18

    申请号：US374723

    申请日：1995-01-27

    申请人： Kiyoshi Nagashima ,  Tetsuya Ueda ,  Hisataka Urakata ,  Tetsuya Fujino ,  Yuichiro Kitagawa ,  Satoshi Uchida ,  Yasuo Akitu ,  Yosiaki Hori

    发明人： Kiyoshi Nagashima ,  Tetsuya Ueda ,  Hisataka Urakata ,  Tetsuya Fujino ,  Yuichiro Kitagawa ,  Satoshi Uchida ,  Yasuo Akitu ,  Yosiaki Hori

    IPC分类号： B01D46/00 ,  B01D46/24

    CPC分类号： B01D46/2422 ,  B01D2271/02

    摘要： A dust removing apparatus includes a filter and mounting frame which prevent leakage of dirty gas and improve the collection factor of soot dust even if dirty gas of a high temperature is subjected to a dust removing operation. The apparatus includes a filter element held in a filter element mounting frame, wherein a flange is disposed on an end of the filter element located on the side which receives dirty gas, and wherein the side of the flange opposite the dirty gas side is pressed against a flange of the filter element mounting frame. A seal packing is disposed between the filter flange and frame flange to seal the elements. Further, a plurality of honeycomb filter elements structured as above may be collected and accommodated to form a honeycomb pack.

    摘要翻译： PCT No.PCT / JP94 / 01032 Sec。 371日期：1995年1月27日 102（e）日期1995年1月27日PCT Filed 1994年6月27日PCT公布。 出版物WO95 / 日期1995年5月1日除尘设备包括一个过滤器和安装框架，防止脏气体的泄漏，并且即使对高温的脏气进行除尘操作，也能提高灰尘的收集系数。 该装置包括保持在过滤元件安装框架中的过滤元件，其中在位于容纳脏气体的一侧的过滤元件的端部上设置有凸缘，并且其中与脏气侧相对的凸缘侧被压靠 过滤元件安装架的凸缘。 密封垫片设置在过滤器法兰和框架法兰之间以密封元件。 此外，可以收集并容纳多个如上构成的蜂窝过滤器元件以形成蜂窝状包装。

    Printer using double sheets of pressure sensitive paper
    18.
    发明授权
    Printer using double sheets of pressure sensitive paper 失效
    打印机使用双张压敏纸

    公开(公告)号：US5295752A

    公开(公告)日：1994-03-22

    申请号：US904755

    申请日：1992-06-26

    申请人： Shinsuke Kawamoto ,  Osamu Miyajima ,  Tetsuya Ueda

    发明人： Shinsuke Kawamoto ,  Osamu Miyajima ,  Tetsuya Ueda

    IPC分类号： B41J11/48 ,  B41J15/04 ,  B41J15/20 ,  B41J29/13 ,  B41J29/15 ,  B41J29/18

    CPC分类号： B41J15/20

    摘要： A printer using double sheets of pressure sensitive paper includes a casing having an opening at its upper portion, a paper guide disposed in the opening of the casing, and a paper support disposed under the opening of the casing. The paper guide separates the printed double sheets of pressure sensitive paper into a receipt sheet and a journal sheet. The paper guide also operates to introduce the receipt sheet out of the casing through the opening and to guide the journal sheet in a predetermined direction within the casing with a front surface of the journal sheet exposed toward the opening. The paper support upwardly supports a rear surface of the journal sheet. Since the front surface of the journal sheet is exposed through the opening of the casing, a confirmation signature and/or correction signature can be handwritten on the front surface of the journal sheet.

    摘要翻译： 使用双张压敏纸的打印机包括在其上部具有开口的壳体，设置在壳体的开口中的纸引导件和设置在壳体的开口下方的纸支架。 纸张导向器将印刷的双张压敏纸分离成收据纸和日记纸。 纸张引导件还用于通过开口将收据单从箱体中引出，并且在轴套板的前表面朝向开口暴露的情况下，将轴颈板沿预定方向引导到壳体内。 纸张支撑件向上支撑轴颈板的后表面。 由于轴颈板的前表面通过壳体的开口暴露，所以可以在轴颈板的前表面上手写确认签名和/或校正签名。

    Tape carrier for tape automated bonding process and a method of producing the same
    19.
    发明授权
    Tape carrier for tape automated bonding process and a method of producing the same 失效
    用于胶带自动粘合工艺的胶带载体及其制造方法

    公开(公告)号：US4865193A

    公开(公告)日：1989-09-12

    申请号：US210086

    申请日：1988-06-22

    申请人： Haruo Shimamoto ,  Tetsuya Ueda

    发明人： Haruo Shimamoto ,  Tetsuya Ueda

    IPC分类号： H01L21/60 ,  H01L21/56 ,  H01L23/495

    CPC分类号： H01L24/50 ,  H01L21/565 ,  H01L23/49572 ,  H01L2924/01005 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/181

    摘要： A tape carrier utilized in the tape automated bonding of semiconductor chips is disclosed which comprises a polyimide tape-shaped film having apertures therein, and patterns of leads and reinforcing members formed on a surface of the film. The reinforcing members may be made of the same material as the leads, such as copper, and formed by a single photoetching process on the film. The reinforcing members are disposed on those areas of the film which lie outside of the leads and which are subjected to stress during the sealing of the semiconductor chips into a resinous mold subsequent to the inner lead bonding thereof. For example, the reinforcing members may be disposed in the lead supporting zones of the film, or around the corners of the outer-lead apertures. The reinforcing members reduces the stresses exerted on the leads during the molding of the chips, so that the deformations thereof during the same process are minimized.

    摘要翻译： 公开了一种用于半导体芯片的带自动接合的带载体，其包括其中具有孔的聚酰亚胺带状膜，以及形成在膜的表面上的引线和加强件的图案。 加强构件可以由诸如铜的引线相同的材料制成，并且通过在膜上的单次光刻工艺形成。 加强构件设置在位于引线外部的膜的那些区域上，并且在将半导体芯片密封到其内部引线接合之后的树脂模具中时受到应力。 例如，加强构件可以设置在膜的引线支撑区域中或者围绕外引线孔的角部。 加强构件减小了在芯片成型期间施加在引线上的应力，使得在相同工艺期间其变形最小化。

    Semiconductor card which can be folded
    20.
    发明授权
    Semiconductor card which can be folded 失效
    可折叠的半导体卡

    公开(公告)号：US4849617A

    公开(公告)日：1989-07-18

    申请号：US26967

    申请日：1987-03-17

    申请人： Tetsuya Ueda

    发明人： Tetsuya Ueda

    IPC分类号： B42D15/02 ,  B42D15/10 ,  G06K19/04 ,  G06K19/077

    CPC分类号： G06K19/04 ,  G06K19/077

    摘要： A thin semiconductor card, such as an IC card, includes a card main body, and a semiconductor module mounted therein. A foldable part or member is provided permitting the card main body to be folded.

    摘要翻译： 诸如IC卡的薄半导体卡包括卡主体和安装在其中的半导体模块。 设置可折叠部件或构件以允许卡主体折叠。