公开(公告)号：US07947999B2

公开(公告)日：2011-05-24

申请号：US11616161

申请日：2006-12-26

申请人： Taizo Tomioka ,  Takahiro Suzuki ,  Hiroyuki Tokubo ,  Yukinori Aoki

发明人： Taizo Tomioka ,  Takahiro Suzuki ,  Hiroyuki Tokubo ,  Yukinori Aoki

IPC分类号： H01L33/00

CPC分类号： H01L33/486 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/10253 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A luminescent device including a die pad lead composed of an inner lead and an outer lead, a case for uniting the inner lead, a light emitting diode chip mounted on a first predetermined position of one main surface of the inner lead, and a transparent sealing material portion for sealing the light emitting diode chip and a part of the one main surface. The case seals the inner lead other than an area sealed by the transparent sealing material portion, and the inner lead of the die pad lead has bending portions at least two places including a first bending portion and a second bending portion. A rear of the first predetermined position in the inner lead of the die pad lead is exposed outside the case, and the second bending portion is formed in the case so that the outer lead extends from a side of the case.

摘要翻译： 一种发光装置，包括由内引线和外引线构成的管芯焊盘引线，用于连接内引线的壳体，安装在内引线的一个主表面的第一预定位置上的发光二极管芯片和透明密封 用于密封发光二极管芯片的材料部分和一个主表面的一部分。 壳体密封除了由透明密封材料部分密封的区域以外的内部引线，并且芯片焊盘引线的内部引线具有包括第一弯曲部分和第二弯曲部分的至少两个位置的弯曲部分。 芯片焊盘引线的内引线中的第一预定位置的后部暴露在壳体的外部，并且第二弯曲部分形成在壳体中，使得外引线从壳体的一侧延伸。

公开(公告)号：US07510911B2

公开(公告)日：2009-03-31

申请号：US10876016

申请日：2004-06-25

申请人： Taizo Tomioka ,  Kazuo Shimokawa

发明人： Taizo Tomioka ,  Kazuo Shimokawa

IPC分类号： H01L21/00 ,  H01L23/10 ,  H01L23/34

CPC分类号： H01L25/072 ,  H01L23/3121 ,  H01L23/36 ,  H01L23/492 ,  H01L23/49861 ,  H01L24/37 ,  H01L24/40 ,  H01L24/84 ,  H01L24/91 ,  H01L25/0655 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/16 ,  H01L2224/371 ,  H01L2224/37147 ,  H01L2224/40225 ,  H01L2224/73153 ,  H01L2224/73253 ,  H01L2224/83104 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/13091 ,  H01L2924/15151 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014

摘要： A semiconductor device comprises a plurality of semiconductor chips each having a surface bonded to a wiring board and being electrically connected thereto, a plurality of metal plates each having a one-end portion bonded to the other surface of each of the plurality of semiconductor chips and having an other-end portion bonded to the wiring board to make electric connection therebetween, thermoplastic resin which seals the metal plates integrally as one body, such that a surface opposing the surface bonded to the semiconductor chip, of each of the metal plates, is exposed to outside, and thermosetting resin which seals an outer peripheral portion of the thermoplastic resin, and the semiconductor chips.

摘要翻译： 一种半导体器件包括多个半导体芯片，每个半导体芯片的表面接合到布线板并与其电连接;多个金属板，每个金属板的一端部分接合到多个半导体芯片的每一个的另一个表面; 具有与所述布线板接合以形成电连接的另一端部，将与所述金属板的与所述半导体芯片接合的表面相对的表面与所述金属板一体地一体地密封的热塑性树脂为 暴露于外部，以及密封热塑性树脂的外周部分的热固性树脂和半导体芯片。

公开(公告)号：US06861675B2

公开(公告)日：2005-03-01

申请号：US10606762

申请日：2003-06-27

申请人： Taizo Tomioka ,  Ikuo Mori ,  Kenji Ito ,  Mutsumi Suematsu ,  Yasuhito Saito ,  Masayuki Arakawa

