公开(公告)号：US10109536B2

公开(公告)日：2018-10-23

申请号：US15589594

申请日：2017-05-08

Applicant: Infineon Technologies AG

Inventor： Christoph Glacer ,  Alfons Dehe ,  John Brueckner

IPC: H01L21/66 ,  H01L21/02 ,  H01L21/3205 ,  B81C99/00 ,  G01N3/08

Abstract: According to an embodiment, a micro-fabricated test structure includes a structure mechanically coupled between two rigid anchors and disposed above a substrate. The structure is released from the substrate and includes a test layer mechanically coupled between the two rigid anchors. The test layer includes a first region having a first cross-sectional area and a constricted region having a second cross-sectional area smaller than the first cross-sectional area. The structure also includes a first tensile stressed layer disposed on a surface of the test layer adjacent the first region.

公开(公告)号：US10104478B2

公开(公告)日：2018-10-16

申请号：US14941220

申请日：2015-11-13

Applicant: Infineon Technologies AG

Inventor： Christoph Glacer ,  Alfons Dehe

IPC: H04R19/04 ,  B81B3/00 ,  B81C1/00 ,  H04R3/00 ,  H04R7/12 ,  H04R19/00 ,  H04R31/00

Abstract: According to an embodiment, a method of operating a microelectromechanical systems (MEMS) transducer that has a membrane includes transducing between out-of-plane deflection of the membrane and voltage on a first pair of electrostatic drive electrodes using the first pair of electrostatic drive electrodes. The first pair of electrostatic drive electrodes is formed on the membrane extending in an out-of-plane direction and form a variable capacitance between the first pair of electrostatic drive electrodes.

公开(公告)号：US20180222749A1

公开(公告)日：2018-08-09

申请号：US15885401

申请日：2018-01-31

Applicant: Infineon Technologies AG

Inventor： Alfons Dehe

IPC: B81C1/00 ,  B81B3/00

CPC classification number: B81C1/00158 ,  B81B3/0005 ,  B81B2201/0235 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2203/0127 ,  B81B2203/0315 ,  B81B2203/04 ,  H04R7/10 ,  H04R19/04 ,  H04R2201/003

Abstract: A membrane component comprises a membrane structure comprising an electrically conductive membrane layer. The electrically conductive membrane layer has a suspension region and a membrane region. In addition, the suspension region of the electrically conductive membrane layer is arranged on an insulation layer. Furthermore, the insulation layer is arranged on a carrier substrate. Moreover, the membrane component comprises a counterelectrode structure. A cavity is arranged vertically between the counterelectrode structure and the membrane region of the electrically conductive membrane layer. In addition, an edge of the electrically conductive membrane layer projects laterally beyond an edge of the insulation layer by more than half of a vertical distance between the electrically conductive membrane layer and the counterelectrode structure.

公开(公告)号：US10017379B2

公开(公告)日：2018-07-10

申请号：US15492193

申请日：2017-04-20

Applicant: Infineon Technologies AG

Inventor： Vijaye Kumar Rajaraman ,  Yonsuang Arnanthigo ,  Alfons Dehe ,  Stefan Kolb

IPC: H01L21/02 ,  B81B7/02 ,  G01N27/22 ,  B81B3/00 ,  B81C1/00 ,  H04R19/00 ,  H04R19/04 ,  H04R31/00

CPC classification number: B81B7/02 ,  B81B3/0018 ,  B81B2201/0214 ,  B81B2201/0257 ,  B81B2201/0278 ,  B81C1/00166 ,  B81C1/00182 ,  B81C1/00206 ,  G01N27/223 ,  H04R19/005 ,  H04R19/04 ,  H04R31/003 ,  H04R2201/003

Abstract: According to an embodiment, a microelectromechanical systems (MEMS) transducer includes a substrate with a first cavity that passes through the substrate from a backside of the substrate. The MEMS transducer also includes a perforated first electrode plate overlying the first cavity on a topside of the substrate, a second electrode plate overlying the first cavity on the topside of the substrate and spaced apart from the perforated first electrode plate by a spacing region, and a gas sensitive material in the spacing region between the perforated first electrode plate and the second electrode plate. The gas sensitive material has an electrical property that is dependent on a concentration of a target gas.

公开(公告)号：US20180052042A1

公开(公告)日：2018-02-22

申请号：US15679162

申请日：2017-08-17

Applicant: Infineon Technologies AG

Inventor： Alfons Dehe ,  Manuel Dorfmeister ,  Ulrich Schmid ,  Michael Schneider

IPC: G01H11/08 ,  H01L41/083

Abstract: An acoustic wave sensor may include: a continuous membrane deflectable by acoustic waves to be detected, and a piezoelectric layer provided on the membrane and including a plurality of piezoelectric layer portions respectively equipped with at least two individual electric contact structures configured to electrically connect the respective piezoelectric layer portions. Electric contact structures associated with different piezoelectric layer portions may be separated from each other.

