公开(公告)号：US10510932B2

公开(公告)日：2019-12-17

申请号：US16275422

申请日：2019-02-14

Applicant: ams Sensors Singapore Pte. Ltd.

Inventor： Hartmut Rudmann ,  Qichuan Yu ,  Simon Gubser ,  Bojan Tesanovic ,  Xu Yi ,  Eunice Ho Hui Ong ,  Hongyuan Liu ,  Ji Wang ,  Edmund Koon Tian Lua ,  Myo Paing ,  Jian Tang ,  Ming Jie Lee

IPC: H01L33/48 ,  H01L25/16 ,  H01L31/02 ,  H01L31/0203 ,  H01L31/0232 ,  H01L33/54 ,  H01L33/58 ,  H01L33/62

Abstract: The present disclosure describes wafer-level processes for fabricating optoelectronic device subassemblies that can be mounted, for example, to a circuit substrate, such as a flexible cable or printed circuit board, and integrated into optoelectronic modules that include one or more optical subassemblies stacked over the optoelectronic device subassembly. The optoelectronic device subassembly can be mounted onto the circuit substrate using solder reflow technology even if the optical subassemblies are composed of materials that are not reflow compatible.

公开(公告)号：US20230266514A1

公开(公告)日：2023-08-24

申请号：US18043308

申请日：2021-08-03

Applicant: ams Sensors Singapore Pte. Ltd.

Inventor： Simon Gubser ,  Sonja Gantner ,  Nicola Spring ,  Sajedeh Manzeli ,  Ethouba Aljassin

IPC: G02B5/24 ,  G02B5/22 ,  G02B1/10

CPC classification number: G02B5/24 ,  G02B5/223 ,  G02B1/10 ,  G02B2207/123 ,  G09F9/301

Abstract: A privacy film for a curved display screen. The privacy film has a curved cross section when no force is applied. The privacy film comprises alternating transparent layers and opaque layers, each extending across the privacy film, and each parallel to the other transparent and opaque layers when no force is applied. A method of manufacturing the film is also disclosed.

公开(公告)号：US11460659B2

公开(公告)日：2022-10-04

申请号：US16717239

申请日：2019-12-17

Applicant: ams Sensors Singapore Pte. Ltd

Inventor： Guo Xiong Wu ,  Ming Jie Lee ,  Simon Gubser ,  Qichuan Yu ,  Joon Heng Tan

IPC: G02B7/00 ,  G02B13/16 ,  H01L31/0232 ,  H01L31/18 ,  H01S5/0225 ,  G02B5/20 ,  G02B13/00 ,  H01L27/146 ,  H01L31/0203 ,  H01L33/50 ,  H01L33/52 ,  H01L33/58 ,  G02B5/28

Abstract: The present disclosure describes optical and optoelectronic assemblies that, in some cases, include screen-printed micro-spacers, as well as methods for manufacturing such assemblies and modules. For example, an optoelectronic device mounted on a substrate can include an optical sub-assembly including a first optical element and a first micro-spacer on the optical element. The optical sub-assembly can be disposed over the optoelectronic device, with a first air or vacuum gap separating the first optical element from the optoelectronic device, and the first micro-spacer laterally surrounding the first air or vacuum gap.

公开(公告)号：US10886420B2

公开(公告)日：2021-01-05

申请号：US16091352

申请日：2017-04-05

Applicant: AMS SENSORS SINGAPORE PTE. LTD.

Inventor： Qichuan Yu ,  Hartmut Rudmann ,  Ji Wang ,  Kian Siang Ng ,  Simon Gubser ,  James Eilertsen ,  Sundar Raman Gnana Sambandam

IPC: H01L31/0203 ,  H01L31/0232 ,  H01L31/16 ,  H01L31/18 ,  H01L33/58 ,  H01L33/54 ,  H01L31/0216 ,  H01L21/76 ,  H01L27/14 ,  H01L33/56 ,  H01L33/00 ,  H01S5/022

Abstract: The wafer-level manufacturing method makes possible to manufacture ultrathin optical devices such as opto-electronic modules. A clear encapsulation is applied to an initial wafer including active optical components and a wafer-size substrate. Thereon, a photostructurable spectral filter layer is produced which defines apertures. Then, trenches are produced which extend through the clear encapsulation and establish sidewalls of intermediate products. Then, an opaque encapsulation is applied to the intermediate products, thus filling the trenches and producing aperture stops. Cutting through the opaque encapsulation material present in the trenches, singulated optical modules are produced, wherein side walls of the intermediate products are covered by the opaque encapsulation material. The wafer-size substrate can be attached to a rigid carrier wafer during most process steps.

