公开(公告)号：US20120038969A1

公开(公告)日：2012-02-16

申请号：US13013407

申请日：2011-01-25

申请人： Boum Seock Kim ,  Seung Gyo Jeong ,  Eun Tae Park

发明人： Boum Seock Kim ,  Seung Gyo Jeong ,  Eun Tae Park

IPC分类号： G02F1/167 ,  H05K3/00

CPC分类号： G02F1/167 ,  G02F2001/133394 ,  G02F2001/1672 ,  Y10T29/49124

摘要： There are provided an electronic paper display device and a method for manufacturing the same. The electronic paper display device includes a first substrate having a first electrode made of transparent material and formed thereon; a second substrate arranged opposite to the first substrate with a predetermined space and having a second electrode formed thereon; a display element layer formed between the first substrate and the second substrate and having a plurality of display elements arranged thereon, the display elements having optical characteristics changed by voltage applied to the first and second electrodes; and vibration parts formed on the first substrate or the second substrate and configured to apply vibrations to the display elements by the voltage applied to the first and second electrodes.

摘要翻译： 提供了一种电子纸显示装置及其制造方法。 电子纸显示装置包括：第一基板，具有由透明材料制成并形成在其上的第一电极; 第二衬底，其布置成与所述第一衬底相对，具有预定的空间并且具有形成在其上的第二电极; 显示元件层，形成在所述第一基板和所述第二基板之间并且具有布置在其上的多个显示元件，所述显示元件具有由施加到所述第一和第二电极的电压而改变的光学特性; 以及形成在所述第一基板或所述第二基板上并且被配置为通过施加到所述第一和第二电极的电压对所述显示元件施加振动的振动部件。

公开(公告)号：US20120091861A1

公开(公告)日：2012-04-19

申请号：US13075970

申请日：2011-03-30

申请人： Boum Seock KIM ,  Eun Tae Park ,  Seung Gyo Jeong ,  Sahn Nahm ,  Chan Hee Nam

发明人： Boum Seock KIM ,  Eun Tae Park ,  Seung Gyo Jeong ,  Sahn Nahm ,  Chan Hee Nam

IPC分类号： H01L41/187 ,  H01L41/24

CPC分类号： H01L41/1875 ,  H01L41/083 ,  H01L41/273 ,  H01L41/43 ,  Y10T29/42

摘要： The present invention relates to a ceramic composition for a piezoelectric actuator and a piezoelectric actuator comprising the same. The ceramic composition for piezoelectric actuator includes a piezoelectric ceramic powder expressed by a Chemical Formula: (1-x)Pb(Zr(1-y)Tiy)O3-xPb(Ni1/3Nb2/3)O3, wherein x is 0.25 to 0.4 and y is 0.4 to 0.7; and a CuO powder and a PbO powder forming a liquid-phase compound at a sintering temperature or less of the piezoelectric ceramic powder. The ceramic composition for a piezoelectric actuator according to the present invention exhibits excellent piezoelectric characteristics and allows for low-temperature firing.

摘要翻译： 本发明涉及一种用于压电致动器的陶瓷组合物和包括该陶瓷组合物的压电致动器。 用于压电致动器的陶瓷组合物包括由化学式：（1-x）Pb（Zr（1-y）Tiy）O3-xPb（Ni1 / 3Nb2 / 3）O3表示的压电陶瓷粉末，其中x为0.25至0.4 y为0.4〜0.7; 以及在压电陶瓷粉末的烧结温度以下形成液相化合物的CuO粉末和PbO粉末。 根据本发明的用于压电致动器的陶瓷组合物显示出优异的压电特性并允许低温烧制。

公开(公告)号：US20120037588A1

公开(公告)日：2012-02-16

申请号：US12926745

申请日：2010-12-07

申请人： Boum Seock Kim ,  Seung Gyo Jeong ,  Eun Tae Park

发明人： Boum Seock Kim ,  Seung Gyo Jeong ,  Eun Tae Park

IPC分类号： B65D1/02

CPC分类号： B65D39/00 ,  B65D2539/001

摘要： Disclosed herein is a piezoelectric sealing cap, including: a piezoelectric element generating displacement by a driving voltage; and a sealing part formed to surround the piezoelectric element and sealing a bottle neck when the piezoelectric element is inserted into the bottle neck.

