Abstract:
An integrated device including a functional circuitry and a built-in self testing circuit for executing a structured test on the functional circuitry is proposed. The functional circuitry includes means for receiving input test values from the built-in self testing circuit and returning output test values to the built-in self testing circuit. In the solution of the invention, the built-in self testing circuit includes a memory for storing starting test values and expected test values, means for generating the input test values according to the starting test values, and means for determining a result of the structured test according to a comparison between the output test values and the expected test values.
Abstract:
A method for automatic gain control of an output signal generated from an input signal includes measuring power of the output signal. Measuring power of the output signal includes setting at least one power threshold, measuring a rate of crossing of the at least one power threshold by the output signal over an observation window, and deriving from the rate of crossing a measured power of the output signal. The method further includes providing a reference power, subtracting the measured power from the reference power to obtain an error signal, and mixing the input signal with the error signal. An analog-to-digital conversion is performed on a result of the mixing to obtain a gain-controlled output signal.
Abstract:
An embodiment of the present invention relates to an integrated memory system comprising at least a non-volatile memory and an automatic storage error corrector, and wherein the memory is connected to a controller by means of an interface bus. Advantageously, the system comprises in the memory circuit means, functionally independent, each being responsible for the correction of a predetermined storage error; at least one of said means generating a signal to ask a correction being external to the memory.
Abstract:
An effective Electric Wafer Sort (EWS) flow is implemented by expanding the functions of the micro-controller embedded in a FLASH EPROM memory device and of the integrated test structures. The architecture provides for executing test routines internally without involving any external complex or expensive test equipment to control the test program. The processes are executed by the onboard micro-controllers (that may be reading either from an embedded ROM or from a GLOBAL CACHE provided). Managing test routines by an internal process permits the device architecture to be transparent from a tester point of view, by purposely creating a standard interface with a set of defined commands and instructions to be interpreted by the on board microcontroller and internally executed.
Abstract:
A process wherein an insulating region is formed in a body at least around an array portion of a semiconductor body; a gate electrode of semiconductor material is formed on top of a circuitry portion of the semiconductor body; a first silicide protection mask is formed on top of the array portion; the gate electrode and the active areas of the circuitry portion are silicided and the first silicide protection mask is removed. The first silicide protection mask (is of polysilicon and is formed simultaneously with the gate electrode. A second silicide protection mask of dielectric material covering the first silicide protection mask is formed before silicidation of the gate electrode. The second silicide protection mask is formed simultaneously with spacers formed laterally to the gate electrode.
Abstract:
A method of processing digital video signals produced by a sensor that are to be presented on a viewfinder, the method involving: a first pair of processing operations for scaling and color interpolation; and a second pair of processing operations for the formation of a color matrix and for white balancing. The operations of at least one, and preferably of both of the pairs of processing operations are executed in a single step. The operation of white balancing is moreover performed only for one frame out of K frame in the frame sequence. The preferential application is in the construction of viewfinders for videocameras and digital still cameras.
Abstract:
A process for manufacturing a byte selection transistor for a matrix of non volatile memory cells organised in rows and columns integrated on a semiconductor substrate, each memory cell comprising a floating gate transistor and a selection transistor, the process providing the following steps: defining on a same semiconductor substrate respective active areas for the byte selection transistor, for the floating gate transistor and for the selection transistor split by portions of insulating layer; depositing a multilayer structure comprising at least a gate oxide layer, a first polysilicon layer, a dielectric layer on the whole substrate and a second polysilicon layer, characterised in that it comprises the following steps: removing through a traditional photolithographic technique the multilayer structure to form at least a couple of two bands developing substantially in a parallel way to the columns of the matrix of memory cells, the first band being effective to define the gate regions of the byte selection transistor and of the selection transistor, the second band being effective to define the gate region of the floating gate transistor, a portion of the first band further extending on the portion of insulating layer which is adjacent to the byte selection transistor, forming an opening in the portion up to expose the first polysilicon layer, forming a conductive layer in the opening to put said first polysilicon layer in electric contact with said second polysilicon layer.
Abstract:
Voltage booster device (3) such as to selectively assume an active status and a stand-by status, said device comprising: a first terminal (15) such as to assume a respective electric potential and associated to a first capacitor (16), a second terminal (10) associated to a second capacitor (11) and selectively connectable to the first terminal (15), characterised in that it also comprises circuital means (100) for discharging the first capacitor thus reducing in module the electrical potential of the first terminal (15), the circuital means being activated to functioning when said device in the stand-by status and the second terminal (10) is disconnected from said first terminal (15).
Abstract:
A process for forming trenches with an oblique profile and rounded top corners, including the steps of: in a semiconductor wafer, through a first polymerizing etch, forming depressions delimited by rounded top corners; and through a second polymerizing etch, opening trenches at the depressions. The second polymerizing etch is made in variable plasma conditions, so that the trenches have oblique walls with a constant slope.