摘要:
Disclosed herein is a power semiconductor module including: a circuit board having gate, emitter, and collector patterns formed thereon; a first semiconductor chip mounted on the circuit board, having gate and emitter terminals each formed on one surface thereof, and having a collector terminal formed on the other surface thereof; a second semiconductor chip mounted on the first semiconductor chip, having a cathode terminal formed on one surface thereof, and having an anode terminal formed on the other surface thereof; a first conductive connection member having one end disposed between the collector terminal of the first semiconductor chip and the cathode terminal of the second semiconductor chip and the other end contacting the collector pattern of the circuit board; and a second conductive connection member having one end contacting the anode terminal of the second semiconductor chip and the other end contacting the emitter pattern of the circuit board.
摘要:
Provided are a semiconductor package capable of packaging and modularizing power semiconductor devices which are difficult to integrate due to heat generation, a semiconductor package module using the same, and a mounting structure thereof. The semiconductor package includes: a common connection terminal formed to have a flat plate shape; first and second electronic devices respectively bonded to both surfaces of the common connection terminals; first and second connection terminals having a flat plate shape and bonded to the first electronic device; and a third connection terminal having a flat plate shape and bonded to the second electronic device.
摘要:
Disclosed herein is a power module package including: a first heat dissipation plate including a first flow path, a second flow path, and a third flow path which are sequentially formed, the first flow path and the third flow path being formed to have a step therebetween; and a second heat dissipation plate formed under the first heat dissipation plate, having one face and the other face, having a semiconductor device mounting groove formed in the one face thereof, and including a fourth flow path having one end connected to the second flow path and the other end connected to the third flow path, wherein a cooling material introduced through the first flow path is distributed to the third flow path and the fourth flow path based on the second flow path.
摘要:
A power module package includes: a substrate having a stepped portion and a non-stepped portion; a power circuit unit electrically connected to a circuit wiring provided in the stepped portion; a control circuit unit electrically connected to a circuit wiring provided in the non-stepped portion; and a molding unit molded on the substrate to seal the power circuit unit while exposing the circuit wiring of the non-stepped portion. Therefore, it is possible to improve thermal characteristics of the power module package, implement high reliability between the power circuit unit and the control circuit unit, improve design freedom of the power module package, and implement miniaturization of products.
摘要:
Disclosed herein are a power module package and a method for manufacturing the same. The power module package includes: a base substrate made of a metal material; cooling channels formed to allow a cooling material to flow in an inner portion of the base substrate; an anodized layer formed on an outer surface of the base substrate; a metal layer formed on a first surface of the base substrate having the anodized layer and including circuits and connection pads; and semiconductor devices mounted on the metal layer.
摘要:
Disclosed herein are a power module package and a method for manufacturing the same. The power module package includes: a base substrate having grooves formed between a plurality of semiconductor device mounting areas; semiconductor devices mounted on the semiconductor device mounting areas of the base substrate; and a molding formed on the base substrate and in inner portions of the grooves.
摘要:
A hybrid material including graphene and iron oxide, a method of manufacturing the same, and an apparatus for treating waste water using the same are provided. A hybrid material having magnetic properties and high dispersibility and including graphene and iron oxide may be effectively used for removing a heavy metal in waste water.
摘要:
A LED lighting device includes a light source module including a plurality of light emitting device, at least one heat radiating member including the at least one light source module disposed therein, a side frame which is coupled to both sides of the heat radiating member respectively, and a support frame which is coupled to one side of the side frame and supports the side frame.
摘要:
An optical measuring apparatus may include a light source, linear polarizer, polarized beam splitter, quarter wave plate, objective lens, and/or light receiver. The polarized beam splitter may be configured to transmit linearly polarized light from the linear polarizer to any one of a first and second optical path. The quarter wave plate may be configured to circularly polarize light transmitted through the first optical path from the polarized beam splitter and transmit the circularly polarized light to an object to be measured, and the quarter wave plate may be configured to linearly polarize the circularly polarized light reflected from the object to be measured and transmit the linearly polarized reflected light to the second optical path of the polarized beam splitter. The objective lens may be configured to generate light having different wavelengths by generating chromatic aberration in the circularly polarized light from the quarter wave plate.
摘要:
Disclosed herein is an anodized heat-radiating substrate. The anodized heat-radiating substrate is advantageous in that it has good radiation characteristics because an anodized oxide layer is formed on the entire surface of a metal layer. And, the anodized heat-radiating substrate is advantageous in that it has high-density/high accumulation characteristics because it forms multi-layered structure by using the connecting member.