Process to remove metal contamination on a glass substrate
    13.
    发明授权
    Process to remove metal contamination on a glass substrate 失效
    去除玻璃基板上的金属污染的过程

    公开(公告)号:US08333843B2

    公开(公告)日:2012-12-18

    申请号:US12424954

    申请日:2009-04-16

    申请人: Fang Mei David Tanner

    发明人: Fang Mei David Tanner

    IPC分类号: C23G1/02 B08B3/00

    摘要: The present disclosure relates to methods and related cleaning solutions (116) for cleaning a glass substrate (10, 112), such as for removing metal ion contaminates from a glass substrate (10, 112) having a transparent conductive oxide layer (12). One method includes: providing a glass substrate (10, 112) having a transparent conductive oxide (TCO) layer (12); and exposing the glass substrate (10, 112) to a cleaning solution (116) that includes 0.5% to 5% organic acid, wherein the organic acid used includes citric acid, acetic acid, or oxalic acid.

    摘要翻译: 本公开涉及用于清洁玻璃基板(10,112)的方法和相关清洁溶液(116),例如用于从具有透明导电氧化物层(12)的玻璃基板(10,112)去除金属离子污染物。 一种方法包括:提供具有透明导电氧化物(TCO)层(12)的玻璃基板(10,112); 并将玻璃基板(10,112)暴露于包含0.5%至5%有机酸的清洗溶液(116)中,其中所用的有机酸包括柠檬酸,乙酸或草酸。

    THIN FILM SCRIBE PROCESS
    19.
    发明申请
    THIN FILM SCRIBE PROCESS 失效
    薄膜筛选工艺

    公开(公告)号:US20100068835A1

    公开(公告)日:2010-03-18

    申请号:US12212535

    申请日:2008-09-17

    IPC分类号: H01L21/66

    摘要: A method and apparatus for improving a thin film scribing procedure is presented. Embodiments of the invention include a method and apparatus for determining a scribe setting for removal of an absorber layer of a photovoltaic device that improves contact resistance between a back contact layer and a front contact layer of the device.

    摘要翻译: 提出了一种改善薄膜划线程序的方法和装置。 本发明的实施例包括一种用于确定用于去除光电装置的吸收层的划线设置的方法和装置,其改善了设备背面接触层和前接触层之间的接触电阻。