公开(公告)号：US20120017979A1

公开(公告)日：2012-01-26

申请号：US13185038

申请日：2011-07-18

申请人： Kazumasa Igarashi ,  Yuki Hasegawa

发明人： Kazumasa Igarashi ,  Yuki Hasegawa

IPC分类号： H01L31/0224 ,  H01L51/44

CPC分类号： H01G9/20 ,  H01G9/2077 ,  Y02E10/542

摘要： A dye-sensitized solar cell is provided, which includes a seal member that is free from swelling and degradation during prolonged sealing use and highly excellent in sealability. The dye-sensitized solar cell includes: a pair of electrode substrates spaced a predetermined distance from each other with their electrically conductive electrode surfaces facing inward; a seal member disposed along peripheries of inner surfaces of the electrode substrates to seal a space between the electrode substrates; and an electrolyte solution filled in the sealed space. The seal member is composed of a material cured by photopolymerizing the following photopolymerizable composition (A), and the electrode substrates each have a portion coated with a (meth)acryloxyalkylsilane silane coupling agent in contact with the seal member. The photopolymerizable composition (A) contains a hydrogenated elastomer derivative having at least one (meth)acryloyl group at at least one of its opposite molecular terminals.

摘要翻译： 提供了一种染料敏化太阳能电池，其包括密封构件，其在长时间密封使用期间不会膨胀和降解，并且密封性极好。 染料敏化太阳能电池包括：一对彼此隔开预定距离的电极基板，其导电电极表面向内; 密封构件，其沿着所述电极基板的内表面设置，以密封所述电极基板之间的空间; 以及填充在密封空间中的电解液。 密封构件由通过光聚合下述光聚合性组合物（A）固化的材料构成，电极基板各自具有与密封构件接触的涂覆有（甲基）丙烯酰氧基烷基硅烷偶联剂的部分。 光聚合性组合物（A）含有在其相对的分子末端中的至少一个具有至少一个（甲基）丙烯酰基的氢化弹性体衍生物。

公开(公告)号：US20100193972A1

公开(公告)日：2010-08-05

申请号：US12303856

申请日：2006-06-06

申请人： Kazumi Yamamoto ,  Masaharu Abe ,  Shigehisa Yamamoto ,  Kazushi Nishimoto ,  Tomohiro Dote ,  Kazumasa Igarashi ,  Kazuhiro Ikemura ,  Takuya Eto ,  Masataka Tada ,  Katsumi Okayama ,  Kaoru Kato

发明人： Kazumi Yamamoto ,  Masaharu Abe ,  Shigehisa Yamamoto ,  Kazushi Nishimoto ,  Tomohiro Dote ,  Kazumasa Igarashi ,  Kazuhiro Ikemura ,  Takuya Eto ,  Masataka Tada ,  Katsumi Okayama ,  Kaoru Kato

IPC分类号： H01L23/29 ,  C08K3/10 ,  C08K3/36

CPC分类号： C01G49/0018 ,  C01G49/0063 ,  C01G49/0072 ,  C01P2002/32 ,  C01P2002/50 ,  C01P2004/32 ,  C01P2004/51 ,  C01P2004/53 ,  C01P2004/61 ,  C01P2006/12 ,  C01P2006/14 ,  C01P2006/22 ,  C01P2006/42 ,  C01P2006/80 ,  C04B35/2625 ,  C04B35/265 ,  C04B35/6263 ,  C04B35/62655 ,  C04B35/62675 ,  C04B35/62685 ,  C04B35/62695 ,  C04B2235/3206 ,  C04B2235/3262 ,  C04B2235/3279 ,  C04B2235/3281 ,  C04B2235/3284 ,  C04B2235/528 ,  C04B2235/5409 ,  C04B2235/5436 ,  C04B2235/5445 ,  C04B2235/5472 ,  C04B2235/763 ,  C04B2235/79 ,  C08G59/621 ,  C08L63/00 ,  C09C1/24 ,  H01L23/295 ,  H01L23/3107 ,  H01L23/3128 ,  H01L23/552 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  Y10T428/2982 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A resin composition for semiconductor encapsulation having good moldability, of which the cured product has effective electromagnetic wave shieldability, is provided. A resin composition for semiconductor encapsulation, containing spherical sintered ferrite particles having the following properties (a) to (c) : (a) the soluble ion content of the particles is at most 5 ppm; (b) the mean particle size of the particles is from 10 to 50 μm; (c) the crystal structure of the particles by X-ray diffractiometry is a spinel structure.

