Abstract:
A magnetoresistive random-access memory (MRAM) integration compatible with shrinking device technologies includes a magnetic tunnel junction (MTJ) formed in a common interlayer metal dielectric (IMD) layer with one or more logic elements. The MTJ is connected to a bottom metal line in a bottom IMD layer and a top via connected to a top IMD layer. The MTJ substantially extends between one or more bottom cap layers configured to separate the common IMD layer and the bottom IMD layer and one or more top cap layers configured to separate the common IMD layer and the top IMD layer. The MTJ can include a top electrode to connect to the top via or be directly connected to the top via through a hard mask for smaller device technologies. The logic elements include vias, metal lines, and semiconductor devices.
Abstract:
A method includes applying a programming voltage to a drain of an access transistor, where a source of the access transistor is coupled to a drain region of a one-time programmable (OTP) device. The method also includes applying a first voltage to a gate of the OTP device and a second voltage to a terminal of the OTP device to bias a channel region of the OTP device, where the first voltage and the second voltage are substantially equal.
Abstract:
Reverse complement MTJ bit cells employing shared source lines are disclosed. In one aspect, a 2T2MTJ reverse complement bit cell employing shared source line is provided. Bit cell includes first MTJ and second MTJ. Value of first MTJ is complement of value of second MTJ. First bit line is coupled to top layer of first MTJ, and first electrode of first access transistor is coupled to bottom layer of first MTJ. Second bit line is coupled to bottom layer of second MTJ, and first electrode of second access transistor is coupled to top layer of second MTJ. Word line is coupled to second electrode of first access transistor and second access transistor. Shared source line is coupled to third electrode of first access transistor and second access transistor. Employing shared source line allows the bit cell to be designed with reduced parasitic resistance.
Abstract:
An advanced metal-nitride-oxide-silicon (MNOS) multiple time programmable (MTP) memory is provided. In an example, an apparatus includes a two field effect transistor (2T field FET) metal-nitride-oxide-silicon (MNOS) MTP memory. The 2T field FET MNOS MTP memory can include an interlayer dielectric (ILD) oxide region that is formed on a well and separates respective gates of first and second transistors from the well. A control gate is located between the respective gates of the first and second transistors, and a silicon-nitride-oxide (SiN) region is located between a metal portion of the control gate and a portion of the ILD oxide region.
Abstract:
A volatile and one-time program (OTP) compatible asymmetric memory cell may include a first pull-up transistor having a first threshold voltage. The asymmetric memory cell may also include a second pull-up transistor having a second threshold voltage that differs from the first threshold voltage. The asymmetric memory cell may further include a switch coupled to a well of the first pull-up transistor and the second pull-up transistor to alternate between a program voltage (Vpg) and a power supply voltage. The asymmetric memory cell may also include a peripheral switching circuit to control programming of the asymmetric memory cell.
Abstract:
A device includes a first magnetic tunnel junction (MTJ) element having a first read margin and a second MTJ element having a second read margin. The first read margin is greater than twice the second read margin. The device also includes an access transistor coupled between the first MTJ element and the second MTJ element. A gate of the access transistor is coupled to a word line. The first MTJ element, the second MTJ element, and the access transistor form a multi-bit spin torque transfer magnetoresistive random access memory (STT-MRAM) memory cell.
Abstract:
A device includes a first magnetic tunnel junction (MTJ) element having a first read margin and a second MTJ element having a second read margin. The first read margin is greater than twice the second read margin. The device also includes an access transistor coupled between the first MTJ element and the second MTJ element. A gate of the access transistor is coupled to a word line. The first MTJ element, the second MTJ element, and the access transistor form a multi-bit spin torque transfer magnetoresistive random access memory (STT-MRAM) memory cell.
Abstract:
An apparatus comprises a first fin field effect transistor (FinFET) device extending from a surface of a first etch stop layer. The apparatus also comprises a second FinFET device extending from a surface of a second etch stop layer. A first compound layer is interposed between the first etch stop layer and the second etch stop layer.
Abstract:
An apparatus includes a semiconductor transistor structure. The semiconductor transistor structure includes dielectric material, a channel region, a gate, a source overlap region, and a drain overlap region. The source overlap region is biasable to cause a first voltage difference between the source overlap region and the gate to exceed a breakdown voltage of the dielectric material. The drain overlap region is biasable to cause a second voltage difference between the drain overlap region and the gate to exceed the breakdown voltage. The apparatus includes a well line coupled to a body of the semiconductor transistor. The apparatus includes circuitry configured to apply a voltage to the well line to prevent a breakdown condition between the channel region and the gate.
Abstract:
A memory cell includes a capacitor that includes a first metal layer and a second metal layer. The capacitor includes a ferroelectric layer disposed between the first metal layer and the second metal layer. The ferroelectric layer is a single layer of a bi-stable asymmetric crystalline material.