公开(公告)号：US09476936B1

公开(公告)日：2016-10-25

申请号：US14211016

申请日：2014-03-14

申请人： Johnstech International Corporation

发明人： David Johnson ,  Jeffrey Sherry ,  Harlan Faller ,  Brian Warwick ,  Sarosh Patel ,  John Bucher ,  Jay Drescher

IPC分类号： G01R31/28

CPC分类号： G01R31/2891 ,  G01R31/2874

摘要： The IC test system provides a system and method for thermal management of test pins. A test pin array (22) in a pin guide (24) is mounted in a retainer (20) which is located between an IC wafer (12) which contains IC devices to be tested (DUT) and a load board (40) which provides pathways to test signals to the DUT. On the other side of the load board is a contact plate (50) which together with the retainer straddles the load board. Leg extensions (36) pass through the load board apertures (42) and provide a thermal circuit from the contact plate to the retainer and to the pin array. On the upper side of the contact plate is a cooling/heating system with a thermal electric peltier device (62) and a further heat exchanger (64) as needed. Holes (44) are provided in the legs (36) to provide a supply of dry air to the wafer and pin array to minimize condensation as a result of cooling effects.

摘要翻译： IC测试系统提供了一种用于测试引脚热管理的系统和方法。 销引导件（24）中的测试针阵列（22）安装在位于包含要测试的IC器件（DUT）的IC晶片（12）和负载板（40）之间的保持器（20）中，该保持器 提供了向DUT测试信号的路径。 在负载板的另一侧是与保持架跨接负载板的接触板（50）。 腿部延伸部分（36）穿过负载板孔（42）并提供从接触板到保持器和引脚阵列的热回路。 在接触板的上侧是具有热电致动器装置（62）和另外的热交换器（64）的冷却/加热系统。 孔（44）设置在腿部（36）中，以向晶片和针阵列提供干燥空气供应，以使冷凝效果最小化。

公开(公告)号：US08937484B2

公开(公告)日：2015-01-20

申请号：US13916968

申请日：2013-06-13

申请人： John E. Nelson ,  Jeffrey C. Sherry ,  Patrick J. Alladio ,  Russell F. Oberg ,  Brian Warwick ,  Gary W. Michalko

发明人： John E. Nelson ,  Jeffrey C. Sherry ,  Patrick J. Alladio ,  Russell F. Oberg ,  Brian Warwick ,  Gary W. Michalko

IPC分类号： G01R1/06 ,  G01R1/067 ,  G01R1/04 ,  H01R13/24 ,  H01H13/702 ,  H01R12/70

CPC分类号： G01R1/0416 ,  G01R1/0466 ,  G01R1/0483 ,  G01R1/0735 ,  G01R1/07371 ,  H01H13/702 ,  H01H2203/04 ,  H01H2205/006 ,  H01H2207/028 ,  H01H2209/052 ,  H01R12/7082 ,  H01R13/2414

摘要： The terminals of a device under test are temporarily electrically connected to corresponding contact pads on a load board by a series of electrically conductive pin pairs. The pin pairs are held in place by an interposer membrane that includes a top contact plate facing the device under test, a bottom contact plate facing the load board, and a vertically resilient, non-conductive member between the top and bottom contact plates. Each pin pair includes a top and bottom pin, which extend beyond the top and bottom contact plates, respectively, toward the device under test and the load board, respectively. The top and bottom pins contact each other at an interface that is inclined with respect to the membrane surface normal. When compressed longitudinally, the pins translate toward each other by sliding along the interface. The sliding is largely longitudinal, with a small and desirable lateral component determined by the inclination of the interface.

