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    Tape carrier package on reel and plasma display device using the same
    11.
    发明授权
    Tape carrier package on reel and plasma display device using the same 失效
    带式载带包装和等离子体显示装置使用它

    公开(公告)号：US07656089B2

    公开(公告)日：2010-02-02

    申请号：US11294360

    申请日：2005-12-06

    申请人： Bu-Kyeong Mo ,  Jong-Bong Ha ,  Seung-Hak Kim

    发明人： Bu-Kyeong Mo ,  Jong-Bong Ha ,  Seung-Hak Kim

    IPC分类号： H01J17/49 ,  H05K1/00

    CPC分类号： H05K3/361 ,  H05K1/0269 ,  H05K2201/0187 ,  H05K2201/09918 ,  H05K2203/161 ,  H05K2203/166

    摘要： A Tape Carrier Package (TCP) that is attachable to and detachable from a connector of a Printed circuit Board Assembly (PBA) of a plasma display apparatus that includes a plurality of electrodes, and a plasma display device including the same. The TCP includes an input portion that is attachable to and detachable from the PBA, an output portion that is attachable to and detachable from one of the plurality of electrodes of the plasma display apparatus, and at least one alignment mark, at least a portion of the alignment mark corresponding to or abutting an edge of the input portion.

    摘要翻译： 一种可附接到包括多个电极的等离子体显示装置的印刷电路板组件（PBA）的连接器并可拆卸的带载封装（TCP）以及包括该等离子体显示装置的等离子体显示装置。 TCP包括可附接到PBA和可从PBA拆卸的输入部分，可连接到等离子体显示装置的多个电极中的一个电极并可拆卸的输出部分，以及至少一个对准标记，至少一部分 所述对准标记对应于或邻接所述输入部分的边缘。

    Method of making a thermally isolated via structure
    12.
    发明授权
    Method of making a thermally isolated via structure 失效
    制造热隔离通孔结构的方法

    公开(公告)号：US07617598B2

    公开(公告)日：2009-11-17

    申请号：US11681964

    申请日：2007-03-05

    申请人： Anthony Primavera ,  Steven P. Findell

    发明人： Anthony Primavera ,  Steven P. Findell

    IPC分类号： H01K3/10

    CPC分类号： H05K1/0271 ,  H05K1/0201 ,  H05K1/0269 ,  H05K1/0272 ,  H05K1/115 ,  H05K2201/0133 ,  H05K2201/0187 ,  H05K2201/0394 ,  H05K2201/062 ,  H05K2201/09036 ,  H05K2201/09063 ,  H05K2201/09509 ,  H05K2203/161 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49204

    摘要： This document discusses, among other things, a method including providing a laminate having a first conductive layer, a second conductive layer and an insulator between the first and second conductive layers. A hollow conductive via is formed through the insulator, the conductive via electrically connects the first and second conductive layers. At least one conductive trace electrically connects the hollow conductive via to at least one of the first and second conductive layers. The method further includes forming a channel in the insulator adjacent to the hollow conductive via and the channel surrounds the via. Wherein the channel extends at least part way between the first and second conductive layers, the at least one conductive trace bridges the channel, and the via is isolated from the insulator by the surrounding channel formed adjacent to the hollow conductive via. The via is isolated to prevent separation between the hollow conductive via and at least one of the first and second conductive layers, where the insulator is in a swollen condition.

    摘要翻译： 本文件尤其涉及一种包括提供在第一和第二导电层之间具有第一导电层，第二导电层和绝缘体的层压体的方法。 通过绝缘体形成中空导电通孔，导电通孔电连接第一和第二导电层。 至少一个导电迹线将中空导电通孔电连接到第一和第二导电层中的至少一个。 该方法还包括在绝缘体中邻近中空导电通孔形成通道，并且通道围绕通孔。 其中通道至少部分地在第一和第二导电层之间延伸，至少一个导电迹线桥接通道，并且通过与中空导电通孔相邻形成的周围通道将通孔与绝缘体隔离。 通孔被隔离以防止中空导电通孔与绝缘体处于膨胀状态的第一和第二导电层中的至少一个之间的分离。

    PRINTED ELECTRONIC DEVICE AND METHODS OF DETERMINING THE ELECTRICAL VALUE THEREOF
    14.
    发明申请
    PRINTED ELECTRONIC DEVICE AND METHODS OF DETERMINING THE ELECTRICAL VALUE THEREOF 审中-公开
    印刷电子器件及其电学值的确定方法