发明人： Taizo Tomioka ,  Ikuo Mori ,  Kenji Ito ,  Mutsumi Suematsu ,  Yasuhito Saito ,  Masayuki Arakawa

IPC分类号： H01L25/16 ,  H01L31/167 ,  H01L31/12

CPC分类号： H01L31/167 ,  H01L25/167 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/48471 ,  H01L2924/12041 ,  H01L2924/13091 ,  H01L2924/00014 ,  H01L2924/00

摘要： An optically coupled semiconductor device according to the present invention comprises a mount electrode and a wire electrode which are formed on a top main face of the first wiring substrate, a light-emitting element is electrically connected to the mount electrode and the wire electrode, a first electrode pad and a second electrode pad which are provided on the top main face of the second wiring substrate in such a manner as to sandwich the opening formed in the second wiring substrate, a photo-receptor element which is arranged in such a manner as to block the opening formed in the second wiring substrate and which is connected to the first electrode pad so as to face the light-emitting element, and a switching element which is connected to the second electrode pad so as to face the wire.

摘要翻译： 根据本发明的光耦合半导体器件包括安装电极和线电极，其形成在第一布线基板的顶部主面上，发光元件电连接到安装电极和线电极， 第一电极焊盘和第二电极焊盘，其以形成在第二布线基板中的开口的方式设置在第二布线基板的顶部主面上;光接收元件，其布置成 阻止形成在第二布线基板上并与第一电极焊盘相对的开口以面向发光元件;以及开关元件，其与第二电极焊盘相对以面对导线。

公开(公告)号：US20120070720A1

公开(公告)日：2012-03-22

申请号：US13204818

申请日：2011-08-08

申请人： Takahiro AIZAWA ,  Yukihiro Ikeya ,  Taizo Tomioka

发明人： Takahiro AIZAWA ,  Yukihiro Ikeya ,  Taizo Tomioka

IPC分类号： H01M2/02 ,  B23K20/10

CPC分类号： H01M2/30 ,  B23K20/10 ,  B23K2101/38 ,  B23K2103/10 ,  H01M2/263

摘要： The present invention provides a battery including a container, an electrode group including a positive electrode and a negative electrode, multiple current collecting tabs being extended from any one of the positive electrode and the negative electrode of the electrode group, and overlapped with one another; a lead bonded to at least one of the current collecting tabs by ultrasonic bonding, a lid configured to close an opening portion of the container, and an external terminal provided on the lid and connected to the at least one current collecting tab via the lead, in which the lead has a cross-sectional area that is increased in a middle of extension of the lead from an ultrasonic-bonded portion to the at least one of the current collecting tabs to the external terminal.

摘要翻译： 本发明提供一种电池，包括容器，包括正极和负极的电极组，从电极组的正电极和负电极中的任一个延伸的多个电流收集片，彼此重叠; 通过超声波接合与至少一个电流收集片接合的引线，构造成封闭容器的开口部分的盖子和设置在盖子上的外部端子，并经由引线连接到至少一个集流片， 其中所述引线的横截面面积在所述引线从超声波接合部分延伸到所述至少一个所述集流突片到所述外部端子的中间增加。

公开(公告)号：US20100195291A1

公开(公告)日：2010-08-05

申请号：US12695536

申请日：2010-01-28

申请人： Akiya KIMURA ,  Taizo Tomioka ,  Takahiro Aizawa

发明人： Akiya KIMURA ,  Taizo Tomioka ,  Takahiro Aizawa

IPC分类号： H05K1/18 ,  H05K3/30

CPC分类号： H05K1/0218 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/19105 ,  H05K1/181 ,  H05K3/284 ,  H05K9/0024 ,  H05K2201/10522 ,  Y10T29/4913 ,  H01L2224/0401

摘要： An electronic circuit module includes a plurality of electronic parts mounted on a substrate, the space separating the electronic parts being filled with thermosetting insulating resin, the insulating resin being covered by metal foil so as to expose the profiles and the heights of the electronic parts, the outer periphery of the metal foil being electrically connected to a grounding electrode arranged on the substrate by means of a conductive material.

