公开(公告)号：US20110180138A1

公开(公告)日：2011-07-28

申请号：US13012947

申请日：2011-01-25

申请人： Shuuichirou Adachi ,  Masato Yoshida ,  Takeshi Nojiri ,  Mitsunori Iwamuro ,  Keiko Kizawa ,  Takuya Aoyagi ,  Hiroki Yamamoto ,  Takashi Naito ,  Takahiko Kato

发明人： Shuuichirou Adachi ,  Masato Yoshida ,  Takeshi Nojiri ,  Mitsunori Iwamuro ,  Keiko Kizawa ,  Takuya Aoyagi ,  Hiroki Yamamoto ,  Takashi Naito ,  Takahiko Kato

IPC分类号： H01L31/0224 ,  H01L31/0216 ,  H01B1/22

CPC分类号： H01B1/22 ,  H01L31/022425 ,  H01L31/02245 ,  H01L31/068 ,  Y02E10/547

摘要： The paste composition for an electrode includes metal particles having copper as a main component, glass particles including diphosphorus pentoxide and divanadium pentoxide and having a content of divanadium pentoxide of 1% by mass or more, a solvent, and a resin. Further, the photovoltaic cell has an electrode formed by using the paste composition for an electrode.

摘要翻译： 电极用糊料组合物包括以铜为主要成分的金属粒子，五氧化二磷和五氧化二钒的玻璃粒子，五氧化二钒的含量为1质量％以上，溶剂和树脂。 此外，光伏电池具有通过使用电极用糊剂组合物形成的电极。

公开(公告)号：US20110028073A1

公开(公告)日：2011-02-03

申请号：US12902337

申请日：2010-10-12

申请人： Masato Fukasawa ,  Masato Yoshida ,  Naoyuki Koyama ,  Yuto Ootsuki ,  Chiaki Yamagishi ,  Kazuhiro Enomoto ,  Kouji Haga ,  Yasushi Kurata

发明人： Masato Fukasawa ,  Masato Yoshida ,  Naoyuki Koyama ,  Yuto Ootsuki ,  Chiaki Yamagishi ,  Kazuhiro Enomoto ,  Kouji Haga ,  Yasushi Kurata

IPC分类号： B24B29/02 ,  B24B7/20 ,  C09K13/00 ,  C08L33/24

CPC分类号： H01L21/31053 ,  C09G1/02 ,  C09K3/1409 ,  C09K3/1463

摘要： The present invention relates to a CMP polishing slurry, comprising cerium oxide particles, a dispersing agent, water-soluble polymer and water, wherein the water-soluble polymer is a compound having a skeleton of any one of an N-mono-substituted product and an N,N-di-substituted product of any one selected from the group consisting of acrylamide, methacrylamide and α-substituted products thereof. The amount of the water-soluble polymer is preferably in the range of 0.01 part or more by weight and 10 parts or less by weight for 100 parts by weight of the polishing slurry. Thus it is possible to provide a polishing slurry and a polishing method which make it possible to polish a film made of silicon oxide or the like effectively and rapidly and further control the process therefor easily in CMP technique for flattening an interlayer insulating film, a BPSG film, an insulator film for shallow trench isolation, and other films.

摘要翻译： 本发明涉及一种包括氧化铈颗粒，分散剂，水溶性聚合物和水的CMP抛光浆料，其中水溶性聚合物是具有N-单取代产物和 一种选自丙烯酰胺，甲基丙烯酰胺及其α-取代产物中的任何一种的N，N-二取代的产物。 对于100重量份的研磨浆料，水溶性聚合物的量优选为0.01重量份以上且10重量份以下。 因此，可以提供可以有效地快速地研磨由氧化硅等制成的膜的抛光浆料和抛光方法，并且在用于使层间绝缘膜，BPSG的平坦化的CMP技术中容易地进一步控制其工艺 薄膜，用于浅沟槽隔离的绝缘膜，以及其他薄膜。

公开(公告)号：US07711870B2

公开(公告)日：2010-05-04

申请号：US12026730

申请日：2008-02-06

申请人： Masato Yoshida ,  Yoshihito Kawakami ,  Shigenori Arai ,  Hideyuki Kihara

发明人： Masato Yoshida ,  Yoshihito Kawakami ,  Shigenori Arai ,  Hideyuki Kihara

IPC分类号： G06F3/00

CPC分类号： G06F13/4295

摘要： An interface detecting circuit and interface detecting method are provided, whereby operations can be carried out depending on peripheral devices connected to USB terminals, and whereby the system can be simplified and software load can be reduced. A pull-down resistor is connected to an ID terminal of a Mini-A receptacle of a peripheral device, the voltage generated by the pull-down resistor, which is pulled down by the ID terminal of the Mini-A receptacle of the peripheral device, and a pull-up resistor, which is pulled up by the ID terminal of a Mini-B receptacle of a device, is detected in an analog fashion, using a detecting section comprised of comparators, and, via a logic section, a logic output is subjected to noise cancellation in a filter section and is memorized in a register section. The operations of other devices are determined according to the states memorized in the register section.

