公开(公告)号：US20160343479A1

公开(公告)日：2016-11-24

申请号：US15107079

申请日：2015-02-02

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Masaaki ITOU

IPC: H01C1/084 ,  H01C1/14 ,  G01R1/20 ,  H01C1/028

CPC classification number: H01C1/084 ,  G01R1/203 ,  H01C1/028 ,  H01C1/14 ,  H01C7/003 ,  H01C7/06

Abstract: A chip resistor includes a resistive element, a pair of electrodes, and heat radiator plates. The resistive element is made of a plate-shaped metal. The pair of electrodes is formed on both ends of a first surface of the resistive element. The heat radiator plates are fastened to a second surface of the resistive element and are disposed spaced apart from each other via a gap therebetween.

Abstract translation: 芯片电阻器包括电阻元件，一对电极和散热板。 电阻元件由板状金属制成。 一对电极形成在电阻元件的第一表面的两端。 散热板固定在电阻元件的第二表面上，并通过它们之间的间隙彼此隔开设置。

公开(公告)号：US09390844B2

公开(公告)日：2016-07-12

申请号：US14221822

申请日：2014-03-21

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Sung Hun Cho ,  Young Key Joo Kim ,  Chang Ho Lee ,  Byung Sung Kang

IPC: H01C1/012 ,  H01C7/00 ,  H01C7/18 ,  H01C17/00 ,  H01C17/065

CPC classification number: H01C7/003 ,  H01C7/18 ,  H01C17/006 ,  H01C17/06526 ,  H01C17/06533

Abstract: A chip resistor may include: a body having a plurality of substrates stacked therein; a plurality of resistors formed in the body with respective substrates interposed therebetween and exposed through both end surfaces of the body; and first and second electrodes covering both end surfaces of the body, respectively, and connected to both end portions of the exposed resistors, respectively.

Abstract translation: 芯片电阻器可以包括：具有堆叠在其中的多个基板的主体; 多个电阻器，其形成在主体中，各自的基板插入其间并通过主体的两个端面露出; 以及分别覆盖主体的两个端面的第一和第二电极，并且分别连接到暴露的电阻器的两个端部。

公开(公告)号：US09373430B2

公开(公告)日：2016-06-21

申请号：US13893423

申请日：2013-05-14

Applicant: Viking Tech Corporation

Inventor： Shih-Long Wei ,  Shen-Li Hsiao ,  Chien-Hung Ho

IPC: H01C1/012 ,  H01C1/028 ,  H01C1/04 ,  H01C1/148 ,  H01C7/00

CPC classification number: H01C1/028 ,  H01C1/04 ,  H01C1/148 ,  H01C7/003

Abstract: A resistor component is provided, including a ceramic bar having a film applied thereon, a protection layer formed on the film in a middle portion of the ceramic bar, an end plating layer formed on the film at two ends of the ceramic bar, an insulation layer formed on the protection layer, and a color coded marking formed on the insulation layer that indicates the resistance of the resistor component. The end plating layer is formed by a barrel plating method and includes copper, tin, nickel and a combination thereof. The resistor component thus has a low cost and is manufactured by a simple process, simultaneously avoids the occurrence of pores or incompletely sealed join that may be caused by the prior method. Therefore the resistor component has high reliability.

Abstract translation: 提供一种电阻器部件，包括其上涂覆有膜的陶瓷棒，在陶瓷棒的中间部分中形成在膜上的保护层，在陶瓷棒的两端形成在膜上的端电镀层，绝缘体 形成在保护层上的层，以及形成在绝缘层上的指示电阻器部件的电阻的颜色编码标记。 端镀层通过滚镀法形成，包括铜，锡，镍及其组合。 因此，电阻器部件成本低并且通过简单的工艺制造，同时避免了由现有方法引起的孔或不完全密封的连接的发生。 因此，电阻器组件具有高可靠性。

公开(公告)号：US20150357097A1

公开(公告)日：2015-12-10

申请号：US14298286

申请日：2014-06-06

Applicant: YAGEO CORPORATION

Inventor： DONG-MOU TSAI ,  TSAI-HU CHEN ,  SHENG-LI HSIAO ,  YUNG-HAN LIU ,  JEN-FU HO

IPC: H01C1/142 ,  H01C1/012

CPC classification number: H01C1/142 ,  H01C1/012 ,  H01C1/028 ,  H01C7/003 ,  H01C17/006