    公开(公告)号：US20080124528A1

    公开(公告)日：2008-05-29

    申请号：US11564703

    申请日：2006-11-29

    申请人： Jerzy Wielgus ,  Daniel R. Gamota ,  John B. Szczech ,  Jie Zhang

    发明人： Jerzy Wielgus ,  Daniel R. Gamota ,  John B. Szczech ,  Jie Zhang

    IPC分类号： H05K1/16 ,  H05K3/46

    CPC分类号： H05K1/16 ,  H05K1/0269 ,  H05K1/162 ,  H05K1/167 ,  H05K3/1216 ,  H05K3/1275 ,  H05K2201/09936 ,  H05K2203/0108 ,  H05K2203/0271 ,  H05K2203/0278 ,  H05K2203/161 ,  H05K2203/163 ,  Y10T428/24802 ,  Y10T428/24893

    摘要： A printed electronic device and methods for determining the electrical value of the device. A dielectric material is contact printed on a substrate using a preset force. The substrate has a pressure sensitive material that is optically responsive in direct proportion to the amount of force imparted by the contact printing. The force of the contact printing causes the pressure sensitive material to form a pattern that is quantifiable to the amount of force. The pattern is then optically inspected and compared to sets of standards in order to quantify the amount of force that was used in printing. The thickness of the printed dielectric material is then calculated based on the quantified force by comparing to another set of standards. The electrical value of the printed material is calculated based on the calculated thickness of the printed dielectric material, the surface area of the printed dielectric material, and the dielectric constant of the dielectric material.

    摘要翻译： 一种印刷电子装置和用于确定装置的电气值的方法。 使用预设的力将电介质材料接触印刷在基板上。 衬底具有与由接触印刷施加的力成正比的光学响应的​​压敏材料。 接触印刷的力导致压敏材料形成可量化为力的图案。 然后对该图案进行光学检查，并与标准组进行比较，以量化印刷中使用的力的量。 然后通过与另一组标准相比较，基于量化力计算印刷电介质材料的厚度。 基于所计算的印刷电介质材料的厚度，印刷电介质材料的表面积和介电材料的介电常数来计算印刷材料的电值。

    THERMALLY ISOLATED VIA STRUCTURE
    15.
    发明申请
    THERMALLY ISOLATED VIA STRUCTURE 失效
    通过结构热隔离

    公开(公告)号：US20070143994A1

    公开(公告)日：2007-06-28

    申请号：US11681964

    申请日：2007-03-05

    申请人： Anthony Primavera ,  Steven Findell

    发明人： Anthony Primavera ,  Steven Findell

    IPC分类号： H01L21/331

    CPC分类号： H05K1/0271 ,  H05K1/0201 ,  H05K1/0269 ,  H05K1/0272 ,  H05K1/115 ,  H05K2201/0133 ,  H05K2201/0187 ,  H05K2201/0394 ,  H05K2201/062 ,  H05K2201/09036 ,  H05K2201/09063 ,  H05K2201/09509 ,  H05K2203/161 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49204

    摘要： This document discusses, among other things, a flexible circuit or other laminate comprising a first conductive layer and a second conductive layer disposed over the first conductive layer. An insulator is disposed between the first and second conductive layers. A conductive via extends through the insulator and electrically connects the first and second conductive layers. The laminate includes a channel in the insulator. In one option, the channel extends at least part way around the via. In another option, the channel extends at least part way between the first and second conductive layers. In another example, a method comprises providing a laminate including at least first and second conductive layers and an insulator disposed therebetween. A via is formed through the insulator. A channel is formed in the insulator at least part way around the via. The channel extends between the first and second conductive layers.

    摘要翻译： 本文件尤其涉及柔性电路或其它层压体，其包括设置在第一导电层上的第一导电层和第二导电层。 绝缘体设置在第一和第二导电层之间。 导电通孔延伸穿过绝缘体并电连接第一和第二导电层。 层压板包括绝缘体中的通道。 在一个选项中，通道至少部分地围绕通道延伸。 在另一选择中，通道至少部分地在第一和第二导电层之间延伸。 在另一示例中，一种方法包括提供包括至少第一和第二导电层以及设置在其间的绝缘体的层压体。 通孔通过绝缘体形成。 在绝缘体中至少部分地围绕通孔形成通道。 通道在第一和第二导电层之间延伸。

    Thermally isolated via structure
    16.
    发明授权
    Thermally isolated via structure 失效
    热隔离通孔结构

    公开(公告)号：US07205486B2

    公开(公告)日：2007-04-17

    申请号：US10892648

    申请日：2004-07-16

    申请人： Anthony Primavera ,  Steven P. Findell

    发明人： Anthony Primavera ,  Steven P. Findell

    IPC分类号： H01L23/48

    CPC分类号： H05K1/0271 ,  H05K1/0201 ,  H05K1/0269 ,  H05K1/0272 ,  H05K1/115 ,  H05K2201/0133 ,  H05K2201/0187 ,  H05K2201/0394 ,  H05K2201/062 ,  H05K2201/09036 ,  H05K2201/09063 ,  H05K2201/09509 ,  H05K2203/161 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49204

    摘要： This document discusses, among other things, a flexible circuit or other laminate comprising a first conductive layer and a second conductive layer disposed over the first conductive layer. An insulator is disposed between the first and second conductive layers. A conductive via extends through the insulator and electrically connects the first and second conductive layers. The laminate includes a channel in the insulator. In one option, the channel extends at least part way around the via. In another option, the channel extends at least part way between the first and second conductive layers. In another example, a method comprises providing a laminate including at least first and second conductive layers and an insulator disposed therebetween. A via is formed through the insulator. A channel is formed in the insulator at least part way around the via. The channel extends between the first and second conductive layers.