摘要翻译： 本发明公开了一种压电密封盖，包括：通过驱动电压产生位移的压电元件; 以及当所述压电元件插入所述瓶颈时，形成为围绕所述压电元件并密封瓶颈的密封部。

公开(公告)号：US20110091640A1

公开(公告)日：2011-04-21

申请号：US12973557

申请日：2010-12-20

申请人： Jin Waun KIM ,  Seung Gyo Jeong

发明人： Jin Waun KIM ,  Seung Gyo Jeong

IPC分类号： H05K3/10 ,  B05D5/12 ,  H01L21/288

CPC分类号： C25D3/02 ,  B32B18/00 ,  C04B37/026 ,  C04B2237/12 ,  C04B2237/123 ,  C04B2237/124 ,  C04B2237/125 ,  C04B2237/32 ,  C04B2237/40 ,  C04B2237/403 ,  C04B2237/405 ,  C04B2237/408 ,  C04B2237/62 ,  C04B2237/68 ,  C23C18/1603 ,  C25D5/02 ,  H05K1/0306 ,  H05K3/1291 ,  H05K3/225 ,  H05K3/4061 ,  H05K3/42 ,  H05K3/429 ,  H05K2203/1126 ,  H05K2203/173 ,  Y10T428/24322

摘要： A method of manufacturing a non-shrinking ceramic substrate according to an aspect of the invention may include: preparing a ceramic laminate having a via electrode therein; firing the ceramic laminate so that a void is formed at the interface between the via electrode and the ceramic laminate; and performing plating to fill the void with a conductive material.

摘要翻译： 根据本发明的一个方面的制造无收缩陶瓷基板的方法可以包括：制备其中具有通孔电极的陶瓷层压体; 烧结陶瓷层压体，使得在通孔电极和陶瓷层压体之间的界面处形成空隙; 并进行电镀以用导电材料填充空隙。

公开(公告)号：US20100098905A1

公开(公告)日：2010-04-22

申请号：US12475318

申请日：2009-05-29

申请人： Jin Waun KIM ,  Seung Gyo Jeong

发明人： Jin Waun KIM ,  Seung Gyo Jeong

IPC分类号： C25D5/54 ,  B05D1/18 ,  B32B3/10

CPC分类号： C25D3/02 ,  B32B18/00 ,  C04B37/026 ,  C04B2237/12 ,  C04B2237/123 ,  C04B2237/124 ,  C04B2237/125 ,  C04B2237/32 ,  C04B2237/40 ,  C04B2237/403 ,  C04B2237/405 ,  C04B2237/408 ,  C04B2237/62 ,  C04B2237/68 ,  C23C18/1603 ,  C25D5/02 ,  H05K1/0306 ,  H05K3/1291 ,  H05K3/225 ,  H05K3/4061 ,  H05K3/42 ,  H05K3/429 ,  H05K2203/1126 ,  H05K2203/173 ,  Y10T428/24322

摘要： A method of manufacturing a non-shrinking ceramic substrate according to an aspect of the invention may include: preparing a ceramic laminate having a via electrode therein; firing the ceramic laminate so that a void is formed at the interface between the via electrode and the ceramic laminate; and performing plating to fill the void with a conductive material.

摘要翻译： 根据本发明的一个方面的制造无收缩陶瓷基板的方法可以包括：制备其中具有通孔电极的陶瓷层压体; 烧结陶瓷层压体，使得在通孔电极和陶瓷层压体之间的界面处形成空隙; 并进行电镀以用导电材料填充空隙。

公开(公告)号：US20100096178A1

公开(公告)日：2010-04-22

申请号：US12478524

申请日：2009-06-04

申请人： Jin Waun KIM ,  Seung Gyo Jeong

发明人： Jin Waun KIM ,  Seung Gyo Jeong

IPC分类号： H05K1/11 ,  H05K3/42

CPC分类号： H05K3/4061 ,  H05K1/0306 ,  H05K3/4629 ,  H05K2201/09454 ,  H05K2201/096 ,  H05K2201/09909 ,  Y10T29/49163

摘要： A non-shrinkage ceramic substrate includes: a ceramic laminated body formed by laminating a plurality of green sheets; an electrode part including a via electrode penetratingly formed at the ceramic laminated body and an outer electrode formed on a surface of the ceramic laminated body and electrically connected with the via electrode; and an interface part formed between the ceramic laminated body and the electrode part to prevent an electrical connection between the electrodes from weakening.