摘要翻译： 被测器件的端子通过一系列导电引脚对临时电连接到负载板上的对应接触焊盘。 销对通过插入器膜保持在适当的位置，该插入器膜包括面向被测器件的顶部接触板，面向负载板的底部接触板以及位于顶部和底部接触板之间的垂直弹性的非导电部件。 每个销对包括顶部和底部销，其分别延伸超过顶部和底部接触板，朝向被测设备和负载板。 顶部和底部销在相对于膜表面正常倾斜的界面处彼此接触。 当纵向压缩时，销沿着界面滑动朝向彼此平移。 滑动主要是纵向的，具有通过界面的倾斜度确定的小且期望的侧向分量。

公开(公告)号：USD719923S1

公开(公告)日：2014-12-23

申请号：US29491020

申请日：2014-05-15

申请人： David Johnson ,  Sarosh Patel ,  John E. Nelson ,  Michael Andres

设计人： David Johnson ,  Sarosh Patel ,  John E. Nelson ,  Michael Andres

公开(公告)号：US08690597B2

公开(公告)日：2014-04-08

申请号：US13456964

申请日：2012-04-26

申请人： Joel N. Erdman

发明人： Joel N. Erdman

IPC分类号： H01R13/64

CPC分类号： G01R1/0466

摘要： A floating or compliant plate test socket device and method is disclosed. Three primary components, a fixed frame (20) receives a floating or compliant plate (22), sit together atop a housing (24) which contains contact pins used for the electrical test of the DUT (device under test). In fixed plate (20) are bearings for reducing friction when the floating plate is driven downward by the DUT inserter. Embedded in sidewalls (40) are a plurality of vertical raceways (46) which receive bearings (48). The raceways are borings, which have gap in the boring, in the fixed plate sidewalls (40) with the boring center spaced from the sidewall sufficiently that part of the bore removes part of the sidewall but allows the ball bearings to partially protrude from the gap formed in the incomplete semicircular boarding without the bearings being able to freely escape.

摘要翻译： 公开了浮动或柔性板测试插座装置和方法。 三个主要部件，固定框架（20）接收浮动或柔性板（22），它们坐在壳体（24）的顶部，壳体（24）包含用于DUT（被测设备）的电气测试的接触针。 在固定板（20）中，当浮动板被DUT插入器向下驱动时，用于减小摩擦的轴承。 嵌入在侧壁（40）中的是容纳轴承（48）的多个垂直滚道（46）。 滚道是钻孔，其在固定板侧壁（40）中具有间隙，其中钻孔中心与侧壁充分隔开，使得孔的一部分移除侧壁的一部分，但允许球轴承部分地从间隙突出 形成在不完整的半圆形登机，而轴承能够自由逃脱。

公开(公告)号：US20120062261A1

公开(公告)日：2012-03-15

申请号：US13226606

申请日：2011-09-07

申请人： John E. Nelson ,  Jeffrey C. Sherry ,  Patrick J. Alladio ,  Russell F. Oberg ,  Brian Warwick ,  Gary W. Michalko

发明人： John E. Nelson ,  Jeffrey C. Sherry ,  Patrick J. Alladio ,  Russell F. Oberg ,  Brian Warwick ,  Gary W. Michalko

IPC分类号： G01R1/067 ,  G01R31/00

CPC分类号： G01R31/2891 ,  G01R1/0416 ,  G01R1/06738 ,  G01R1/06744 ,  G01R1/0735 ,  G01R3/00 ,  G01R31/2887 ,  G01R31/2889 ,  H01R43/16 ,  Y10T29/49204

摘要： The terminals of a device under test are temporarily electrically connected to corresponding contact pads on a load board by a series of electrically conductive pin pairs. The pin pairs are held in place by an interposer membrane that includes a top contact plate facing the device under test, a bottom contact plate facing the load board, and a vertically resilient, non-conductive member between the top and bottom contact plates. Each pin pair includes a top and bottom pin, which extend beyond the top and bottom contact plates, respectively, toward the device under test and the load board, respectively. The top and bottom pins contact each other at an interface that is inclined with respect to the membrane surface normal. When compressed longitudinally, the pins translate toward each other by sliding along the interface.