摘要翻译： 提供了具有良好成型性的半导体封装用树脂组合物，其固化物具有有效的电磁波屏蔽性。 一种半导体封装用树脂组合物，含有具有以下特性（a）〜（c）的球状烧结铁氧体颗粒：（a）颗粒的可溶性离子含量为5ppm以下， （b）颗粒的平均粒度为10〜50μm; （c）通过X射线衍射法测定的颗粒的晶体结构是尖晶石结构。

公开(公告)号：US20090130432A1

公开(公告)日：2009-05-21

申请号：US12350764

申请日：2009-01-08

申请人： Hirofumi FUJII ,  Yoshio Terada ,  Kazumasa Igarashi

发明人： Hirofumi FUJII ,  Yoshio Terada ,  Kazumasa Igarashi

IPC分类号： B32B27/06

CPC分类号： C08G73/1025 ,  C08G73/10 ,  C08K3/04 ,  C08K5/3432 ,  C08L79/08 ,  G03F7/0387 ,  Y10T428/254 ,  Y10T428/2822 ,  Y10T428/31663

摘要： The present invention provides a low-modulus low-stress resin which has such heat resistance that cohesive force and reliability can be retained even at high temperatures and which is applicable as various functional materials.The resin is a thermoplastic resin having a modulus of elasticity at room temperature, 25° C., of 1 GPa or lower and a modulus of elasticity at 250° C. of 1 MPa or higher, or a precursor resin thereof.

摘要翻译： 本发明提供一种低模量低应力树脂，其具有这样的耐热性，即使在高温下也可以保持内聚力和可靠性，并且可用作各种功能材料。 树脂是在室温，25℃，1GPa以下的弹性模量和250℃下的弹性模量为1MPa以上的热塑性树脂或其前体树脂。

公开(公告)号：US07352069B2

公开(公告)日：2008-04-01

申请号：US10540863

申请日：2003-12-24

申请人： Ichiro Hazeyama ,  Masahiro Kubo ,  Sakae Kitajo ,  Koji Matsui ,  Kazumasa Igarashi ,  Hiroshi Noro

发明人： Ichiro Hazeyama ,  Masahiro Kubo ,  Sakae Kitajo ,  Koji Matsui ,  Kazumasa Igarashi ,  Hiroshi Noro

IPC分类号： H01L23/29

CPC分类号： H01L23/293 ,  H01L21/563 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83192 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01073 ,  H01L2924/01076 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/0132 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/10253 ,  H01L2924/15787 ,  H01L2924/1579 ,  H01L2924/19042 ,  H01L2924/351 ,  Y02P20/582 ,  H01L2924/00 ,  H01L2924/0665 ,  H01L2924/00012 ,  H01L2224/0401

摘要： An object of the present invention is to provide an electronic part device which can be repaired even in the case of an electronic part device having a malfunction in electrical connection after carrying out underfill.The present invention is an electronic part device in which a semiconductor element (flip chip) (3) is mounted on a wiring circuit substrate (1) under such a state that an electrode part for connection (joint ball) disposed on the semiconductor element (flip chip) (3) and a circuit electrode (5) disposed on the wiring circuit substrate (1) are facing with each other. In addition, the gap between the wiring circuit substrate (1) and the semiconductor element (flip chip) (3) is filled by a filling resin layer (4) comprising a liquid epoxy resin composition which comprises the following component (D) and the following components (A) to (C). (A) A liquid epoxy resin. (B) A curing agent. (C) An N,N,N′,N′-tetra-substituted fluorine-containing aromatic diamine compound. (D) A carboxylic acid vinyl ether addition product.

摘要翻译： 本发明的目的是提供一种电子零件装置，即使在进行底部填充之后，在具有电连接故障的电子部件装置的情况下也能够进行维修。 本发明是一种电子部件装置，其中半导体元件（倒装芯片）（3）安装在布线电路基板（1）上，该状态使得设置在半导体元件上的连接用电极部（接合球） 倒装芯片）（3）和设置在布线电路基板（1）上的电路电极（5）彼此面对。 此外，布线电路基板（1）与半导体元件（倒装芯片）（3）之间的间隙由包含液体环氧树脂组合物的填充树脂层（4）填充，该液体环氧树脂组合物包含以下组分（D）和 以下组分（A）至（C）。 （A）液体环氧树脂。 （B）固化剂。 （C）N，N，N'，N'-四取代的含氟芳族二胺化合物。 （D）羧酸乙烯基醚加成物。