摘要翻译： 非收缩陶瓷基板包括：通过层压多个生片形成的陶瓷层叠体; 包括在陶瓷层叠体上贯通地形成的通孔电极的电极部件和形成在陶瓷层叠体的表面并与通孔电极电连接的外部电极; 以及形成在陶瓷层叠体和电极部之间的界面部，以防止电极之间的电连接变弱。

公开(公告)号：US06627966B2

公开(公告)日：2003-09-30

申请号：US09853592

申请日：2001-05-14

申请人： Seung Gyo Jeong ,  Ji Hwan Shin

发明人： Seung Gyo Jeong ,  Ji Hwan Shin

IPC分类号： H03H942

CPC分类号： H01L23/10 ,  C04B37/026 ,  C04B37/028 ,  C04B2237/12 ,  C04B2237/408 ,  C04B2237/74 ,  H01L21/50 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/01079 ,  H01L2924/07802 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/16195 ,  H01L2924/163 ,  H01L2924/16315 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00015

摘要： In a method and a device for sealing a ceramic package of a SAW (Surface Acoustic Wave) filter, when making a ceramic package of an environmentally sensitive SAW filter such as a SAW duplexer filter or a SAW filter, a first sealing is carried out between a ceramic main body and a metal case so as to protect the chip component, and then, a second sealing is carried out also between the metal case and the ceramic main body again, so that the shielding effect against external electromagnetic fields would be superior, and so that costs are reduced and so that a workability improvement can be realized, and so that the sealing can be made more secure. The first sealing is carried out on a step that is formed on the top of the ceramic main body to bond the metal case thereupon. The second sealing is carried out on the top of the ceramic main body to bond the metal case on the ceramic main body.

摘要翻译： 在用于密封SAW（表面声波）滤波器的陶瓷封装的方法和装置中，当制造诸如SAW双工器滤波器或SAW滤波器的环境敏感的SAW滤波器的陶瓷封装时，首先密封在 陶瓷主体和金属壳体，以保护芯片部件，然后再次在金属壳体和陶瓷主体之间进行第二密封，使得对外部电磁场的屏蔽效果将优异， 并且因此降低成本，并且可以实现可操作性的提高，并且能够使密封更可靠。 第一密封是在形成在陶瓷主体的顶部上的步骤上进行的，以将金属壳体接合在其上。 在陶瓷主体的顶部进行第二次密封，将金属壳体接合在陶瓷主体上。

公开(公告)号：US08080737B2

公开(公告)日：2011-12-20

申请号：US12342907

申请日：2008-12-23

申请人： Seung Gyo Jeong

发明人： Seung Gyo Jeong

IPC分类号： H05K1/09

CPC分类号： B32B37/12 ,  B32B2038/047 ,  B32B2305/80 ,  B32B2309/02 ,  B32B2311/02 ,  B32B2315/02 ,  B32B2315/08 ,  B32B2457/08 ,  G01R1/07378 ,  H05K1/0306 ,  H05K3/1291 ,  H05K3/4629 ,  H05K2203/061 ,  H05K2203/1126 ,  H05K2203/1476

摘要： Provided are a ceramic substrate, a method of manufacturing the same, and an electrical device using the same. A ceramic substrate includes a first laminated body, a second laminated body and an adhesive part. The first laminated body includes a predetermined electrode formed therein. The second laminated body is laminated on and electrically connected to the first laminated body. Also, the adhesive part is intervened between the first laminated body and the second laminated body to adhere the first and second laminated bodies through interfacial reaction.

摘要翻译： 提供一种陶瓷基板，其制造方法和使用该陶瓷基板的电气装置。 陶瓷基板包括第一层叠体，第二层叠体和粘合部。 第一层叠体包括形成在其中的预定电极。 第二层叠体层叠在第一层叠体上并电连接。 此外，粘合剂部分介于第一层压体和第二层压体之间，以通过界面反应粘合第一和第二层压体。