公开(公告)号：US08217501B2

公开(公告)日：2012-07-10

申请号：US12789456

申请日：2010-05-28

申请人： Hyeog Chan Kwon ,  Hyun Joung Kim ,  Jae Chang Kim ,  Taeg Ki Lim ,  Jong Wook Ju

发明人： Hyeog Chan Kwon ,  Hyun Joung Kim ,  Jae Chang Kim ,  Taeg Ki Lim ,  Jong Wook Ju

IPC分类号： H01L23/02

CPC分类号： H01L25/105 ,  H01L21/561 ,  H01L21/565 ,  H01L23/562 ,  H01L2224/32225 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/1815 ,  H01L2924/3511

摘要： A method of manufacture of an integrated circuit package system includes: providing a substrate with a top surface; configuring the top surface to include electrical contacts; attaching an integrated circuit to the top surface; and depositing a material to prevent warpage of the substrate on the top surface of the substrate and over the integrated circuit, the material patterned to have discrete hollow conduits that are over and larger than the electrical contacts.

摘要翻译： 集成电路封装系统的制造方法包括：向基板提供顶表面; 配置顶表面以包括电触点; 将集成电路连接到顶表面; 并且沉积材料以防止衬底在衬底的顶表面上和集成电路上的翘曲，该图案化的材料具有超过和大于电触点的离散中空导管。

公开(公告)号：US07443037B2

公开(公告)日：2008-10-28

申请号：US11278421

申请日：2006-04-01

申请人： Hyun Joung Kim ,  Jong Wook Ju ,  Taeg Ki Lim

发明人： Hyun Joung Kim ,  Jong Wook Ju ,  Taeg Ki Lim

IPC分类号： H01L23/52 ,  H01L23/48 ,  H01L29/40

CPC分类号： H01L25/0657 ,  H01L23/3128 ,  H01L24/33 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/1134 ,  H01L2224/1308 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2224/4899 ,  H01L2224/73265 ,  H01L2224/83139 ,  H01L2224/83191 ,  H01L2224/83194 ,  H01L2224/83856 ,  H01L2224/85051 ,  H01L2224/85399 ,  H01L2225/0651 ,  H01L2225/06575 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01014 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/4554

摘要： A stacked integrated circuit package system is provided connecting an interconnect between a first integrated circuit device and a substrate, the first integrated circuit device on the substrate, applying a protective dot on the first integrated circuit device, mounting a second integrated circuit device, having an adhesive, on the protective dot, with the adhesive on the first integrated circuit device, connecting the second integrated circuit device and the substrate, and encapsulating the first integrated circuit device, the second integrated circuit device, and the interconnect.

摘要翻译： 提供连接第一集成电路器件和衬底之间的互连的堆叠集成电路封装系统，衬底上的第一集成电路器件，在第一集成电路器件上施加保护点，安装第二集成电路器件， 在第一集成电路器件上的粘合剂上粘合在保护点上，连接第二集成电路器件和衬底，并封装第一集成电路器件，第二集成电路器件和互连。

公开(公告)号：US20070296086A1

公开(公告)日：2007-12-27

申请号：US11762055

申请日：2007-06-12

申请人： Jong Wook Ju ,  Taeg Ki Lim ,  Hyun Joung Kim

发明人： Jong Wook Ju ,  Taeg Ki Lim ,  Hyun Joung Kim

IPC分类号： H01L23/52

CPC分类号： H01L23/3128 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/03 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/05554 ,  H01L2224/16 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1052 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/10161 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package system is provided including mounting a first integrated circuit device over a carrier, mounting a second integrated circuit device having an adhesive spacer over the first integrated circuit device in an offset configuration, connecting a first internal interconnect between the carrier and the first integrated circuit device with the first internal interconnect within the adhesive spacer, connecting a second internal interconnect between the carrier and the second integrated circuit device, and encapsulating the first integrated circuit device, the second integrated circuit device, the first internal interconnect and the second internal interconnect.

