Thin film magnetic head
    11.
    发明授权
    Thin film magnetic head 失效
    薄膜磁头

    公开(公告)号:US5113300A

    公开(公告)日:1992-05-12

    申请号:US752220

    申请日:1991-08-21

    CPC classification number: G11B5/31 G11B5/3116

    Abstract: A thin film magnetic head which includes a substrate of magnetic or nonmagnetic material, an upper magnetic film on the substrate, a coil conductor on the substrate, and a lower magnetic film on the substrate, the lower magnetic film having a groove formed therein for receiving the coil conductor therein. In the preferred form of the present invention, the thickness of the lower magnetic film is at least 0.3 times the thickness of the upper magnetic film when the substrate is composed of a magnetic material and at least 0.8 times the thickness of the upper magnetic film when the substrate is composed of a nonmagnetic material.

    Abstract translation: 一种薄膜磁头,其包括磁性或非磁性材料的衬底,衬底上的上部磁性膜,衬底上的线圈导体和衬底上的下部磁性膜,下部磁性膜具有形成在其中的槽,用于接收 其中的线圈导体。 在本发明的优选形式中,当基板由磁性材料构成时,下部磁性膜的厚度为上部磁性膜的厚度的至少0.3倍,并且当上部磁性膜的厚度为至少0.8倍时 基板由非磁性材料构成。

    Electromagnetic wave suppression sheet, device, and electronic apparatus
    13.
    发明授权
    Electromagnetic wave suppression sheet, device, and electronic apparatus 失效
    电磁波抑制片,器件和电子设备

    公开(公告)号:US08377340B2

    公开(公告)日:2013-02-19

    申请号:US12630971

    申请日:2009-12-04

    CPC classification number: H05K9/0083

    Abstract: Disclosed is an electromagnetic wave suppression sheet obtained by mixing metallic magnetic particles into a resin and formed into a sheet shape. In the electromagnetic wave suppression sheet, a coercive force is 320 [A/m] or more and a saturation magnetization is 0.35 [Wb/m2] or more at a time when an external magnetic field of 1 kOe in an in-plane direction is applied.

    Abstract translation: 公开了一种通过将金属磁性颗粒混合成树脂并形成为片状而获得的电磁波抑制片。 在电磁波抑制片中,当在面内方向上的1kOe的外部磁场为(E)的情况下,矫顽力为320 [A / m]以上,饱和磁化强度为0.35 [Wb / m 2] 应用。

    Method of fabricating a semiconductor device
    14.
    发明授权
    Method of fabricating a semiconductor device 有权
    制造半导体器件的方法

    公开(公告)号:US07585706B2

    公开(公告)日:2009-09-08

    申请号:US11898951

    申请日:2007-09-18

    Abstract: The semiconductor device of this invention includes an active region formed from a group III nitride semiconductor grown on a substrate and an insulating oxide film formed in a peripheral portion of the active region by oxidizing the group III nitride semiconductor. On the active region, a gate electrode in Schottky contact with the active region extending onto the insulating oxide film and having an extended portion on the insulating oxide film is formed, and ohmic electrodes respectively serving as a source electrode and a drain electrode are formed with space from side edges along the gate length direction of the gate electrode.

    Abstract translation: 本发明的半导体器件包括由在衬底上生长的III族氮化物半导体形成的有源区和通过氧化III族氮化物半导体而形成在有源区的周边部分中的绝缘氧化物膜。 在有源区域上,形成与延伸到绝缘氧化膜上并在绝缘氧化膜上具有延伸部分的有源区肖特基接触的栅电极,分别用作源电极和漏电极的欧姆电极形成有 沿着栅电极的栅极长度方向的侧边缘的空间。

    Semiconductor device having an active region formed from group III nitride
    15.
    发明授权
    Semiconductor device having an active region formed from group III nitride 有权
    具有由III族氮化物形成的有源区的半导体器件

    公开(公告)号:US07285806B2

    公开(公告)日:2007-10-23

    申请号:US09813304

    申请日:2001-03-21

    Abstract: The semiconductor device of this invention includes an active region formed from a group III nitride semiconductor grown on a substrate and an insulating oxide film formed in a peripheral portion of the active region by oxidizing the group III nitride semiconductor. On the active region, a gate electrode in Schottky contact with the active region extending onto the insulating oxide film and having an extended portion on the insulating oxide film is formed, and ohmic electrodes respectively serving as a source electrode and a drain electrode are formed with space from side edges along the gate length direction of the gate electrode.

    Abstract translation: 本发明的半导体器件包括由在衬底上生长的III族氮化物半导体形成的有源区和通过氧化III族氮化物半导体而形成在有源区的周边部分中的绝缘氧化物膜。 在有源区域上,形成与延伸到绝缘氧化膜上并在绝缘氧化膜上具有延伸部分的有源区肖特基接触的栅电极,分别用作源电极和漏电极的欧姆电极形成有 沿着栅电极的栅极长度方向的侧边缘的空间。

    Semisonductor device
    17.
    发明申请
    Semisonductor device 审中-公开
    半导体装置

    公开(公告)号:US20050006664A1

    公开(公告)日:2005-01-13

    申请号:US10909425

    申请日:2004-08-03

    CPC classification number: H01L29/7783 H01L29/2003

    Abstract: A semiconductor device includes an AlGaN film formed on a GaN film on a substrate, a gate electrode formed on the AlGaN film, and source and drain electrodes formed on either side of the gate electrode on the AlGaN film. An n-type InxGayAl1-x-yN film is interposed between the source and drain electrodes and the AlGaN film. Alternatively, the semiconductor device includes an n-type InxGayAl1-x-yN film formed on a GaN film on a substrate, a gate electrode formed on the InxGayAl1-x-yN film, and source and drain electrodes formed on either side of the gate electrode on the InxGayAl1-x-yN film.

    Abstract translation: 半导体器件包括形成在基板上的GaN膜上的AlGaN膜,形成在AlGaN膜上的栅电极,以及形成在AlGaN膜上的栅电极的两侧的源极和漏极。 在源电极和漏电极和AlGaN膜之间插入n型In x Ga y Al 1-x-y N膜。 或者,半导体器件包括形成在衬底上的GaN膜上的n型In x Ga y Al 1-x-y N膜,形成在In x Ga y Al 1-x-y N膜上的栅电极,以及形成在栅极两侧的源极和漏极 InxGayAl1-x-yN膜上的电极。

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