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    Wrinkle-resistant adhesive construction
    213.
    发明授权
    Wrinkle-resistant adhesive construction 有权
    防皱胶结构

    公开(公告)号：US06511743B1

    公开(公告)日：2003-01-28

    申请号：US09657399

    申请日：2000-09-08

    Applicant: Chan U. Ko ,  Hsiao K. Chuang ,  Ronald Ugolick

    Inventor： Chan U. Ko ,  Hsiao K. Chuang ,  Ronald Ugolick

    IPC: B32B712

    CPC classification number: C09J153/00 ,  C08L53/02 ,  C08L2666/02 ,  C08L2666/24 ,  C09J7/22 ,  C09J7/243 ,  C09J7/38 ,  C09J7/387 ,  C09J153/02 ,  C09J2201/36 ,  C09J2203/334 ,  C09J2423/006 ,  C09J2453/00 ,  Y10T428/28 ,  Y10T428/2848 ,  Y10T428/2857 ,  Y10T428/2883

    Abstract: A multilayer PSA construction includes a facestock, a hazy, first adhesive layer adjacent the facestock, and a PSA layer adjacent the first adhesive layer, and is protected until use by a release liner. The first adhesive layer includes an immiscible blend of a first elastomer having a first glass transition temperature and forming a continuous phase, and a second elastomer forming a discontinuous phase. The second elastomer has a glass transition temperature greater than the first glass transition temperature. The first adhesive layer also contains a tackifying component, which is preferentially soluble in the discontinuous phase. The PSA layer has a composition different from the first adhesive layer and is formed of at least one tackified elastomer that provides a measurable third maximum glass transition temperature, which is less than the second glass transition temperature. The multilayer PSA construction exhibits reduced migration of tackifiers and plasticizers over time.

    Abstract translation: 多层PSA结构包括与面材相邻的面材，模糊的第一粘合剂层和邻近第一粘合剂层的粘合剂层，并且被保护直到被剥离衬垫使用。 第一粘合剂层包括具有第一玻璃化转变温度并形成连续相的第一弹性体和形成不连续相的第二弹性体的不混溶共混物。 第二弹性体的玻璃化转变温度大于第一玻璃化转变温度。 第一粘合剂层还含有优选溶解在不连续相中的增粘组分。 PSA层具有不同于第一粘合剂层的组成，并且由至少一种增强的弹性体形成，其提供小于第二玻璃化转变温度的可测量的第三最大玻璃化转变温度。 多层PSA结构显示出随着时间的推移，增粘剂和增塑剂的迁移减少。

    Glue strip for book binding
    214.
    发明申请
    Glue strip for book binding 审中-公开
    胶带用于书籍装订

    公开(公告)号：US20030000642A1

    公开(公告)日：2003-01-02

    申请号：US10184917

    申请日：2002-07-01

    Inventor： Yuval Dim ,  Gil Rosenfeld

    IPC: C09J007/00 ,  B32B031/20

    CPC classification number: B42D3/002 ,  B42C9/0056 ,  C09J7/10 ,  C09J2201/36 ,  C09J2201/61 ,  Y10T428/2813

    Abstract: According to some embodiments of the invention, a method for bookbinding is provided. The method comprises placing a strip of hot-melt adhesive tape between a spine of a book block and a central region of a cover. The hot-melt adhesive tape comprises a first layer having a first hot-melt adhesive substance having a first viscosity and a second layer having a second hot-melt adhesive substance having a second viscosity that is higher than the first viscosity when heated. The strip of the hot-melt adhesive is placed such that the first layer of the tape is positioned next to the spine and the second layer is positioned next to the central region of the cover.

    Abstract translation: 根据本发明的一些实施例，提供了一种装订方法。 该方法包括将热熔胶带条放置在书芯的脊柱和盖的中心区域之间。 热熔胶带包括具有第一粘度的第一热熔粘合物质的第一层和具有第二粘度的第二层的第二层，所述第二热熔粘合物质的第二粘度比加热时的第一粘度高。 将热熔粘合剂的条放置成使得带的第一层位于脊柱旁边，而第二层位于盖的中心区域附近。

    Method for thermally releasing adherend and apparatus for thermally releasing adherend
    215.
    发明申请
    Method for thermally releasing adherend and apparatus for thermally releasing adherend 审中-公开
    粘合剂热释放方法和用于热脱模粘合体的装置

    公开(公告)号：US20020195199A1

    公开(公告)日：2002-12-26

    申请号：US10131178

    申请日：2002-04-25

    Applicant: NITTO DENKO CORPORATION

    Inventor： Seiji Izutani ,  Michirou Kawanishi ,  Yukio Arimitsu

    IPC: B32B001/00

    CPC classification number: H01L21/6835 ,  C09J7/38 ,  C09J2201/36 ,  C09J2205/11 ,  H01L21/67132 ,  H01L21/6836 ,  H01L2221/68322 ,  H01L2221/68327 ,  H01L2924/19041 ,  Y10T156/1147 ,  Y10T156/1153 ,  Y10T156/1184 ,  Y10T156/1911 ,  Y10T156/1967

    Abstract: The invention provides a method for thermally releasing an adherend, which comprises selectively releasing one or some of a plurality of substances adhered on a thermally releasable pressure-sensitive adhesive sheet having a thermally expandable layer containing therein thermo-expandable microspheres, by partly heating the pressure-sensitive adhesive sheet using a heating unit capable of partly heating the pressure-sensitive adhesive sheet. This thermally releasing method may further involve a step of cutting the substance adhered to the pressure-sensitive adhesive sheet. In this occasion, the heating unit has a heating portion of a shape in conformity with the shape of the adherend to be released, and may be provided on at lease one of the side to which the adherend is adhered and the opposite side thereto of the pressure-sensitive adhesive sheet.