Abstract: The disclosure provides a chip resistor including: a substrate, two first electrodes, two second electrodes, a resistive layer, at least one protection layer and at least one coating layer. The protection layer covers part of the two first electrodes, and includes at least two overlay sides and at least one overlay plane. The coating layer covers the at least two overlay sides, the at least one overlay plane, and part of the two first electrodes and the two second electrodes. The chip resistor uses the two overlay sides and the overplay plane to extend a distance between the two first electrodes and the outside. Therefore, it is difficult for the airborne sulfur, sulfides and sulfur-containing compounds to enter and react with the two first electrodes. Thus, the chip resistor can resist corrosion of harmful substances such as sulfur, sulfides and sulfur-containing compounds or halogens on the electrodes.

Abstract translation: 本公开提供一种片式电阻器，包括：衬底，两个第一电极，两个第二电极，电阻层，至少一个保护层和至少一个涂层。 保护层覆盖两个第一电极的一部分，并且包括至少两个覆盖面和至少一个覆盖平面。 涂层覆盖至少两个覆盖面，至少一个覆盖平面以及两个第一电极和两个第二电极的一部分。 芯片电阻器使用两个覆盖层和超平面来延伸两个第一电极和外部之间的距离。 因此，空气中的硫，硫化物和含硫化合物难以进入并与两个第一电极反应。 因此，芯片电阻器可以抵抗有害物质如硫，硫化物和含硫化合物或卤素在电极上的腐蚀。

公开(公告)号：US20150216044A1

公开(公告)日：2015-07-30

申请号：US14581460

申请日：2014-12-23

Applicant: ROHM CO., LTD.

Inventor： Hiroshi TAMAGAWA ,  Yasuhiro KONDO ,  Hiroki YAMAMOTO

IPC: H05K1/02 ,  H05K3/00 ,  H05K1/09 ,  H05K5/00 ,  H05K1/11

CPC classification number: H01L27/016 ,  H01C1/14 ,  H01C1/142 ,  H01C7/003 ,  H01C7/006 ,  H01C17/006 ,  H01G4/012 ,  H01G4/30 ,  H01G4/33 ,  H01L27/0802 ,  H01L27/0805 ,  H01L28/20 ,  H01L28/60 ,  H05K1/167 ,  Y10T29/49158

Abstract: The chip part of the present invention includes a substrate, an electrode on the substrate and having a front surface in which a plurality of recessed portions are formed toward the thickness direction thereof, and an element region having a circuit element that is electrically connected to the electrode.

Abstract translation: 本发明的芯片部分包括基板，基板上的电极，并且具有朝向其厚度方向形成有多个凹部的前表面，以及元件区域，电路元件电连接到 电极。

公开(公告)号：US20140266568A1

公开(公告)日：2014-09-18

申请号：US14292325

申请日：2014-05-30

Applicant: CYNTEC CO. LTD.

Inventor： Hsing-Kai CHENG ,  Yu-Jen Lin ,  Yen-Ting Lin ,  Ta-Wen Lo

IPC: H01C1/012

CPC classification number: H01C7/13 ,  G01R1/203 ,  H01C1/148 ,  H01C7/003

Abstract: A resistor device includes a resistor plate having opposite first and second surfaces; a first metal layer including first and second portions which are disposed on the first surface of the resistor plate at opposite first and second sides, respectively; and a second metal layer including a first sensing pad, a second sensing pad, a first current pad and a second current pad, separate from one another, wherein the first sensing pad and the first current pad are disposed on the first portion of the first metal layer and the second sensing pad and the second current pad are disposed on the second portion of the first metal layer. A protective layer is preferably provided, overlying the resistor plate and the first metal layer uncovered by the second metal layer.