    摘要翻译： 本文件尤其涉及柔性电路或其它层压体，其包括设置在第一导电层上的第一导电层和第二导电层。 绝缘体设置在第一和第二导电层之间。 导电通孔延伸穿过绝缘体并电连接第一和第二导电层。 层压板包括绝缘体中的通道。 在一个选项中，通道至少部分地围绕通道延伸。 在另一选择中，通道至少部分地在第一和第二导电层之间延伸。 在另一示例中，一种方法包括提供包括至少第一和第二导电层以及设置在其间的绝缘体的层压体。 通孔通过绝缘体形成。 在绝缘体中至少部分地围绕通孔形成通道。 通道在第一和第二导电层之间延伸。

    Method of manufacturing ceramic laminated body
    18.
    发明授权
    Method of manufacturing ceramic laminated body 有权
    制造陶瓷层压体的方法

    公开(公告)号：US07156935B2

    公开(公告)日：2007-01-02

    申请号：US10481644

    申请日：2003-04-04

    申请人： Kazuo Kishida

    发明人： Kazuo Kishida

    IPC分类号： B32B38/04 ,  B32B38/10 ,  C03B29/00 ,  H05K3/46

    CPC分类号： H05K3/0052 ,  B28B11/14 ,  H01L21/481 ,  H05K1/0269 ,  H05K1/0306 ,  H05K3/4611 ,  H05K3/4629 ,  H05K3/4688 ,  H05K2201/09036 ,  H05K2203/0207 ,  H05K2203/161 ,  Y10T156/108 ,  Y10T156/1082

    摘要： Unfired first ceramic layers 11 and at least one unfired second ceramic layer 12 having a different color from the unfired first ceramic layers 11 are laminated to prepare an unfired ceramic laminate 13. Notches 14 are then formed on a surface of the unfired ceramic laminate 13 using the second ceramic layer 12 as a reference. The unfired ceramic laminate 13 is fired to provide a fired ceramic laminate 13a, which is then divided along the notches 14 into ceramic composites 13b. In this process, notches having the proper depth can be formed on the unfired ceramic laminate 13.

    摘要翻译： 将未烧制的第一陶瓷层11和与未烧制的第一陶瓷层11具有不同颜色的至少一个未烧成的第二陶瓷层12层压以制备未烧结的陶瓷层压体13。 然后使用第二陶瓷层12作为参考，在未焙烧的陶瓷层压体13的表面上形成凹口14。 烧制未煅烧的陶瓷层压体13，以提供一个烧制的陶瓷层压体13a，然后将其沿凹口14分成陶瓷复合材料13b。 在该方法中，可以在未烧结的陶瓷层压体13上形成具有适当深度的凹口。

    Overstress indication
    19.
    发明授权
    Overstress indication 失效
    过应力指示

    公开(公告)号：US07086291B2

    公开(公告)日：2006-08-08

    申请号：US10835030

    申请日：2004-04-29

    申请人： Joseph Anthony Holung ,  Noboru Kodama ,  Tin-Lup Wong

    发明人： Joseph Anthony Holung ,  Noboru Kodama ,  Tin-Lup Wong

    IPC分类号： G01B11/16

    CPC分类号： H05K1/0269 ,  H01L22/12 ,  H05K1/0271 ,  H05K2203/0271 ,  H05K2203/161 ,  H05K2203/163

    摘要： Devices and their subassemblies typically undergo stresses during manufacturing and testing processes and during general use. To provide visual indication of stress or strain levels endured, a preferred embodiment includes frangible material deposited on particular isolated areas of devices and/or their subassemblies. The frangible material, when applied according to one methodical embodiment, provides visible indication of overstrain as cracks in the frangible material deposits, and of non overstrain when cracks are not visible.

    摘要翻译： 设备及其组件通常在制造和测试过程中以及在一般使用过程中经受应力。 为了提供耐受应力或应变水平的视觉指示，优选实施例包括沉积在设备和/或其子组件的特定隔离区域上的易碎材料。 当根据一个方法实施例应用时，易碎材料提供了作为易碎材料沉积物中的裂纹的过度应变的可视指示，以及当不可见的裂纹时非易失性的材料。