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19 条记录 (耗时 0.022 秒)

    Heat-Radiating Substrate and Method Of Manufacturing The Same
    11.
    发明申请
    Heat-Radiating Substrate and Method Of Manufacturing The Same 有权
    热辐射基板及其制造方法

    公开(公告)号：US20120127666A1

    公开(公告)日：2012-05-24

    申请号：US13007545

    申请日：2011-01-14

    申请人： Ji Hyun PARK ,  Seog Moon CHOI ,  Young Ki LEE

    发明人： Ji Hyun PARK ,  Seog Moon CHOI ,  Young Ki LEE

    IPC分类号： H05K7/20 ,  H05K1/00 ,  H05K3/00 ,  C23C28/00 ,  C25D7/00

    CPC分类号： H05K1/053 ,  H05K2201/09745

    摘要： Disclosed herein are a heat-radiating substrate and a method of manufacturing the same. The heat-radiating substrate includes: a base substrate with a heat sink, having a groove; an insulating layer formed on the base substrate by performing anodization thereon; and a circuit layer formed on the insulating layer, whereby the heat-radiating substrate with the heat-sink, made of metal material, is manufactured, thereby making it possible to protect devices weak against heat and thus solve the problem in view of reduced life span and degraded reliability.

    摘要翻译： 这里公开了散热基板及其制造方法。 散热基板包括：具有散热器的基底，具有凹槽; 绝缘层，其通过在其上进行阳极氧化而形成在所述基底基板上; 以及形成在绝缘层上的电路层，由此制造具有由金属材料制成的散热器的散热基板，从而可以保护弱热的器件，从而解决了降低寿命的问题 跨度和可靠性降低。

    LIGHT EMITTING MODULE AND METHOD OF MANUFACTURING THE SAME
    12.
    发明申请
    LIGHT EMITTING MODULE AND METHOD OF MANUFACTURING THE SAME 审中-公开
    发光模块及其制造方法

    公开(公告)号：US20120001544A1

    公开(公告)日：2012-01-05

    申请号：US12904512

    申请日：2010-10-14

    申请人： Tae Hoon KIM ,  Sang Hyun SHIN ,  Cheol Ho HEO ,  Young Ki LEE ,  Ji Hyun PARK ,  Ki Ho SEO

    发明人： Tae Hoon KIM ,  Sang Hyun SHIN ,  Cheol Ho HEO ,  Young Ki LEE ,  Ji Hyun PARK ,  Ki Ho SEO

    IPC分类号： H01J7/44 ,  H01J9/00

    CPC分类号： H01L25/167 ,  H01L27/3276 ,  H01L27/3288 ,  H01L33/641 ,  H01L51/529 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K3/445 ,  H05K2201/10106 ,  H05K2201/10128 ,  H05K2203/0315 ,  H01L2924/00

    摘要： Disclosed are a light emitting module and a method of manufacturing the light emitting module. The light emitting module includes: a heat radiating substrate which includes a metal substrate with through holes, an internal insulating layer formed along inner walls of the through holes, and an external insulating layer covering all outer surfaces of the metal substrate; a light emitting component unit disposed on a top surface of the heat radiating substrate; a driving circuit unit which is electrically connected to the light emitting component unit, and is mounted on the heat radiating substrate to apply a driving signal to the light emitting component unit; a passive component which is mounted on the heat radiating substrate and is electrically connected to the driving circuit unit; and circuit wiring layers which are disposed on a top and a bottom of the heat radiating substrate, respectively, and are interconnected therebetween through vias formed on the through holes with the internal insulating layer of the heat radiating substrate, and play a role of electrical interconnection of the driving circuit unit and the light emitting component unit, or the driving circuit unit and the passive component.

    摘要翻译： 公开了发光模块和制造发光模块的方法。 发光模块包括：散热基板，其包括具有通孔的金属基板，沿着通孔的内壁形成的内部绝缘层，以及覆盖金属基板的所有外表面的外部绝缘层; 设置在散热基板的上表面上的发光部件单元; 驱动电路单元，其电连接到所述发光部件单元，并且安装在所述散热基板上以向所述发光部件单元施加驱动信号; 无源部件，其被安装在散热基板上并电连接到驱动电路单元; 以及电路布线层，其分别设置在散热基板的顶部和底部，并且通过形成在通孔上的通孔与散热基板的内部绝缘层相互连接，并且起到电互连的作用 驱动电路单元和发光部件单元，或者驱动电路单元和无源部件。

    ARROW FOR HUNTING
    14.
    发明申请
    ARROW FOR HUNTING 有权
    搜索引擎

    公开(公告)号：US20100279803A1

    公开(公告)日：2010-11-04

    申请号：US12770266

    申请日：2010-04-29

    申请人： Young Ki LEE

    发明人： Young Ki LEE

    IPC分类号： F42B6/08 ,  F42B6/06

    CPC分类号： F42B6/06 ,  F42B6/08

    摘要： Disclosed herein is an arrow for hunting. The arrow includes an arrow shaft having a predetermined length and including a nock on one end and a shaft threaded part in the other end. A plurality of feathers is positioned to be adjacent to the nock of the arrow shaft. A connector includes a connecting threaded part fastened to the shaft threaded part, a stopper, and a penetration threaded part. An arrowhead is connected to the connector in such a way as to be opposite to the connecting threaded part. A penetration rotary unit has a threaded part to be fastened to the penetration threaded part of the connector, is shorter than the penetration threaded part, and has wings. A spring is positioned between the stopper and the penetration rotary unit, and provides a restoring force to bias the penetration rotary unit toward the arrowhead.

