POWER SEMICONDUCTOR MODULE
    1.
    发明申请
    POWER SEMICONDUCTOR MODULE 有权
    功率半导体模块

    公开(公告)号:US20130069108A1

    公开(公告)日:2013-03-21

    申请号:US13313713

    申请日:2011-12-07

    IPC分类号: H01L29/739

    摘要: Disclosed herein is a power semiconductor module including: a circuit board having gate, emitter, and collector patterns formed thereon; a first semiconductor chip mounted on the circuit board, having gate and emitter terminals each formed on one surface thereof, and having a collector terminal formed on the other surface thereof; a second semiconductor chip mounted on the first semiconductor chip, having a cathode terminal formed on one surface thereof, and having an anode terminal formed on the other surface thereof; a first conductive connection member having one end disposed between the collector terminal of the first semiconductor chip and the cathode terminal of the second semiconductor chip and the other end contacting the collector pattern of the circuit board; and a second conductive connection member having one end contacting the anode terminal of the second semiconductor chip and the other end contacting the emitter pattern of the circuit board.

    摘要翻译: 本文公开了一种功率半导体模块,包括:电路板,其上形成有栅极,发射极和集电极图案; 安装在所述电路板上的第一半导体芯片,在其一个表面上形成有栅极和发射极端子,并且在其另一个表面上形成集电极端子; 安装在所述第一半导体芯片上的第二半导体芯片,具有在其一个表面上形成的阴极端子,并且在其另一个表面上形成阳极端子; 第一导电连接构件,其一端设置在第一半导体芯片的集电极端子和第二半导体芯片的阴极端子之间,另一端接触电路板的集电体图案; 以及第二导电连接构件,其一端接触第二半导体芯片的阳极端子,另一端接触电路板的发射极图案。

    POWER MODULE PACKAGE
    3.
    发明申请
    POWER MODULE PACKAGE 有权
    电源模块封装

    公开(公告)号:US20130134571A1

    公开(公告)日:2013-05-30

    申请号:US13353128

    申请日:2012-01-18

    IPC分类号: H01L23/34

    摘要: Disclosed herein is a power module package including: a first heat dissipation plate including a first flow path, a second flow path, and a third flow path which are sequentially formed, the first flow path and the third flow path being formed to have a step therebetween; and a second heat dissipation plate formed under the first heat dissipation plate, having one face and the other face, having a semiconductor device mounting groove formed in the one face thereof, and including a fourth flow path having one end connected to the second flow path and the other end connected to the third flow path, wherein a cooling material introduced through the first flow path is distributed to the third flow path and the fourth flow path based on the second flow path.

    摘要翻译: 本文公开了一种功率模块封装,包括:第一散热板,包括顺序地形成的第一流路,第二流路和第三流路,第一流路和第三流路形成为具有台阶 之间; 以及形成在所述第一散热板下方的第二散热板,具有一个面和另一个面,在其一个面上形成有半导体器件安装槽,并且包括第四流路,其一端连接到所述第二流路 并且另一端连接到第三流动路径,其中通过第一流动路径引入的冷却材料基于第二流动路径分配到第三流动路径和第四流动路径。

    Optical Measuring Apparatuses
    9.
    发明申请
    Optical Measuring Apparatuses 有权
    光学测量仪器

    公开(公告)号:US20120105859A1

    公开(公告)日:2012-05-03

    申请号:US13281656

    申请日:2011-10-26

    IPC分类号: G01J3/45 G01B9/02

    摘要: An optical measuring apparatus may include a light source, linear polarizer, polarized beam splitter, quarter wave plate, objective lens, and/or light receiver. The polarized beam splitter may be configured to transmit linearly polarized light from the linear polarizer to any one of a first and second optical path. The quarter wave plate may be configured to circularly polarize light transmitted through the first optical path from the polarized beam splitter and transmit the circularly polarized light to an object to be measured, and the quarter wave plate may be configured to linearly polarize the circularly polarized light reflected from the object to be measured and transmit the linearly polarized reflected light to the second optical path of the polarized beam splitter. The objective lens may be configured to generate light having different wavelengths by generating chromatic aberration in the circularly polarized light from the quarter wave plate.

    摘要翻译: 光学测量装置可以包括光源,线性偏振器,偏振分束器,四分之一波片,物镜和/或光接收器。 偏振分束器可以被配置为将来自线性偏振器的线偏振光透射到第一和第二光路中的任一个。 四分之一波片可以被配置为使从偏振分束器透射通过第一光路的光圆偏振,并将圆偏振光透射到被测量物体,并且四分之一波片可以被配置为使圆偏振光线性偏振 从被测量物体反射并将线性偏振反射光传输到偏振分束器的第二光路。 物镜可以被配置为通过在来自四分之一波片的圆偏振光中产生色差来产生具有不同波长的光。