摘要翻译： 被测器件的端子通过一系列导电引脚对临时电连接到负载板上的对应接触焊盘。 销对通过插入器膜保持在适当的位置，该插入器膜包括面向被测器件的顶部接触板，面向负载板的底部接触板以及位于顶部和底部接触板之间的垂直弹性的非导电部件。 每个销对包括顶部和底部销，其分别延伸超过顶部和底部接触板，朝向被测设备和负载板。 顶部和底部销在相对于膜表面正常倾斜的界面处彼此接触。 当纵向压缩时，销沿着界面滑动朝向彼此平移。

公开(公告)号：US20060087311A1

公开(公告)日：2006-04-27

申请号：US11254511

申请日：2005-10-20

申请人： Dennis Shell

发明人： Dennis Shell

IPC分类号： G01R31/28

CPC分类号： E05C3/14 ,  E05B17/2038 ,  G01R31/2893 ,  Y10T292/0911

摘要： An actuator for pressing a plurality of circuit contacts carried on a microcircuit package against a plurality of test contacts has a frame having a top surface and a bottom surface facing away from the top surface. The frame has first and second end slots each intersecting the top surface at opposite ends thereof. A loader foot is carried by the frame's bottom surface for applying force to a microcircuit. First and second latch elements, each respectively mounted within the frame's first and second end slots are each shiftable between a latched position and an unlatched position within the frame's first and second slots, each said latch element when in the latched position for gripping an edge of an alignment plate and when in the unlatched position for releasing the alignment plate. An actuator element mounted on the frame's top surface receives manual force and converts the received manual force to force applied to the latch elements to shift the latch elements between the latched and unlatched positions.

摘要翻译： 用于将承载在微电路封装上的多个电路触点压靠在多个测试触点上的致动器具有框架，其具有顶表面和背离顶表面的底表面。 框架具有第一和第二端槽，每个槽在其相对端与顶表面相交。 装载脚由框架的底面承载，以将力施加到微电路。 每个分别安装在框架的第一和第二端部狭槽内的第一和第二闩锁元件均可在框架的第一和第二槽内的锁定位置和解锁位置之间移动，每个所述闩锁元件处于锁定位置时， 对准板，并且处于解锁位置时用于释放对准板。 安装在框架顶表面上的致动器元件接收手动力并将接收到的手动力转换成施加到闩锁元件上的力以将闩锁元件移动到锁定位置和解锁位置之间。

公开(公告)号：US06861667B2

公开(公告)日：2005-03-01

申请号：US10619895

申请日：2003-07-15

申请人： Mathew L. Gilk ,  John W. O'Sullivan ,  David A. Johnson

发明人： Mathew L. Gilk ,  John W. O'Sullivan ,  David A. Johnson

IPC分类号： H01R4/66 ,  H01R13/514 ,  H01L23/58

CPC分类号： H01R13/2435 ,  H01R13/514 ,  H01R2201/20

摘要： A grounding assembly for testing which can be readily changed is provided by an insert which is retained within an opening in a test socket. Flexible projections from the socket fit within grooves in the insert to provide the retention means. The insert is positioned within an opening in the socket adjacent to an opening containing a device under test (DUT). The insert is also between the DUT and a test board, and has contacts arranged such they connect ground contacts on the DUT to opposing contacts on the test board. The insert can provide different numbers, arrangements, and types of contacts as well as different materials for both the contact and contact body by merely changing the insert.

摘要翻译： 可以容易地改变的用于测试的接地组件由保持在测试插座中的开口内的插入件提供。 该插座的柔性凸起配合在插入件中的槽内以提供保持装置。 插入件位于插座中的开口内，邻近包含待测器件（DUT）的开口。 插入件也在DUT和测试板之间，并且具有布置成使得它们将DUT上的接地触点连接到测试板上的相对触点的触点。 插入件可以通过仅改变插入件来为触点和接触体提供不同的数量，布置和类型的触点以及不同的材料。

公开(公告)号：US20030224663A1

公开(公告)日：2003-12-04

申请号：US10379835

申请日：2003-03-04

申请人： JohnsTech International Corporation

发明人： David A. Johnson ,  Eric V. Kline

IPC分类号： H01R013/66

CPC分类号： H01R13/2464 ,  H01L23/64 ,  H01L23/642 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01R12/57 ,  H01R13/2407 ,  H01R13/6464 ,  H01R13/6471 ,  H01R13/6473 ,  H01R13/6608 ,  H01R13/719 ,  H05K1/023 ,  H05K1/0231 ,  H05K1/025 ,  H05K7/1092 ,  H05K2201/0792 ,  H05K2201/10325 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10636 ,  H05K2201/10689 ,  Y02P70/611 ,  H01L2924/00