    摘要翻译： 这里公开了一种狩猎的箭头。 箭头包括具有预定长度的箭头轴，并且在另一端包括一端的一个孔和一个轴螺纹部分。 多个羽毛被定位成与箭头轴的nock相邻。 连接器包括紧固到轴螺纹部分的连接螺纹部分，止动件和穿透螺纹部分。 箭头以与连接螺纹部分相对的方式连接到连接器。 穿透旋转单元具有要紧固到连接器的穿透螺纹部分的螺纹部分，比穿透螺纹部分短，并且具有翼部。 弹簧定位在止动器和穿透旋转单元之间，并且提供恢复力以将穿透旋转单元偏向箭头。

    POWER SEMICONDUCTOR MODULE
    16.
    发明申请
    POWER SEMICONDUCTOR MODULE 有权
    功率半导体模块

    公开(公告)号：US20130069108A1

    公开(公告)日：2013-03-21

    申请号：US13313713

    申请日：2011-12-07

    申请人： Young Ki LEE ,  Dong Soo SEO ,  Kwang Soo KIM ,  Young Hoon KWAK

    发明人： Young Ki LEE ,  Dong Soo SEO ,  Kwang Soo KIM ,  Young Hoon KWAK

    IPC分类号： H01L29/739

    CPC分类号： H01L23/4824 ,  H01L29/7393 ,  H01L2924/0002 ,  H01L2924/00

    摘要： Disclosed herein is a power semiconductor module including: a circuit board having gate, emitter, and collector patterns formed thereon; a first semiconductor chip mounted on the circuit board, having gate and emitter terminals each formed on one surface thereof, and having a collector terminal formed on the other surface thereof; a second semiconductor chip mounted on the first semiconductor chip, having a cathode terminal formed on one surface thereof, and having an anode terminal formed on the other surface thereof; a first conductive connection member having one end disposed between the collector terminal of the first semiconductor chip and the cathode terminal of the second semiconductor chip and the other end contacting the collector pattern of the circuit board; and a second conductive connection member having one end contacting the anode terminal of the second semiconductor chip and the other end contacting the emitter pattern of the circuit board.

    摘要翻译： 本文公开了一种功率半导体模块，包括：电路板，其上形成有栅极，发射极和集电极图案; 安装在所述电路板上的第一半导体芯片，在其一个表面上形成有栅极和发射极端子，并且在其另一个表面上形成集电极端子; 安装在所述第一半导体芯片上的第二半导体芯片，具有在其一个表面上形成的阴极端子，并且在其另一个表面上形成阳极端子; 第一导电连接构件，其一端设置在第一半导体芯片的集电极端子和第二半导体芯片的阴极端子之间，另一端接触电路板的集电体图案; 以及第二导电连接构件，其一端接触第二半导体芯片的阳极端子，另一端接触电路板的发射极图案。

    POWER MODULE PACKAGE
    17.
    发明申请
    POWER MODULE PACKAGE 有权
    电源模块封装

    公开(公告)号：US20130134571A1

    公开(公告)日：2013-05-30

    申请号：US13353128

    申请日：2012-01-18

    申请人： Kwang Soo KIM ,  Young Hoon KWAK ,  Young Ki LEE

    发明人： Kwang Soo KIM ,  Young Hoon KWAK ,  Young Ki LEE

    IPC分类号： H01L23/34

    CPC分类号： H01L23/473 ,  H01L25/072 ,  H01L25/162 ,  H01L2224/48091 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/00014 ,  H01L2924/00

    摘要： Disclosed herein is a power module package including: a first heat dissipation plate including a first flow path, a second flow path, and a third flow path which are sequentially formed, the first flow path and the third flow path being formed to have a step therebetween; and a second heat dissipation plate formed under the first heat dissipation plate, having one face and the other face, having a semiconductor device mounting groove formed in the one face thereof, and including a fourth flow path having one end connected to the second flow path and the other end connected to the third flow path, wherein a cooling material introduced through the first flow path is distributed to the third flow path and the fourth flow path based on the second flow path.

    摘要翻译： 本文公开了一种功率模块封装，包括：第一散热板，包括顺序地形成的第一流路，第二流路和第三流路，第一流路和第三流路形成为具有台阶 之间; 以及形成在所述第一散热板下方的第二散热板，具有一个面和另一个面，在其一个面上形成有半导体器件安装槽，并且包括第四流路，其一端连接到所述第二流路 并且另一端连接到第三流动路径，其中通过第一流动路径引入的冷却材料基于第二流动路径分配到第三流动路径和第四流动路径。