公开(公告)号：US10741736B2

公开(公告)日：2020-08-11

申请号：US15473935

申请日：2017-03-30

Applicant: AMS SENSORS SINGAPORE PTE. LTD.

Inventor： Simon Gubser ,  Mario Cesana ,  Markus Rossi ,  Hartmut Rudmann

IPC: H01L33/56 ,  H01L31/0232 ,  H01L27/146 ,  H01L23/00 ,  H01L31/0203 ,  H01L31/18 ,  H01L33/00 ,  H01L33/58 ,  H01L51/52 ,  H01L51/56 ,  H01S5/00 ,  H01S5/02 ,  H01S5/183 ,  H01L31/0216 ,  H01L33/44 ,  H01L33/48 ,  H01L33/54

Abstract: Various optoelectronic modules are described and include one or more optoelectronic devices. Each optoelectronic module includes one or more optoelectronic devices. Sidewalls laterally surround each optoelectronic device and can be in direct contact with sides of the optoelectronic device or, in some cases, with an overmold surrounding the optoelectronic device. The sidewalls can be composed, for example, of a vacuum injected material that is non-transparent to light emitted by or detectable by the optoelectronic device. The module also includes a passive optical element. Depending on the implementation, the passive optical element can be on a cover for the module, directly on a top surface of the optoelectronic device, or on an overmold surrounding the optoelectronic device. Methods of fabricating such modules are described as well, and can facilitate manufacturing the modules using wafer-level processes.

公开(公告)号：US10566467B2

公开(公告)日：2020-02-18

申请号：US15772581

申请日：2016-11-15

Applicant: ams Sensors Singapore Pte. Ltd.

Inventor： Qichuan Yu ,  Hartmut Rudmann ,  Ji Wang ,  Kian Siang Ng ,  Simon Gubser ,  James Eilertsen ,  Sundar Raman Ghana Sambandam

IPC: H01L31/0203 ,  H01L31/0216 ,  H01L33/54 ,  H01L33/58 ,  H01L31/0232 ,  H01L31/18

Abstract: The wafer-level manufacturing method makes possible to manufacture ultrathin optical devices such as opto-electronic modules. A clear encapsulation is applied to an initial wafer including active optical components and a wafer-size substrate, thereon, a photostructurable opaque coating is produced which includes apertures. Then, trenches are produced which extend through the clear encapsulation and establish side walls of intermediate products. Then, an opaque encapsulation is applied to the intermediate products, thus filling the trenches. Cutting through the opaque encapsulation material present in the trenches, singulated optical modules are produced, wherein side walls of the intermediate products are covered by the opaque encapsulation material.

公开(公告)号：US20190214533A1

公开(公告)日：2019-07-11

申请号：US16275422

申请日：2019-02-14

Applicant: ams Sensors Singapore Pte. Ltd.

Inventor： Hartmut Rudmann ,  Qichuan Yu ,  Simon Gubser ,  Bojan Tesanovic ,  Xu Yi ,  Eunice Ho Hui Ong ,  Hongyuan Liu ,  Ji Wang ,  Edmund Koon Tian Lua ,  Myo Paing ,  Jian Tang ,  Ming Jie Lee

IPC: H01L33/48 ,  H01L25/16 ,  H01L33/62 ,  H01L33/54 ,  H01L31/0232 ,  H01L31/0203 ,  H01L31/02 ,  H01L33/58

CPC classification number: H01L33/486 ,  H01L25/167 ,  H01L31/02005 ,  H01L31/0203 ,  H01L31/02325 ,  H01L33/54 ,  H01L33/58 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/16195 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2933/0066 ,  H01L2924/00014

Abstract: The present disclosure describes wafer-level processes for fabricating optoelectronic device subassemblies that can be mounted, for example, to a circuit substrate, such as a flexible cable or printed circuit board, and integrated into optoelectronic modules that include one or more optical subassemblies stacked over the optoelectronic device subassembly. The optoelectronic device subassembly can be mounted onto the circuit substrate using solder reflow technology even if the optical subassemblies are composed of materials that are not reflow compatible.