    Abstract translation: 本发明提供了一种用于热释放被粘物的方法，其包括通过部分加热压力来选择性地释放粘附在具有热可膨胀层的热可释放压敏粘合片上的多种物质中的一种或一种，其中包含热可膨胀微球 使用能够部分加热压敏粘合片的加热单元的敏感性粘合片。 该热释放方法还可以包括切割附着在压敏粘合片上的物质的步骤。 在这种情况下，加热单元具有与待被剥离的被粘物的形状一致的加热部，并且可以设置在被粘物侧的至少一侧和与被粘物相反的一侧 压敏粘合片。

    Process for the production of thinned wafer
    216.
    发明申请
    Process for the production of thinned wafer 审中-公开
    生产薄片晶圆的工艺

    公开(公告)号：US20020127821A1

    公开(公告)日：2002-09-12

    申请号：US10025891

    申请日：2001-12-26

    Inventor： Kazuyuki Ohya ,  Isao Tanaka

    IPC: H01L021/30 ,  H01L021/46

    CPC classification number: H01L21/67132 ,  C09J7/10 ,  C09J2201/134 ,  C09J2201/36 ,  C09J2203/326 ,  C09J2431/00 ,  C09J2467/00 ,  H01L21/304 ,  H01L21/6835 ,  H01L2221/68327

    Abstract: A process for the production of a thinned wafer, comprising bonding the circuit surface (surface A) of a semiconductor wafer (a) to a holding substrate (b) with an adhesive film (c), grinding and polishing the back surface (surface B) of the semiconductor wafer to thin the semiconductor wafer, carrying out the metallization of the back surface (surface B) and the like as required, and then separating the thinned wafer from the holding substrate (b), wherein a thermoplastic resin film is used as the adhesive film (c) and the above bonding of the circuit surface (surface A) of the semiconductor wafer (a) to the holding substrate (b) is carried out at a bonding temperature selected from the range of from null10null C. to null120null C. of glass transition point of the thermoplastic resin film or the range of from null40null C. to null20null C. of melting point of the thermoplastic resin film.

    Abstract translation: 一种用于生产薄片晶片的方法，包括用半导体晶片（a）的电路表面（表面A）与粘合剂膜（c）粘合到保持基板（b）上，研磨和抛光背面（表面B ），从而使半导体晶片变薄，根据需要进行后表面（表面B）等的金属化，然后将薄片晶片与保持基板（b）分离，使用热塑性树脂膜 作为粘合膜（c），半导体晶片（a）的电路面（表面A）与保持基板（b）的上述接合在选自+ 10℃的接合温度下进行 至+ 120℃的热塑性树脂膜的玻璃化转变温度或-40℃〜+ 20℃的范围。

    Adhesive transfer device
    217.
    发明申请
    Adhesive transfer device 有权
    粘合剂输送装置

    公开(公告)号：US20020102402A1

    公开(公告)日：2002-08-01

    申请号：US10051150

    申请日：2002-01-22

    Applicant: XYRON, INC.

    Inventor： Carl D. Neuburger ,  Franklin C. Bradshaw ,  Robert V. O'Keefe

    IPC: B32B009/04 ,  B32B009/00 ,  B32B021/02 ,  B32B027/02

    CPC classification number: B32B37/226 ,  B32B37/26 ,  B32B2037/0061 ,  B32B2041/06 ,  C09J7/245 ,  C09J7/38 ,  C09J7/385 ,  C09J2201/36 ,  C09J2201/606 ,  Y10S428/914 ,  Y10T156/1741 ,  Y10T428/14 ,  Y10T428/1405 ,  Y10T428/1462 ,  Y10T428/1471 ,  Y10T428/1476 ,  Y10T428/1481 ,  Y10T428/1495 ,  Y10T428/2486 ,  Y10T428/28 ,  Y10T428/2839 ,  Y10T428/2848 ,  Y10T428/2861 ,  Y10T428/2891 ,  Y10T428/2984