摘要翻译： 电子电路模块包括安装在基板上的多个电子部件，分隔充满热固性绝缘树脂的电子部件的空间，绝缘树脂被金属箔覆盖，以暴露电子部件的型材和高度， 金属箔的外周通过导电材料与布置在基板上的接地电极电连接。

公开(公告)号：US07683394B2

公开(公告)日：2010-03-23

申请号：US11854280

申请日：2007-09-12

申请人： Taizo Tomioka

发明人： Taizo Tomioka

IPC分类号： H01L29/227 ,  H01L29/207

CPC分类号： H01L33/60 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/45144 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/181 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： An optical semiconductor device includes: a base substrate which has a concave portion; a light-emitting element which is provided in the concave portion, and which emits light; a prevention member which is provided to the base substrate in a manner of covering a side surface of the concave portion, and which prevents the light emitted by the light-emitting element from being incident on the side surface of the concave portion; and a translucent member which is provided in the concave portion, and which seals the light-emitting element.

摘要翻译： 一种光学半导体器件，包括：具有凹部的基底; 发光元件，设置在所述凹部中，发光; 防止部件，其以覆盖所述凹部的侧面的方式设置到所述基底基板，并且防止由所述发光元件发射的光入射到所述凹部的侧面; 以及设置在所述凹部中并且密封所述发光元件的半透明构件。

公开(公告)号：US20050029651A1

公开(公告)日：2005-02-10

申请号：US10876016

申请日：2004-06-25

申请人： Taizo Tomioka ,  Kazuo Shimokawa

发明人： Taizo Tomioka ,  Kazuo Shimokawa

IPC分类号： H01L23/34 ,  H01L21/56 ,  H01L23/31 ,  H01L23/36 ,  H01L23/492 ,  H01L23/498 ,  H01L25/04 ,  H01L25/065 ,  H01L25/07 ,  H01L25/18 ,  H01L21/44 ,  H01L21/50 ,  H01L23/28

CPC分类号： H01L25/072 ,  H01L23/3121 ,  H01L23/36 ,  H01L23/492 ,  H01L23/49861 ,  H01L24/37 ,  H01L24/40 ,  H01L24/84 ,  H01L24/91 ,  H01L25/0655 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/16 ,  H01L2224/371 ,  H01L2224/37147 ,  H01L2224/40225 ,  H01L2224/73153 ,  H01L2224/73253 ,  H01L2224/83104 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/13091 ,  H01L2924/15151 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014

摘要： A semiconductor device comprises a plurality of semiconductor chips each having a surface bonded to a wiring board and being electrically connected thereto, a plurality of metal plates each having a one-end portion bonded to the other surface of each of the plurality of semiconductor chips and having an other-end portion bonded to the wiring board to make electric connection therebetween, thermoplastic resin which seals the metal plates integrally as one body, such that a surface opposing the surface bonded to the semiconductor chip, of each of the metal plates, is exposed to outside, and thermosetting resin which seals an outer peripheral portion of the thermoplastic resin, and the semiconductor chips.

摘要翻译： 一种半导体器件包括多个半导体芯片，每个半导体芯片的表面接合到布线板并与其电连接;多个金属板，每个金属板的一端部分接合到多个半导体芯片的每一个的另一个表面; 具有与所述布线板接合以形成电连接的另一端部，将与所述金属板的与所述半导体芯片接合的表面相对的表面与所述金属板一体地一体地密封的热塑性树脂为 暴露于外部，以及密封热塑性树脂的外周部分的热固性树脂和半导体芯片。