Abstract translation: 电阻器装置包括具有相反的第一和第二表面的电阻器板; 第一金属层，包括第一和第二部分，其分别在相反的第一和第二侧设置在电阻器板的第一表面上; 以及第二金属层，其包括彼此分离的第一感测焊盘，第二感测焊盘，第一电流焊盘和第二电流焊盘，其中所述第一感测焊盘和所述第一电流焊盘设置在所述第一 金属层和第二感测焊盘和第二电流焊盘设置在第一金属层的第二部分上。 优选地设置保护层，覆盖电阻器板和未被第二金属层覆盖的第一金属层。

公开(公告)号：US20140247108A1

公开(公告)日：2014-09-04

申请号：US14350672

申请日：2012-10-12

Applicant: Torayuki Tsukada ,  Kentaro Naka

Inventor： Torayuki Tsukada ,  Kentaro Naka

IPC: H01C7/00 ,  H01C17/00

CPC classification number: H01C7/00 ,  H01C7/003 ,  H01C17/00 ,  H01C17/006 ,  H01C17/02 ,  H01C17/065 ,  H01C17/242 ,  Y10T29/49082

Abstract: [Object]A chip resistor suitable for enhancing manufacturing efficiency is provided.[Means]A chip resistor includes a first electrode 1, a second electrode 2, a resistor portion 3, a first intermediate layer 4 connected to the first electrode 1 and the resistor portion 3, a second intermediate layer 5 connected to the second electrode 2 and the resistor portion 3, a coating film 61 covering the first electrode 1, and oxides existing in the first intermediate layer 4. The coating film 61 is made of a material having a higher absorptance of a laser beam of a predetermined wavelength than that of the material forming the first electrode 1. The oxides are oxides of the material forming the coating film 61.

Abstract translation: 提供了一种适合于提高制造效率的片式电阻器。 芯片电阻器包括第一电极1，第二电极2，电阻器部分3，连接到第一电极1和电阻器部分3的第一中间层4，连接到第二电极2的第二中间层5 电阻部分3，覆盖第一电极1的涂膜61和存在于第一中间层4中的氧化物。涂膜61由具有比预定波长的预定波长的激光束的吸收率更高的材料制成 形成第一电极1的材料。氧化物是形成涂膜61的材料的氧化物。

公开(公告)号：US08754742B2

公开(公告)日：2014-06-17

申请号：US13627013

申请日：2012-09-26

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yusuke Otsuka ,  Yuichi Iida ,  Kazuo Kishida ,  Takahiro Takada

IPC: H01C1/012 ,  H01C17/30 ,  H01C7/00 ,  H05K3/46 ,  H01L23/13 ,  H01C17/075 ,  H01L23/538 ,  H01L23/66 ,  H01C1/14 ,  H01C17/00

CPC classification number: H01C17/30 ,  H01C1/14 ,  H01C7/003 ,  H01C17/00 ,  H01C17/075 ,  H01L23/13 ,  H01L23/5385 ,  H01L23/66 ,  H01L2924/0002 ,  H05K1/167 ,  H05K3/4629 ,  H01L2924/00

Abstract: A multilayer ceramic substrate includes a ceramic laminated body including a plurality of ceramic layers stacked on each other, a resistor, and a resistor connecting conductor with a portion overlapping the resistor and an overcoat layer that covers the resistor located on a principal surface of the ceramic laminated body. An overcoat layer is made relatively thick during firing, thereby making cracks less likely to be caused, and after the firing step, the thickness of the overcoat layer is reduced by physically scraping down the surface of the overcoat layer, thereby reducing the trimming time. In the overcoat layer, a region that covers a portion in which a resistor overlaps a resistor connecting conductor is thicker than a region that covers the other portion.

Abstract translation: 多层陶瓷基板包括陶瓷层叠体，陶瓷层叠体包括彼此堆叠的多个陶瓷层，电阻器和电阻器连接导体以及与该电阻器重叠的部分，以及覆盖位于陶瓷的主表面上的电阻器的外涂层 层压体。 在焙烧时使外涂层相对较厚，从而使得难以产生裂纹，并且在烧制步骤之后，通过物理地刮擦外涂层的表面来降低外涂层的厚度，从而减少修整时间。 在覆盖层中，覆盖电阻器与电阻器连接导体重叠的部分的区域比覆盖另一部分的区域厚。