摘要： An apparatus for providing a controlled impedance directly to predetermined contact elements within a socket, thereby reducing the nulldistortingnull nature of the electrical interconnection system. In an illustrative embodiment of the present invention, predetermined contacts of a socket may have a resistance, inductance, capacitance, or a combination thereof incorporated therein. In another illustrative embodiment, at least one active element(s) may also be incorporated into predefined contacts. In this manner, predefined contacts may nullprocessnull the corresponding signal in a predetermined manner, defined by the circuitry incorporated on the contact itself. Illustrative functions that may be performed include, but are not limited to, amplifying, analog-to-digital converting, digital-to-analog converting, predefined logic functions, or any other function that may be performed via a combination of active and/or passive elements including a microprocessor function.

摘要翻译： 一种用于将受控阻抗直接提供给插座内的预定接触元件的设备，由此降低了电互连系统的“变形”性质。 在本发明的说明性实施例中，插座的预定触点可以具有并入其中的电阻，电感，电容或其组合。 在另一说明性实施例中，至少一个有源元件也可以并入预定义的触点中。 以这种方式，预定义的触点可以以预定的方式“处理”对应的信号，由接合体本身所包含的电路定义。 可以执行的说明性功能包括但不限于放大模数转换，数模转换，预定义逻辑功能或可以通过有源和/或数字转换的组合来执行的任何其他功能， 无源元件包括微处理器功能。

公开(公告)号：US5967848A

公开(公告)日：1999-10-19

申请号：US962924

申请日：1997-10-27

申请人： David A. Johnson ,  Eric V. Kline

发明人： David A. Johnson ,  Eric V. Kline

IPC分类号： H01L23/64 ,  H01R12/57 ,  H01R13/24 ,  H01R13/646 ,  H01R13/6464 ,  H01R13/6471 ,  H01R13/6473 ,  H01R13/66 ,  H01R13/719 ,  H01R33/76 ,  H01R33/945 ,  H05K1/02 ,  H05K7/10 ,  H01R9/09

CPC分类号： H01R13/2464 ,  H01L23/64 ,  H01L23/642 ,  H01R13/2407 ,  H01R13/6464 ,  H01R13/6608 ,  H01R13/719 ,  H05K1/023 ,  H05K1/0231 ,  H05K1/025 ,  H05K7/1092 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01R12/57 ,  H01R13/6471 ,  H01R13/6473 ,  H05K2201/0792 ,  H05K2201/10325 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10636 ,  H05K2201/10689 ,  Y02P70/611

摘要： An apparatus for providing a controlled impedance directly to predetermined contact elements within a socket, thereby reducing the "distorting" nature of the electrical interconnection system. In an illustrative embodiment of the present invention, predetermined contacts of a socket may have a resistance, inductance, capacitance, or a combination thereof incorporated therein. In another illustrative embodiment, at least one active element(s) may also be incorporated into predefined contacts. In this manner, predefined contacts may "process" the corresponding signal in a predetermined manner, defined by the circuitry incorporated on the contact itself. Illustrative functions that may be performed include, but are not limited to, amplifying, analog-to-digital converting, digital-to-analog converting, predefined logic functions, or any other function that may be performed via a combination of active and/or passive elements including a microprocessor function.

公开(公告)号：USD1042357S1

公开(公告)日：2024-09-17

申请号：US29791272

申请日：2022-01-06

申请人： Johnstech International Corporation

设计人： Mike Andres

摘要： FIG. 1 is a top front left perspective view of an anti pinching contact showing my new design;
FIG. 2 is a front plan view thereof.
FIG. 3 is a rear plan view thereof.
FIG. 4 is a left plan view thereof.
FIG. 5 is a right plan view thereof.
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
The dot-dash broken lines depict the bounds of the claimed design, while all evenly spaced broken lines are directed to environment. The broken lines form no part of the claimed design.