摘要:
A method of forming a metal plug, comprising the following steps. An etched dielectric layer, over a conductive layer, over a semiconductor structure are provided. The etched dielectric layer having a via hole and an exposed periphery. The etched dielectric layer is treated with at least one alkaline earth element source to form an in-situ metal barrier layer within the dielectric layer exposed periphery. A metal plug is formed within the via hole wherein the in-situ metal barrier layer prevents diffusion of the metal from the metal plug into the dielectric oxide layer.
摘要:
A method of bonding a bonding element to a metal bonding pad comprises the following steps. A semiconductor structure having an exposed, recessed metal bonding pad within a layer opening is provided. The layer has an upper surface. A conductive cap having a predetermined thickness is formed over the metal bonding pad. A bonding element is bonded to the conductive cap to form an electrical connection with the metal bonding pad.
摘要:
A method of forming a boron carbide layer for use as a barrier and an etch-stop layer in a copper dual damascene structure, and the structure itself are disclosed. In addition to providing a good barrier to copper diffusion, good insulating properties, high etch selectivity with respect to dielectric insulators, boron carbide also provides good electrical characteristics because of its low dielectric constant of less than 5. The amorphous boron carbide is formed in a PECVD chamber by introducing a boron source gas such as B2H6, B5H9+, and carbon source gas such as CH4 and C2H6 at a deposition temperature of about 400° C. Any one, or any combination of the passivation, etch-stop, cap layers of the damascene structure can comprise boron carbide.
摘要:
A method of removing copper contamination from a semiconductor wafer, comprising the following steps. A semiconductor wafer having copper contamination thereon is provided. An oxidizing radical containing downstream plasma is provided from a first source (alternatively halogen (F2, Cl2, or Br2) may be used as on oxidizing agent). A vaporized chelating agent is provided from a second source. The oxidizing radical containing downstream plasma and vaporized chelating agent are mixed to form an oxidizing radical containing downstream plasma/vaporized chelating agent mixture. The mixture is directed to the copper contamination so that the mixture reacts with the copper contamination to form a volatile product. The volatile product is removed from the proximity of the wafer.
摘要:
A method of fabricating trenches has been achieved. The method may be applied to damascene and dual damascene contacts to prevent damage to organic low dielectric constant materials due to photoresist ashing. A semiconductor substrate is provided. A first dielectric layer is deposited overlying the semiconductor substrate. A first etch stopping layer is deposited overlying the first dielectric layer. A second etch stopping layer is deposited overlying the first etch stopping layer. An optional anti-reflective coating is applied. A photoresist layer is deposited. The photoresist layer is patterned to define openings for planned trenches. The second etch stopping layer is etched through to form a hard mask for the planned trenches. The photoresist layer is stripped away by ashing where the first etch stopping layer protects the first dielectric layer from damage due to the presence of oxygen radicals. The first etch stopping layer is etched through to complete the trenches, and the integrated circuit device is completed.
摘要:
It is the general object of the present invention to provide an improved method of fabricating semiconductor integrated circuit devices, specifically by describing an improved process of fabricating multilevel metal structures using low dielectric constant materials. The present invention relates to an improved processing methods for stable and planar intermetal dielectrics, with low dielectric constants. The first embodiment uses a stabilizing adhesion layer between the bottom, low dielectric constant layer and the top dielectric layer. The advantages are: (i) improved adhesion and stability of the low dielectric layer and the top dielectric oxide (ii) over all layer thickness of the dielectric layers can be reduced, hence lowering the parasitic capacitance of these layers. In the second embodiment, the method uses a multi-layered “hard mask” on metal interconnect lines with a silicon oxynitride DARC, dielectric anti-reflective coating on top of metal. A double coating scheme of low dielectric constant insulators are used in this application. The third embodiment uses a hard mask stack over the interconnect metal lines, with a silicon oxynitride DARC costing on top of metal, and an adhesion layer between the low dielectric material and the top dielectric layer.
摘要:
FIG. 1 is a perspective view of a camera lens showing our new design; FIG. 2 is a front elevation view thereof; FIG. 3 is a rear elevation view thereof; FIG. 4 is a left side elevation view thereof; FIG. 5 is a right side elevation view thereof; FIG. 6 is a top plan view thereof; FIG. 7 is a bottom plan view thereof; and, FIG. 8 is an enlarged portion view taken from encircled portion labeled, “FIG. 8,” in FIG. 2. The dashed-dot lines illustrate the boundary of the enlarged portion view of FIG. 8 shown in FIGS. 2 and 8 and form no part of the claimed design. The even dashed broken lines in the figures show portions of the camera lens which form no part of the claimed design.
摘要:
The invention discloses a novel LCD projector, comprising an imaging system with single-light path system for LCD projector time-division display, a lighting system with PCS (P light converted into S light) function, a three-primary-colors LED light source with microlenses, and a heat dissipation system with dust-proof and self-cleaning function; the monochrome LCD screen of the imaging system has a high light transmittance and resolution, achieving higher brightness and resolution; the lighting part has a polarized light conversion function, which converts the useless P light into useful S light, improving the light utilization and increasing the brightness; a transparent antifouling coating is applied on the optical components of the heat dissipation system to reduce dust adsorption; ultrasonic vibrators are mounted on the optical components to shake off the dust attached; the light source uses the microlens to converge the three-primary-color LED light source to improve light efficiency and uniformity.
摘要:
The invention discloses a novel projector, comprising a sealed shell of electronic projector, an illumination system and a LED light source system, wherein the sealed shell is provided with an optical and internal circulation cooling assembly inside by area; the optical assembly comprises the projector working assembly. The invention is inside a sealed shell; the cold air far below normal temperature generated by semiconductor refrigeration piece takes away the heat on optical device, improving the heat dissipation efficiency. Simultaneously, because the cold air is inside a sealed shell, the optical device can be placed in a dust-free environment. The polarized light conversion prism converts the useless P light in conventional projector imagining into the useful S light, improving the light utilization, and increasing the brightness of projection at the same power. The LED light source is collimated by the collimating lens to meet PCS conversion requirement for polarized light converter.
摘要:
The general problem of pattern change discovery between high-dimensional data sets is addressed by considering the notion of the principal angles between the subspaces is introduced to measure the subspace difference between two high-dimensional data sets. Current methods either mainly focus on magnitude change detection of low-dimensional data sets or are under supervised frameworks. Principal angles bear a property to isolate subspace change from the magnitude change. To address the challenge of directly computing the principal angles, matrix factorization is used to serve as a statistical framework and develop the principle of the dominant subspace mapping to transfer the principal angle based detection to a matrix factorization problem. Matrix factorization can be naturally embedded into the likelihood ratio test based on the linear models. The method may be unsupervised and addresses the statistical significance of the pattern changes between high-dimensional data sets.