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    POWER SEMICONDUCTOR MODULE
    2.
    发明申请
    POWER SEMICONDUCTOR MODULE 有权
    功率半导体模块

    公开(公告)号：US20130069108A1

    公开(公告)日：2013-03-21

    申请号：US13313713

    申请日：2011-12-07

    申请人： Young Ki LEE ,  Dong Soo SEO ,  Kwang Soo KIM ,  Young Hoon KWAK

    发明人： Young Ki LEE ,  Dong Soo SEO ,  Kwang Soo KIM ,  Young Hoon KWAK

    IPC分类号： H01L29/739

    CPC分类号： H01L23/4824 ,  H01L29/7393 ,  H01L2924/0002 ,  H01L2924/00

    摘要： Disclosed herein is a power semiconductor module including: a circuit board having gate, emitter, and collector patterns formed thereon; a first semiconductor chip mounted on the circuit board, having gate and emitter terminals each formed on one surface thereof, and having a collector terminal formed on the other surface thereof; a second semiconductor chip mounted on the first semiconductor chip, having a cathode terminal formed on one surface thereof, and having an anode terminal formed on the other surface thereof; a first conductive connection member having one end disposed between the collector terminal of the first semiconductor chip and the cathode terminal of the second semiconductor chip and the other end contacting the collector pattern of the circuit board; and a second conductive connection member having one end contacting the anode terminal of the second semiconductor chip and the other end contacting the emitter pattern of the circuit board.

    摘要翻译： 本文公开了一种功率半导体模块，包括：电路板，其上形成有栅极，发射极和集电极图案; 安装在所述电路板上的第一半导体芯片，在其一个表面上形成有栅极和发射极端子，并且在其另一个表面上形成集电极端子; 安装在所述第一半导体芯片上的第二半导体芯片，具有在其一个表面上形成的阴极端子，并且在其另一个表面上形成阳极端子; 第一导电连接构件，其一端设置在第一半导体芯片的集电极端子和第二半导体芯片的阴极端子之间，另一端接触电路板的集电体图案; 以及第二导电连接构件，其一端接触第二半导体芯片的阳极端子，另一端接触电路板的发射极图案。

    POWER MODULE PACKAGE
    3.
    发明申请
    POWER MODULE PACKAGE 有权
    电源模块封装

    公开(公告)号：US20130134571A1

    公开(公告)日：2013-05-30

    申请号：US13353128

    申请日：2012-01-18

    申请人： Kwang Soo KIM ,  Young Hoon KWAK ,  Young Ki LEE

    发明人： Kwang Soo KIM ,  Young Hoon KWAK ,  Young Ki LEE

    IPC分类号： H01L23/34

    CPC分类号： H01L23/473 ,  H01L25/072 ,  H01L25/162 ,  H01L2224/48091 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/00014 ,  H01L2924/00

    摘要： Disclosed herein is a power module package including: a first heat dissipation plate including a first flow path, a second flow path, and a third flow path which are sequentially formed, the first flow path and the third flow path being formed to have a step therebetween; and a second heat dissipation plate formed under the first heat dissipation plate, having one face and the other face, having a semiconductor device mounting groove formed in the one face thereof, and including a fourth flow path having one end connected to the second flow path and the other end connected to the third flow path, wherein a cooling material introduced through the first flow path is distributed to the third flow path and the fourth flow path based on the second flow path.

    摘要翻译： 本文公开了一种功率模块封装，包括：第一散热板，包括顺序地形成的第一流路，第二流路和第三流路，第一流路和第三流路形成为具有台阶 之间; 以及形成在所述第一散热板下方的第二散热板，具有一个面和另一个面，在其一个面上形成有半导体器件安装槽，并且包括第四流路，其一端连接到所述第二流路 并且另一端连接到第三流动路径，其中通过第一流动路径引入的冷却材料基于第二流动路径分配到第三流动路径和第四流动路径。

    HEAT DISSIPATING CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
    9.
    发明申请
    HEAT DISSIPATING CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME 审中-公开
    散热电路板及其制造方法

    公开(公告)号：US20120273558A1

    公开(公告)日：2012-11-01

    申请号：US13540504

    申请日：2012-07-02

    申请人： Hye Sook SHIN ,  Seog Moon CHOI ,  Shan GAO ,  Chang Hyun LIM ,  Tae Hyun KIM ,  Young Ki LEE

    发明人： Hye Sook SHIN ,  Seog Moon CHOI ,  Shan GAO ,  Chang Hyun LIM ,  Tae Hyun KIM ,  Young Ki LEE

    IPC分类号： B23K1/20

    CPC分类号： H05K7/205 ,  H05K1/0209 ,  H05K1/0263 ,  H05K1/053 ,  H05K3/202 ,  H05K3/24 ,  H05K3/341 ,  H05K2201/066 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49155

    摘要： Disclosed is a heat dissipating circuit board, which includes a metal core including an insulating layer formed on the surface thereof, a circuit layer formed on the insulating layer and including a seed layer and a first circuit pattern, and a heat dissipating frame layer bonded onto the circuit layer using solder and having a second circuit pattern, and in which the heat dissipating frame layer is bonded onto the circuit layer not by a plating process but by using solder, thus reducing the cost and time of the plating process and relieving stress applied to the heat dissipating circuit board due to the plating process. A method of manufacturing the heat dissipating circuit board is also provided.

    摘要翻译： 公开了一种散热电路板，其包括金属芯，该金属芯包括在其表面上形成的绝缘层，形成在绝缘层上的电路层，包括种子层和第一电路图案，以及散热框架层， 使用焊料并具有第二电路图案的电路层，其中散热框架层不是通过电镀工艺而是通过使用焊料结合到电路层上，因此降低了电镀工艺的成本和时间并减轻了施加的应力 由于电镀过程而导致散热电路板。 还提供了制造散热电路板的方法。

    ARROW FOR HUNTING
    10.
    发明申请
    ARROW FOR HUNTING 有权
    搜索引擎

    公开(公告)号：US20100279803A1

    公开(公告)日：2010-11-04

    申请号：US12770266

    申请日：2010-04-29

    申请人： Young Ki LEE

    发明人： Young Ki LEE

    IPC分类号： F42B6/08 ,  F42B6/06

    CPC分类号： F42B6/06 ,  F42B6/08

    摘要： Disclosed herein is an arrow for hunting. The arrow includes an arrow shaft having a predetermined length and including a nock on one end and a shaft threaded part in the other end. A plurality of feathers is positioned to be adjacent to the nock of the arrow shaft. A connector includes a connecting threaded part fastened to the shaft threaded part, a stopper, and a penetration threaded part. An arrowhead is connected to the connector in such a way as to be opposite to the connecting threaded part. A penetration rotary unit has a threaded part to be fastened to the penetration threaded part of the connector, is shorter than the penetration threaded part, and has wings. A spring is positioned between the stopper and the penetration rotary unit, and provides a restoring force to bias the penetration rotary unit toward the arrowhead.

    摘要翻译： 这里公开了一种狩猎的箭头。 箭头包括具有预定长度的箭头轴，并且在另一端包括一端的一个孔和一个轴螺纹部分。 多个羽毛被定位成与箭头轴的nock相邻。 连接器包括紧固到轴螺纹部分的连接螺纹部分，止动件和穿透螺纹部分。 箭头以与连接螺纹部分相对的方式连接到连接器。 穿透旋转单元具有要紧固到连接器的穿透螺纹部分的螺纹部分，比穿透螺纹部分短，并且具有翼部。 弹簧定位在止动器和穿透旋转单元之间，并且提供恢复力以将穿透旋转单元偏向箭头。