摘要翻译： 提供了一种集成电路封装系统，包括将第一集成电路器件安装在载体上，将具有粘合隔离物的第二集成电路器件以偏移配置安装在第一集成电路器件上，连接载体和第一器件之间的第一内部互连 集成电路装置，其中所述第一内部互连在所述粘合剂间隔件内，连接所述载体和所述第二集成电路装置之间的第二内部互连，并且封装所述第一集成电路装置，所述第二集成电路装置，所述第一内部互连和所述第二内部互连 互连。

公开(公告)号：US20090001613A1

公开(公告)日：2009-01-01

申请号：US11768790

申请日：2007-06-26

申请人： Ja Eun Yun ,  Jong Wook Ju

发明人： Ja Eun Yun ,  Jong Wook Ju

IPC分类号： H01L23/28

CPC分类号： H01L23/3121 ,  H01L23/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L25/0657 ,  H01L2224/05553 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/32057 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/4899 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/83385 ,  H01L2224/83856 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/06575 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

摘要： An integrated circuit package system comprising: forming a substrate having a solder mask with a support structure formed from the solder mask; mounting a first integrated circuit device over the support structure; connecting the substrate and the first integrated circuit device; and encapsulating the first integrated circuit device and the support structure.

摘要翻译： 一种集成电路封装系统，包括：形成具有由所述焊接掩模形成的支撑结构的焊料掩模的衬底; 在支撑结构上安装第一集成电路装置; 连接所述基板和所述第一集成电路装置; 并封装第一集成电路器件和支撑结构。

公开(公告)号：US08569882B2

公开(公告)日：2013-10-29

申请号：US13071397

申请日：2011-03-24

申请人： WonJun Ko ,  Sungmin Song ,  Jong Wook Ju ,  JaEun Yun ,  Hye Ran Lee

发明人： WonJun Ko ,  Sungmin Song ,  Jong Wook Ju ,  JaEun Yun ,  Hye Ran Lee

IPC分类号： H01L23/34

CPC分类号： H01L25/105 ,  H01L24/73 ,  H01L25/03 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/1005 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/0401

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a base substrate; mounting a central integrated circuit over the base substrate; mounting a side package having a side package substrate along a peripheral region of the base substrate and laterally peripheral to the central integrated circuit with the side package substrate coplanar with the central integrated circuit; and encapsulating the central integrated circuit and the side package above the base substrate with a base encapsulation to form a planar surface over the central integrated circuit and the side package facing away from the base substrate.

摘要翻译： 一种制造集成电路封装系统的方法，包括：提供基底; 在基底基板上安装中央集成电路; 沿着所述基底基板的周边区域安装具有侧封装基板的侧封装，并且所述侧封装具有与所述中央集成电路共面的侧封装基板的中央集成电路的横向周边; 并且用基底封装将中央集成电路和侧封装封装在基底衬底之上，以在中心集成电路和侧封装背面上形成平面，背面远离基底。

公开(公告)号：US08415204B2

公开(公告)日：2013-04-09

申请号：US12412315

申请日：2009-03-26

申请人： JaEun Yun ,  Jong Wook Ju ,  WonJun Ko ,  Hye Ran Lee

发明人： JaEun Yun ,  Jong Wook Ju ,  WonJun Ko ,  Hye Ran Lee

IPC分类号： H01L21/00

CPC分类号： H01L23/3733 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49827 ,  H01L2224/16 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/3025 ,  H01L2224/0401

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a package substrate; mounting an integrated circuit die on the package substrate; and attaching a heat spreader assembly, having a thermal adhesive layer formed therein, to the package substrate and the integrated circuit die.

摘要翻译： 一种集成电路封装系统的制造方法，包括：提供封装基板; 将集成电路管芯安装在封装衬底上; 以及将其中形成有热粘合剂层的散热器组件附接到封装基板和集成电路管芯。

公开(公告)号：US20100244236A1

公开(公告)日：2010-09-30

申请号：US12412315

申请日：2009-03-26

申请人： JaEun Yun ,  Jong Wook Ju ,  WonJun Ko ,  Hye Ran Lee

发明人： JaEun Yun ,  Jong Wook Ju ,  WonJun Ko ,  Hye Ran Lee

IPC分类号： H01L23/34 ,  H01L21/50

CPC分类号： H01L23/3733 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49827 ,  H01L2224/16 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/3025 ,  H01L2224/0401

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a package substrate; mounting an integrated circuit die on the package substrate; and attaching a heat spreader assembly, having a thermal adhesive layer formed therein, to the package substrate and the integrated circuit die.