摘要翻译： 提供了一种接口检测电路和接口检测方法，由此可以根据连接到USB端子的外围设备进行操作，从而可以简化系统并且可以减少软件负载。 下拉电阻连接到外围设备的Mini-A插座的ID端子，由下拉电阻器产生的电压由外围设备的Mini-A插座的ID端子拉下 并且使用由比较器组成的检测部分以模拟方式检测由设备的Mini-B插座的ID端子上拉的上拉电阻器，并且经由逻辑部分逻辑 输出在滤波器部分进行噪声消除，并被存储在寄存器部分中。 其他设备的操作根据存储在寄存器部分中的状态来确定。

公开(公告)号：US20090230568A1

公开(公告)日：2009-09-17

申请号：US11886463

申请日：2007-04-10

申请人： Hiroyuki Yasuda ,  Masato Yoshida

发明人： Hiroyuki Yasuda ,  Masato Yoshida

IPC分类号： C09J163/00 ,  C09J133/02 ,  H01L23/12

CPC分类号： C09J163/00 ,  C08L33/066 ,  C08L63/00 ,  C08L2666/04 ,  C08L2666/22 ,  C09J7/10 ,  C09J11/08 ,  C09J133/066 ,  C09J2433/00 ,  C09J2461/00 ,  C09J2463/00 ,  H01L21/6836 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/83191 ,  H01L2224/83885 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01059 ,  H01L2924/01072 ,  H01L2924/01077 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/3512

摘要： There is provided an adhesive film for a semiconductor, comprising a thermoplastic resin (A), an epoxy resin (B) and a curing agent (C), wherein a minimum melt viscosity of said adhesive film for a semiconductor is 0.1 Pa·s to 500 Pa·s both inclusive in a temperature range of 50° C. to 180° C. both inclusive at a temperature-rise rate of 10° C./min from room temperature and a content of volatile component is 5.0% or less.

摘要翻译： 提供一种用于半导体的粘合膜，其包含热塑性树脂（A），环氧树脂（B）和固化剂（C），其中所述半导体粘合剂膜的最小熔融粘度为0.1Pa.s至 在50℃〜180℃的温度范围内，以室温为10℃/分钟的升温速度，挥发成分的含量为5.0％以下，均为500Pa.s。

公开(公告)号：US20090082959A1

公开(公告)日：2009-03-26

申请号：US12230952

申请日：2008-09-09

申请人： Masato Yoshida ,  Makoto Tanaka

发明人： Masato Yoshida ,  Makoto Tanaka

IPC分类号： G01C21/34 ,  G06F12/00

CPC分类号： G01C21/3407

摘要： From among high upland area determination data stored in a hard disk drive, only a portion corresponding to a required segmental region is read into an external memory along with traveling of a vehicle. Determining of a high upland area is then executed based on the portion of the high upland determination in the external storage device. When a high-upland division is present in a vicinity of a present position, a portion of the high upland area determination data is read into the external memory. The read portion of the high upland area determination data corresponds to a high upland area, which covers all the high-upland divisions adjacently existing starting from the high-upland division in the vicinity of the present position. When a high-upland division is not present in the vicinity of the present position, a portion of the high upland area determination data corresponding to a segmental region having a predetermined minimum range centering on the present position is read into the external memory.