公开(公告)号：US20180029878A1

公开(公告)日：2018-02-01

申请号：US15662389

申请日：2017-07-28

Applicant: Infineon Technologies AG

Inventor： Alfons Dehe ,  Matthias Friedrich Herrmann ,  Johannes Manz

IPC: B81B7/00 ,  B81C1/00 ,  B81B3/00

CPC classification number: B81B7/0061 ,  B81B3/0021 ,  B81B2201/0257 ,  B81B2201/033 ,  B81B2203/0127 ,  B81B2203/04 ,  B81C1/00158 ,  B81C1/00166

Abstract: A microelectromechanical device, a microelectromechanical system, and a method of manufacturing a microelectromechanical device, wherein the microelectromechanical device may include: a substrate; a diaphragm mounted to the substrate; a first electrode mounted to the diaphragm; a second electrode mounted to the substrate; wherein the first electrode is laterally adjacent to the second electrode; and wherein the diaphragm is arranged over a gap between the first electrode and the second electrode.

公开(公告)号：US09876446B2

公开(公告)日：2018-01-23

申请号：US14962949

申请日：2015-12-08

Applicant: Infineon Technologies AG

Inventor： Alfons Dehe

IPC: H01L21/00 ,  H02N99/00 ,  H04R7/10 ,  H04R31/00 ,  G01N21/956 ,  H01J37/26 ,  H02N1/08

CPC classification number: H02N99/00 ,  G01N21/956 ,  H01J37/26 ,  H02N1/08 ,  H04R7/10 ,  H04R19/04 ,  H04R31/003 ,  Y10T428/24281

Abstract: A plate, a transducer, a method for making a transducer, and a method for operating a transducer are disclosed. An embodiment comprises a plate comprising a first material layer comprising a first stress, a second material layer arranged beneath the first material layer, the second material layer comprising a second stress, an opening arranged in the first material layer and the second material layer, and an extension extending into opening, wherein the extension comprises a portion of the first material layer and a portion of the second material layer, and wherein the extension is curved away from a top surface of the plate based on a difference in the first stress and the second stress.

公开(公告)号：US20170325013A1

公开(公告)日：2017-11-09

申请号：US15587535

申请日：2017-05-05

Applicant: Infineon Technologies AG

Inventor： Alfons Dehe ,  David Tumpold ,  Gueclue Onaran

IPC: H04R1/08 ,  G01N29/02 ,  G01N29/24 ,  H04R1/04

CPC classification number: H04R1/08 ,  G01N29/02 ,  G01N29/2418 ,  H04R1/04 ,  H04R19/005 ,  H04R19/04 ,  H04R29/004 ,  H04R31/00 ,  H04R2201/003 ,  H04R2201/029 ,  H04R2499/11

Abstract: A device for detecting acoustic waves may include a housing having a housing wall with an inner surface, and an acoustic wave sensor provided at least partially inside the housing and configured to detect acoustic waves. The inner surface of the housing wall is made in at least half of its entire area of a thermally insulating material.

公开(公告)号：US20170325012A1

公开(公告)日：2017-11-09

申请号：US15586328

申请日：2017-05-04

Applicant: Infineon Technologies AG

Inventor： Alfons Dehe ,  David Tumpold ,  Gueclue Onaran

IPC: H04R1/04 ,  H04R19/04 ,  H04R29/00

CPC classification number: H04R1/04 ,  G01N29/02 ,  G01N29/2418 ,  H04R1/08 ,  H04R19/005 ,  H04R19/04 ,  H04R29/004 ,  H04R31/00 ,  H04R2201/003 ,  H04R2201/029 ,  H04R2499/11

Abstract: A device for detecting acoustic waves may include a housing having a housing wall with an inner surface, and an acoustic wave sensor provided at least partially inside the housing and configured to detect acoustic waves. The inner surface of the housing wall is made in at least half of its entire area of a thermally insulating material.

公开(公告)号：US20170238107A1

公开(公告)日：2017-08-17

申请号：US15044663

申请日：2016-02-16

Applicant: Infineon Technologies AG

Inventor： Arnaud Walther ,  Alfons Dehe

IPC: H04R29/00 ,  G01K7/02 ,  H04R3/00 ,  H04R19/04 ,  B81C1/00 ,  H04R19/00

CPC classification number: H04R29/004 ,  B81B7/02 ,  B81B2201/0257 ,  B81B2201/0278 ,  B81C1/00158 ,  G01K1/14 ,  G01K7/02 ,  G01K7/028 ,  H04R3/00 ,  H04R7/10 ,  H04R19/005 ,  H04R19/04 ,  H04R2307/027 ,  H04R2499/11

Abstract: A MEMS microphone and a method for manufacturing a MEMS microphone are disclosed. Embodiments of the invention provide a MEMS microphone including a MEMS microphone structure having at least one counter electrode structure and a diaphragm structure deflectable with respect to the counter electrode structure and a thermocouple arranged at the MEMS microphone structure.