公开(公告)号：US4520075A

公开(公告)日：1985-05-28

申请号：US654517

申请日：1984-09-25

申请人： Kazumasa Igarashi ,  Katsuhiko Yamaguchi ,  Kazuo Iko ,  Kazuyuki Miki

发明人： Kazumasa Igarashi ,  Katsuhiko Yamaguchi ,  Kazuo Iko ,  Kazuyuki Miki

IPC分类号： C08G73/10

CPC分类号： C08G73/106 ,  Y10T428/31623 ,  Y10T428/31663 ,  Y10T428/31721 ,  Y10T428/31725

摘要： A siloxane-modified polyimide precursor which can be converted into a polyimide having excellent adhesion and moisture resistance is produced by simultaneously polymerizing a diaminosiloxane and a diamine containing no silicon atoms in its molecule with 3,3',4,4'-biphenyltetracarboxylic dianhydride, wherein the diaminosiloxane is used in an amount of 1 to 4 mole % per mole of the total diamino compounds and such that the silicon content in the final reaction product is 0.5 wt % or less. The thus obtained precursor solution is further heat aged to reduce the molecular weight of the precursor so that solution viscosity is decreased to a proper level suitable for coating operation.

摘要翻译： 通过在其分子中同时聚合二氨基硅氧烷和不含硅原子的二胺与3,3'，4,4'-联苯四羧酸二酐同时聚合可以转化为具有优异的粘合性和耐湿性的聚酰亚胺的硅氧烷改性的聚酰亚胺前体， 其中所述二氨基硅氧烷的用量为每摩尔全部二氨基化合物1至4摩尔％，并且使得最终反应产物中的硅含量为0.5重量％或更少。 由此获得的前体溶液进一步加热老化以降低前体的分子量，使得溶液粘度降低到适合于涂覆操作的适当水平。

公开(公告)号：US4499252A

公开(公告)日：1985-02-12

申请号：US594063

申请日：1984-03-28

申请人： Kazumasa Igarashi ,  Katsuhiko Yamaguchi ,  Munekazu Tanaka

发明人： Kazumasa Igarashi ,  Katsuhiko Yamaguchi ,  Munekazu Tanaka

IPC分类号： C08G73/10

CPC分类号： C08G73/106

摘要： A process for producing a polyimide precursor having excellent adhesion property and improved moisture resistance by polymerization of an organic tetracarboxylic acid component and a diamine is disclosed. A portion of the organic tetracarboxylic acid is reacted with an aminosilane compound in which H in an amino group is substituted with a monovalent organic group containing a hydrophobic aromatic ring, to produce a silane-modified polycarboxylic acid component and the resulting silane-modified polycarboxylic acid component is polymerized with a diamine together with the residual organic tetracarboxylic acid component.

摘要翻译： 公开了一种通过有机四羧酸组分和二胺的聚合制备具有优异的粘附性和改善的耐湿性的聚酰亚胺前体的方法。 将一部分有机四羧酸与氨基中的H被含有疏水性芳环的一价有机基团取代的氨基硅烷化合物反应，得到硅烷改性的多元羧酸成分，得到的硅烷改性多元羧酸 组分与残余的有机四羧酸组分一起与二胺聚合。

公开(公告)号：US08802547B2

公开(公告)日：2014-08-12

申请号：US13552719

申请日：2012-07-19

申请人： Akinobu Kakimoto ,  Satoshi Takagi ,  Kazumasa Igarashi

发明人： Akinobu Kakimoto ,  Satoshi Takagi ,  Kazumasa Igarashi

IPC分类号： H01L21/00 ,  H01L21/02

CPC分类号： H01L21/02664 ,  H01L21/0245 ,  H01L21/02532 ,  H01L21/02592 ,  H01L21/0262

摘要： A method of forming an amorphous silicon film includes: forming a seed layer on a surface of a base by heating the base and supplying an amino silane-based gas to the heated base, forming the amorphous silicon film with thickness for layer growth on the seed layer by heating the base and supplying a silane-based gas containing no amino group to the seed layer on the surface of the heated base, and decreasing a film thickness of the amorphous silicon film by etching the amorphous silicon film formed with thickness for layer growth.