摘要翻译： 一种集成电路封装系统的制造方法，包括：提供封装基板; 将集成电路管芯安装在封装衬底上; 以及将其中形成有热粘合剂层的散热器组件附接到封装基板和集成电路管芯。

公开(公告)号：US20120241980A1

公开(公告)日：2012-09-27

申请号：US13071397

申请日：2011-03-24

申请人： WonJun Ko ,  Sungmin Song ,  Jong Wook Ju ,  JaEun Yun ,  Hye Ran Lee

发明人： WonJun Ko ,  Sungmin Song ,  Jong Wook Ju ,  JaEun Yun ,  Hye Ran Lee

IPC分类号： H01L25/065 ,  H01L21/98

CPC分类号： H01L25/105 ,  H01L24/73 ,  H01L25/03 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/1005 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/0401

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a base substrate; mounting a central integrated circuit over the base substrate; mounting a side package having a side package substrate along a peripheral region of the base substrate and laterally peripheral to the central integrated circuit with the side package substrate coplanar with the central integrated circuit; and encapsulating the central integrated circuit and the side package above the base substrate with a base encapsulation to form a planar surface over the central integrated circuit and the side package facing away from the base substrate.

摘要翻译： 一种制造集成电路封装系统的方法，包括：提供基底; 在基底基板上安装中央集成电路; 沿着所述基底基板的周边区域安装具有侧封装基板的侧封装，并且所述侧封装具有与所述中央集成电路共面的侧封装基板的中央集成电路的横向周边; 并且用基底封装将中央集成电路和侧封装封装在基底衬底之上，以在中心集成电路和侧封装背面上形成平面，背面远离基底。

公开(公告)号：US07763961B2

公开(公告)日：2010-07-27

申请号：US11278420

申请日：2006-04-01

申请人： Seung Wook Park ,  Jong Wook Ju

发明人： Seung Wook Park ,  Jong Wook Ju

IPC分类号： H01L23/02

CPC分类号： H01L23/3128 ,  H01L23/49816 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/49 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06541 ,  H01L2225/06555 ,  H01L2225/06586 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A hybrid stacking package system is provided including providing a board-on-chip substrate, having an opening, attaching a first integrated circuit on the board-on-chip substrate, attaching bond wires, between the first integrated circuit and the board-on-chip substrate, through the opening, and mounting a second integrated circuit over the bond wires.

摘要翻译： 提供了一种混合堆叠封装系统，包括：提供一个片上芯片基板，具有开口，将第一集成电路连接在片上基板上，在第一集成电路和板上基板之间安装结合线， 通过开口，并在接合线上安装第二集成电路。

公开(公告)号：US20080136006A1

公开(公告)日：2008-06-12

申请号：US11608827

申请日：2006-12-09

申请人： Ki Youn Jang ,  Jong-Woo Ha ,  Jong Wook Ju

发明人： Ki Youn Jang ,  Jong-Woo Ha ,  Jong Wook Ju

IPC分类号： H01L23/02

CPC分类号： H01L25/0657 ,  H01L23/3128 ,  H01L23/3135 ,  H01L24/48 ,  H01L24/73 ,  H01L25/03 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/06589 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/19107 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/48247 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A stacked integrated circuit package-in-package system is provided including forming a substrate having a top surface and a bottom surface, mounting a first device over the top surface, stacking a second device over the first device in an offset configuration, connecting a first internal interconnect between the first device and the bottom surface, connecting a second internal interconnect between the second device and the bottom surface, and encapsulating the first device and the second device.

摘要翻译： 提供了一种堆叠集成电路封装包装系统，包括形成具有顶表面和底表面的基板，将第一装置安装在顶表面上方，以第一装置在偏移构造中堆叠第二装置，连接第一 在第一装置和底表面之间的内部互连，在第二装置和底表面之间连接第二内部互连，并封装第一装置和第二装置。