摘要翻译： 从存储在硬盘驱动器中的高地区确定数据中，只有与所需分段区域对应的部分与车辆的行驶一起被读取到外部存储器中。 然后根据外部存储装置中的高地区确定部分来执行高地区的确定。 当在当前位置附近存在高地分区时，将高地区确定数据的一部分读入外部存储器。 高地区确定数据的读取部分对应于高地区，覆盖从现在位置附近的高地分区开始的所有高地陆地分区。 当在当前位置附近不存在高地区划分时，将与当前位置相对应的具有预定最小范围的段区域的高地盘区域确定数据的一部分读入外部存储器。

公开(公告)号：US07410409B1

公开(公告)日：2008-08-12

申请号：US10018188

申请日：2000-06-15

申请人： Naoyuki Koyama ,  Kouji Haga ,  Masato Yoshida ,  Keizou Hirai ,  Toranosuke Ashizawa ,  Youiti Machii

发明人： Naoyuki Koyama ,  Kouji Haga ,  Masato Yoshida ,  Keizou Hirai ,  Toranosuke Ashizawa ,  Youiti Machii

IPC分类号： B24B1/00

CPC分类号： H01L21/31053 ,  C09G1/02 ,  C09K3/1409 ,  C09K3/1463 ,  H01L21/30625

摘要： The present invention discloses a CMP abrasive comprising cerium oxide particles, a dispersant, an organic polymer having an atom or a structure capable of forming a hydrogen bond with a hydroxyl group present on a surface of a film to be polished and water, a method for polishing a substrate comprising polishing a film to be polished by moving a substrate on which the film to be polished is formed and a polishing platen while pressing the substrate against the polishing platen and a polishing cloth and supplying the CMP abrasive between the film to be polished and the polishing cloth, a method for manufacturing a semiconductor device comprising the steps of the above-mentioned polishing method, and an additive for a CMP abrasive comprising an organic polymer having an atom or a structure capable of forming a hydrogen bond with a hydroxyl group present on a surface of a film to be polished, and water.

摘要翻译： 本发明公开了一种CMP研磨剂，其包含氧化铈颗粒，分散剂，具有能够与待抛光的膜表面上存在的羟基形成氢键的原子或结构的有机聚合物和水， 抛光衬底，其包括通过移动其上形成有待抛光的膜的衬底抛光待抛光的膜和抛光台板，同时将衬底压靠在抛光台板和抛光布上并将CMP磨料供应在待抛光的膜之间 抛光布，半导体器件的制造方法，包括上述抛光方法的步骤和用于CMP研磨剂的添加剂，其包含具有能够与羟基形成氢键的原子或结构的有机聚合物 存在于要抛光的膜的表面上，以及水。

公开(公告)号：US07404476B2

公开(公告)日：2008-07-29

申请号：US10575103

申请日：2004-10-08

申请人： Masato Yoshida

发明人： Masato Yoshida

IPC分类号： B66B27/00

CPC分类号： B66B29/04 ,  B66B27/00

摘要： An escalator, having a pair of balustrades disposed on both sides of traveling steps, includes a balustrade end, a skirt end portion, and an indicator. The balustrade end is configured to turn back a handrail belt wound around each of the balustrades. The skirt end portion has a belt entrance port configured to receive the handrail belt, and an outer edge of the skirt end portion furthest away from the traveling steps extends further in an axial direction of the traveling steps than an inner edge of the skirt end portion closest to the traveling steps to guide items towards the traveling steps. The indicator is configured to indicate operating conditions of the escalator. A front face of the skirt end portion includes an inclined surface at a predetermined angle with a vertical plane. A display face of the indicator conforms to the inclination of the inclined surface.

摘要翻译： 具有设置在行进台阶两侧的一对栏杆的自动扶梯包括栏杆端部，裙部端部部分和指示器。 栏杆端构造成回转围绕每个栏杆的扶手带。 裙端部具有被配置为容纳扶手带的带入口，并且远离行进台阶的裙端部的外边缘沿着行进步骤的轴向方向比裙端部的内边缘进一步延伸 最靠近行进步骤，以指导物品朝行进步骤。 该指示器被配置为指示自动扶梯的操作条件。 裙端部的前表面包括与垂直平面成预定角度的倾斜表面。 指示器的显示面符合倾斜面的倾斜度。

公开(公告)号：US20070266642A1

公开(公告)日：2007-11-22

申请号：US11878504

申请日：2007-07-25

申请人： Masato Yoshida ,  Toranosuke Ashizawa ,  Hiroki Terazaki ,  Yuuto Ootuki ,  Yasushi Kurata ,  Jun Matsuzawa ,  Kiyohito Tanno

发明人： Masato Yoshida ,  Toranosuke Ashizawa ,  Hiroki Terazaki ,  Yuuto Ootuki ,  Yasushi Kurata ,  Jun Matsuzawa ,  Kiyohito Tanno

IPC分类号： B24B7/22

CPC分类号： C09G1/02 ,  C09K3/1409 ,  C09K3/1463 ,  H01L21/31053

摘要： To polish polishing target surfaces of SiO2 insulating films or the like at a high rate without scratching the surface, the present invention provides an abrasive comprising a slurry comprising a medium and dispersed therein at least one of i) cerium oxide particles constituted of at least two crystallites and having crystal grain boundaries or having a bulk density of not higher than 6.5 g/cm3 and ii) abrasive grains having pores. Also provided are a method of polishing a target member and a process for producing a semiconductor device which make use of this abrasive.