公开(公告)号：US08590140B2

公开(公告)日：2013-11-26

申请号：US12873827

申请日：2010-09-01

Applicant: Shih-Long Wei ,  Shen-Li Hsiao ,  Chien-Min Shao ,  Chien-Hung Ho

Inventor： Shih-Long Wei ,  Shen-Li Hsiao ,  Chien-Min Shao ,  Chien-Hung Ho

IPC: H01C17/00

CPC classification number: H01C17/07 ,  H01C7/003 ,  H01C17/006 ,  H01C17/065

Abstract: A fabrication method of an alloy resistor includes: providing an alloy sheet having a plurality of openings spacing apart from each other and going through the alloy sheet and a plurality of alloy resistor units located between any two adjacent openings, wherein each of the alloy resistor units has an insulating cover area and a plurality of electrode ends on both sides of the insulating cover area; forming an insulating layer on a surface of the insulating cover area of the alloy resistor units by an electrodeposition coating process; cutting the alloy along a connecting portion, so as to obtain separated alloy resistor units; and forming a conductive adhesion material on the electrode ends of the alloy resistor units. An alloy resistor having an insulating layer with a smooth surface can be obtained by performing an electrodeposition coating process.

Abstract translation: 合金电阻器的制造方法包括：提供具有彼此间隔开并且穿过合金板的多个开口的合金片和位于任意两个相邻开口之间的多个合金电阻器单元，其中每个合金电阻器单元 绝缘覆盖区域和绝缘覆盖区域两侧的多个电极端部; 通过电沉积涂覆工艺在合金电阻器单元的绝缘覆盖区域的表面上形成绝缘层; 沿着连接部分切割合金，以获得分离的合金电阻器单元; 以及在合金电阻器单元的电极端上形成导电粘合材料。 通过进行电沉积涂布工艺，可以得到具有光滑表面的绝缘层的合金电阻体。

公开(公告)号：US20130119827A1

公开(公告)日：2013-05-16

申请号：US13660527

申请日：2012-10-25

Applicant: Samsung Electro-mechanics Co., Ltd.

Inventor： Sung Hyung KANG ,  Du Won CHOI ,  Min Sung SONG ,  Sang Hoon KWON ,  Chang Hoon KIM ,  Byoung Hwa LEE

IPC: C04B35/468 ,  H01L41/083 ,  H01F5/00 ,  H01G4/10 ,  H01C7/10 ,  B32B5/16 ,  H01L41/047

CPC classification number: H01C17/06533 ,  C04B35/4682 ,  C04B2235/3208 ,  C04B2235/3215 ,  C04B2235/3217 ,  C04B2235/3224 ,  C04B2235/3239 ,  C04B2235/3244 ,  C04B2235/3256 ,  C04B2235/3258 ,  C04B2235/3262 ,  C04B2235/3275 ,  C04B2235/3279 ,  C04B2235/3281 ,  C04B2235/3284 ,  C04B2235/3418 ,  C04B2235/36 ,  C04B2235/442 ,  C04B2235/5409 ,  C04B2235/785 ,  C04B2235/79 ,  H01B3/12 ,  H01C7/003 ,  H01C7/025 ,  H01C7/045 ,  H01G4/1227 ,  H01G4/30 ,  Y10T428/2982

Abstract: There is provided a dielectric composition, including; a base powder including BamTiO3 (0.995≦m≦1.010); a first sub-component including 0.05 to 4.00 moles of an oxide or carbonate containing at least one rare-earth element based on 100 moles of the base powder; a second sub-component including 0.05 to 0.70 moles of an oxide or carbonate containing at least one transition metal; a third sub-component including 0.20 to 2.00 moles of a Si oxide; a fourth sub-component including 0.02 to 1.00 mole of an Al oxide; and a fifth sub-component including 20 to 140% of an oxide containing at least one of Ba and Ca, based on the third sub-component.

Abstract translation: 提供介电组合物，包括： 包括BamTiO 3（0.995 @ m @ 1.010）的基础粉末; 包含基于100摩尔基础粉末含有至少一种稀土元素的氧化物或碳酸酯的0.05至4.00摩尔的第一子组分; 含有0.05〜0.70摩尔含有至少一种过渡金属的氧化物或碳酸盐的第二子成分; 第三子成分，含有0.20〜2.00摩尔的Si氧化物; 第四副成分，含有0.02〜1.00摩尔的Al氧化物; 和包含20〜140％的含有Ba和Ca中的至少一种的氧化物的第五子成分，基于第三子成分。