摘要翻译： 形成非晶硅膜的方法包括：通过加热基底并向加热的基底供应氨基硅烷基气体，在基底的表面上形成种子层，形成具有种子厚度的非晶硅膜 通过加热基底并将不含氨基的硅烷系气体供给到加热基材的表面上的种子层，并且通过蚀刻形成有层生长厚度的非晶硅膜来降低非晶硅膜的膜厚度 。

公开(公告)号：US20110041914A1

公开(公告)日：2011-02-24

申请号：US12990027

申请日：2009-04-22

申请人： Yuki Hasegawa ,  Kazumasa Igarashi ,  Kenichi Hiwatashi ,  Naoto Masuyama

发明人： Yuki Hasegawa ,  Kazumasa Igarashi ,  Kenichi Hiwatashi ,  Naoto Masuyama

IPC分类号： H01L31/0216 ,  H01L31/02

CPC分类号： H01M14/005 ,  H01G9/2031 ,  H01G9/2059 ,  H01G9/2077 ,  H01M2/08 ,  H01M2/26 ,  Y02E10/542

摘要： A dye-sensitized solar cell is provided, which includes: a pair of electrode substrates (1,1′) bonded to each other with a seal member (7) with their electrically conductive electrode surfaces facing inward, one of the electrode substrates being opaque or translucent, the other electrode substrate being transparent; and an electrolyte solution contained therein. The seal member (7) is composed of a material cured by photopolymerizing a photopolymerizable composition essentially comprising a hydrogenated elastomer derivative having at least one (meth)acryloyl group at least one of its opposite molecular terminals, and the electrode substrates (1, 1′) each have a portion coated with a silane coupling agent of a (meth)acryloxyalkylsilane in contact with the seal member (7). Therefore, the dye-sensitized solar cell has higher adhesive sealability and excellent durability.

摘要翻译： 提供了一种染料敏化太阳能电池，其包括：一对电极基板（1,1'），其密封部件（7）彼此接合，导电电极表面朝内，其中一个电极基板是不透明的 或半透明，另一电极基板是透明的; 和其中包含的电解质溶液。 密封构件（7）由通过光聚合组合物固化的材料构成，所述光致聚合组合物基本上包含具有至少一个相对分子末端的至少一个（甲基）丙烯酰基的氢化弹性体衍生物和电极基底（1,1' ）各自具有涂覆有与密封构件（7）接触的（甲基）丙烯酰氧基烷基硅烷的硅烷偶联剂的部分。 因此，染料敏化太阳能电池具有更高的粘合密封性和优异的耐久性。

公开(公告)号：US20070293597A1

公开(公告)日：2007-12-20

申请号：US11665772

申请日：2005-10-19

申请人： Hirofumi Fujii ,  Yoshio Terada ,  Kazumasa Igarashi

发明人： Hirofumi Fujii ,  Yoshio Terada ,  Kazumasa Igarashi

IPC分类号： C08G73/10 ,  C08L79/08

CPC分类号： C08G73/1025 ,  C08G73/10 ,  C08K3/04 ,  C08K5/3432 ,  C08L79/08 ,  G03F7/0387 ,  Y10T428/254 ,  Y10T428/2822 ,  Y10T428/31663

摘要： The present invention provides a low-modulus low-stress resin which has such heat resistance that cohesive force and reliability can be retained even at high temperatures and which is applicable as various functional materials. The resin is a thermoplastic resin having a modulus of elasticity at room temperature, 25° C., of 1 GPa or lower and a modulus of elasticity at 250° C. of 1 MPa or higher, or a precursor resin thereof.

摘要翻译： 本发明提供一种低模量低应力树脂，其具有这样的耐热性，即使在高温下也可以保持内聚力和可靠性，并且可用作各种功能材料。 树脂是在室温，25℃，1GPa以下的弹性模量和250℃下的弹性模量为1MPa以上的热塑性树脂或其前体树脂。

公开(公告)号：US07034405B2

公开(公告)日：2006-04-25

申请号：US10165394

申请日：2002-06-07

申请人： Junichi Toyoda ,  Katsumi Okayama ,  Kazumasa Igarashi

发明人： Junichi Toyoda ,  Katsumi Okayama ,  Kazumasa Igarashi

IPC分类号： H01L23/29

CPC分类号： H01L23/3121 ,  H01L23/295 ,  H01L23/552 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/48247 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/0102 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A resin component for encapsulating a semiconductor includes magnetic powder and silica powder whose average particle diameter is smaller than the average particle diameter of the magnetic powder. Thus, the curing body of the resin component for encapsulating a semiconductor has an electromagnetic wave shielding function by the magnetic powder. Since the spaces of the magnetic powder are filled with the silica powder whose average particle diameter is small, the moldability of the curing body is improved and the insulating characteristics thereof are enhanced. Such a resin component for encapsulating a semiconductor is employed, there can be produced a preferably formed and encapsulated semiconductor device having the electromagnetic wave shielding function and having no malfunction generated due to leakage current from a semiconductor element.