摘要翻译： 本发明提供一种研磨剂，其包含含有介质的浆料，其中分散有i）至少一种，其中i） 由至少两个晶体构成并具有晶界或堆积密度不高于6.5g / cm 3的氧化铈颗粒和ii）具有孔的磨料颗粒。 还提供了一种抛光目标构件的方法以及利用该研磨剂制造半导体器件的方法。

公开(公告)号：US07263439B2

公开(公告)日：2007-08-28

申请号：US10916509

申请日：2004-08-12

申请人： Masato Yoshida

发明人： Masato Yoshida

IPC分类号： G01C21/00

CPC分类号： G06F3/038 ,  G06F3/011 ,  G06F3/016 ,  G06F3/0338 ,  G06F2203/014

摘要： In an image control system, with a reactive force on an input device that controls a pointer in a display, a bilateral communication of a pointing device can prevent a sense of discomfort while the system is used by an operator. When a screen image is switched from an image A to an image B, the pointing device activates the reactive force data for the image B after a predetermined amount of time based on the type or the amount of the image data of the screen image B. This enables the application of the reactive force for the image B in synchronization with generation of the screen image B, and thus gives an appropriate reactive force to the input portion of the pointing device when the screen images are being replaced from the image A to the image B.

摘要翻译： 在图像控制系统中，在控制显示器中的指针的输入设备上具有反作用力，指示设备的双向通信可以在系统由操作者使用时防止不适感。 当屏幕图像从图像A切换到图像B时，指示设备基于屏幕图像B的图像数据的类型或量来激活预定时间量之后的图像B的反作用力数据。 这使得能够与生成屏幕图像B同步地对图像B施加反作用力，并且因此当屏幕图像被从图像A更换到图像A时向给定装置的输入部分提供适当的反作用力 图像B.

公开(公告)号：US20070169421A1

公开(公告)日：2007-07-26

申请号：US11727071

申请日：2007-03-23

申请人： Naoyuki Koyama ,  Kouji Haga ,  Masato Yoshida ,  Keizou Hirai ,  Toranosuke Ashizawa ,  Youiti Machii

发明人： Naoyuki Koyama ,  Kouji Haga ,  Masato Yoshida ,  Keizou Hirai ,  Toranosuke Ashizawa ,  Youiti Machii

IPC分类号： C09K3/14

CPC分类号： H01L21/31053 ,  C09G1/02 ,  C09K3/1409 ,  C09K3/1463 ,  H01L21/30625

摘要： The present invention discloses a CMP abrasive comprising cerium oxide particles, a dispersant, an organic polymer having an atom or a structure capable of forming a hydrogen bond with a hydroxyl group present on a surface of a film to be polished and water, a method for polishing a substrate comprising polishing a film to be polished by moving a substrate on which the film to be polished is formed and a polishing platen while pressing the substrate against the polishing platen and a polishing cloth and supplying the CMP abrasive between the film to be polished and the polishing cloth, a method for manufacturing a semiconductor device comprising the steps of the above-mentioned polishing method, and an additive for a CMP abrasive comprising an organic polymer having an atom or a structure capable of forming a hydrogen bond with a hydroxyl group present on a surface of a film to be polished, and water.

摘要翻译： 本发明公开了一种CMP研磨剂，其包含氧化铈颗粒，分散剂，具有能够与待抛光的膜表面上存在的羟基形成氢键的原子或结构的有机聚合物和水， 抛光衬底，其包括通过移动其上形成有待抛光的膜的衬底抛光待抛光的膜和抛光台板，同时将衬底压靠在抛光台板和抛光布上并将CMP磨料供应在待抛光的膜之间 抛光布，半导体器件的制造方法，包括上述抛光方法的步骤和用于CMP研磨剂的添加剂，其包含具有能够与羟基形成氢键的原子或结构的有机聚合物 存在于要抛光的膜的表面上，以及水。