    Abstract: The present invention relates to an adhesive transfer device for selectively making a repositionably adherable substrate from a selected substrate. The device comprises a base substrate, a layer of pressure-sensitive repositionable adhesive disposed on the base substrate, a layer of pressure-sensitive permanent adhesive disposed adjacent to the repositionable adhesive layer opposite the base substrate, and structure providing a release surface. The release surface is removably engaged with the permanent adhesive layer opposite the repositionable adhesive layer and the base substrate so as to cover the permanent adhesive layer. The nature of the release surface is such that the base substrate and the structure providing the release surface can be moved apart from one another so as to separate the release surface from the permanent adhesive layer and leave both of the adhesive layers on the base substrate with the permanent adhesive layer exposed, thereby enabling the selected substrate to be adhesively bonded to the exposed permanent adhesive layer. The adhesive layers are provided such that, after the selected substrate has been adhesively bonded to the permanent adhesive layer, the base substrate and the selected substrate can be moved apart from one another so as to separate the base substrate from the repositionable adhesive layer and leaving both the adhesive layers on the selected substrate with the repositionable adhesive layer exposed, thereby allowing the selected substrate to be repositionably adhered to a contact surface by engaging the exposed repositionable adhesive layer with the contact surface. A number of various devices embodying the principles of the present invention are disclosed in the present application, including a tablet having a plurality of adhesive transfer sheets, an adhesive transfer cartridge for use with an adhesive transfer apparatus, and a dispenser for dispensing a length of the base substrate.

    Abstract translation: 本发明涉及一种用于从所选择的基底选择性地制造可重新定位的可粘合的基底的粘合剂转移装置。 该装置包括基底，设置在基底基底上的压敏可重定位粘合剂层，与基底基板相对的可重新定位的粘合剂层相邻设置的压敏永久性粘合剂层和提供释放表面的结构。 释放表面可移除地与永久性粘合剂层相对地与可重新定位的粘合剂层和基底基板相接合以覆盖永久粘合剂层。 释放表面的性质使得基底基材和提供释放表面的结构可以彼此分开移动，以将释放表面与永久性粘合剂层分离，并将两个粘合剂层留在基底基材上， 永久性粘合剂层暴露，从而使所选择的基材能够与暴露的永久性粘合剂层粘合。 提供粘合剂层，使得在所选择的基底已经粘附到永久性粘合剂层之后，基底基板和所选择的基底可以彼此分开移动，以便将基底基材与可重新定位的粘合剂层分离并留下 在所选择的基底上的可再定位粘合剂层的粘合剂层都暴露出来，从而通过将暴露的可重新定位的粘合剂层与接触表面接合而允许所选择的基材可重新定位地粘附到接触表面。 在本申请中公开了体现本发明原理的多种装置，包括具有多个粘合剂转移片的片剂，用于粘合剂转移装置的粘合剂转移盒，以及用于分配长度的 基底。

    Adhesive transfer device for making repositionably adherable substrates
    218.
    发明授权
    Adhesive transfer device for making repositionably adherable substrates 有权

    公开(公告)号：US06403185B1

    公开(公告)日：2002-06-11

    申请号：US09343676

    申请日：1999-06-30

    Applicant: Carl D. Neuburger ,  Franklin C. Bradshaw ,  Robert V. O'Keefe

    Inventor： Carl D. Neuburger ,  Franklin C. Bradshaw ,  Robert V. O'Keefe

    IPC: B32B710

    CPC classification number: B32B37/226 ,  B32B37/26 ,  B32B2037/0061 ,  B32B2041/06 ,  C09J7/245 ,  C09J7/38 ,  C09J7/385 ,  C09J2201/36 ,  C09J2201/606 ,  Y10S428/914 ,  Y10T156/1741 ,  Y10T428/14 ,  Y10T428/1405 ,  Y10T428/1462 ,  Y10T428/1471 ,  Y10T428/1476 ,  Y10T428/1481 ,  Y10T428/1495 ,  Y10T428/2486 ,  Y10T428/28 ,  Y10T428/2839 ,  Y10T428/2848 ,  Y10T428/2861 ,  Y10T428/2891 ,  Y10T428/2984

    Abstract: The present invention relates to an adhesive transfer device for selectively making a repositionably adherable substrate from a selected substrate. The device comprises a base substrate, a layer of pressure-sensitive repositionable adhesive disposed on the base substrate, a layer of pressure-sensitive permanent adhesive disposed adjacent to the repositionable adhesive layer opposite the base substrate, and structure providing a release surface. The release surface is removably engaged with the permanent adhesive layer opposite the repositionable adhesive layer and the base substrate so as to cover the permanent adhesive layer. The nature of the release surface is such that the base substrate and the structure providing the release surface can be moved apart from one another so as to separate the release surface from the permanent adhesive layer and leave both of the adhesive layers on the base substrate with the permanent adhesive layer exposed, thereby enabling the selected substrate to be adhesively bonded to the exposed permanent adhesive layer. The adhesive layers are provided such that, after the selected substrate has been adhesively bonded to the permanent adhesive layer, the base substrate and the selected substrate can be moved apart from one another so as to separate the base substrate from the repositionable adhesive layer and leaving both the adhesive layers on the selected substrate with the repositionable adhesive layer exposed, thereby allowing the selected substrate to be repositionably adhered to a contact surface by engaging the exposed repositionable adhesive layer with the contact surface. A number of various devices embodying the principles of the present invention are disclosed in the present application, including a tablet having a plurality of adhesive transfer sheets, an adhesive transfer cartridge for use with an adhesive transfer apparatus, and a dispenser for dispensing a length of the base substrate.

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