公开(公告)号：US07061119B1

公开(公告)日：2006-06-13

申请号：US09543034

申请日：2000-04-05

Applicant: Tongbi Jiang

Inventor： Tongbi Jiang

IPC: H01L23/48 ,  H01L29/40

CPC classification number: H01L24/32 ,  H01L23/13 ,  H01L23/3121 ,  H01L23/4951 ,  H01L24/48 ,  H01L24/83 ,  H01L2224/05599 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/2919 ,  H01L2224/32014 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83194 ,  H01L2224/8385 ,  H01L2224/85399 ,  H01L2224/92147 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10155 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An apparatus and method for preventing damage to tape attachment semiconductor assemblies due to encapsulation filler particles causing damage to a semiconductor die active surface and/or to a corresponding semiconductor substrate surface by providing an adhesive tape which extends across areas of contact between the semiconductor die active surface and the semiconductor substrate. The present invention also includes extending the adhesive tape beyond the areas of contact between the semiconductor die active surface and the semiconductor substrate to provide a visible surface of visual inspection of proper adhesive tape placement.

Abstract translation: 一种用于防止由于包封填料颗粒导致对半导体管芯有源表面和/或相应的半导体衬底表面的损坏而损坏带附接半导体组件的装置和方法，该粘合带延伸穿过半导体管芯激活的接触区域 表面和半导体衬底。 本发明还包括将粘合带延伸超过半导体管芯有源表面和半导体衬底之间的接触区域，以提供目视检查合适的胶带放置的可视表面。

公开(公告)号：US07005731B2

公开(公告)日：2006-02-28

申请号：US10801206

申请日：2004-03-16

Applicant: Tongbi Jiang ,  Jerrold L. King

Inventor： Tongbi Jiang ,  Jerrold L. King

IPC: H01L23/495

CPC classification number: H01L24/06 ,  H01L21/4821 ,  H01L23/495 ,  H01L23/4951 ,  H01L23/49579 ,  H01L23/49582 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/83 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05556 ,  H01L2224/06136 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/48664 ,  H01L2224/48699 ,  H01L2224/48764 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/85464 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/10162 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H05K3/3426 ,  H01L2924/0665 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/3512

Abstract: A conductive plastic lead frame and method of manufacturing the same, suitable for use in IC packaging. In a preferred embodiment, the lead frame is constructed of a plastic or polymer based lead frame structure with an intrinsic conductive polymer coating. In a second embodiment, the lead frame is a composite plastic or polymeric material intermixed with an intrinsic conductive polymer coating.

Abstract translation: 导电塑料引线框及其制造方法，适用于IC封装。 在优选实施例中，引线框架由具有本征导电聚合物涂层的基于塑料或聚合物的引线框架结构构成。 在第二实施例中，引线框架是与本征导电聚合物涂层混合的复合塑料或聚合材料。

公开(公告)号：US20060033010A1

公开(公告)日：2006-02-16

申请号：US11257041

申请日：2005-10-25

Applicant: Tongbi Jiang ,  Michael Connell ,  Jin Li

Inventor： Tongbi Jiang ,  Michael Connell ,  Jin Li

IPC: H01L27/00

CPC classification number: H01L27/14627 ,  B33Y80/00

Abstract: An improved image sensor wherein a first micro-lens array comprised of one or more micro-lenses is positioned over a cavity such that incoming light is focused on the photo sensors of the image sensor. The first micro-lens array may collimate and focus incoming light onto the photo sensors of the image sensor, or may collimate incoming light and direct it to a second micro-lens array which then focuses the light onto the photo sensors. A method of fabricating the improved image sensor is also provided wherein the cavity and first micro-lens array are formed by use of a sacrificial material.

公开(公告)号：US06982177B2

公开(公告)日：2006-01-03

申请号：US10900776

申请日：2004-07-27

Applicant: Chad A. Cobbley ,  John VanNortwick ,  Bret K. Street ,  Tongbi Jiang

Inventor： Chad A. Cobbley ,  John VanNortwick ,  Bret K. Street ,  Tongbi Jiang

IPC: G01R31/26

CPC classification number: G01R1/0483 ,  Y10T29/4913 ,  Y10T29/49144

Abstract: Flip-chip semiconductor assemblies, each including integrated circuit (IC) dice and an associated substrate, are electrically tested before encapsulation using an in-line or in situ test socket or probes at a die-attach station. Those assemblies using “wet” quick-cure epoxies for die attachment may be tested prior to the epoxy being cured by pressing the integrated circuit (IC) dice against interconnection points on the substrate for electrical connection, while those assemblies using “dry” epoxies may be cured prior to testing. In either case, any failures in the dice or in the interconnections between the dice and the substrates can be easily fixed, and the need for the use of known-good-die (KGD) rework procedures during repair is eliminated.

Abstract translation: 每个包括集成电路（IC）裸片和相关衬底的倒装芯片半导体组件在封装之前使用在线或原位测试插座或芯片附着站的探针进行电测试。 在通过将集成电路（IC）芯片压在基板上的互连点以进行电连接的环氧树脂固化之前，可以测试使用“湿”快速固化环氧树脂进行芯片附接的那些组件，而使用“干”环氧树脂的那些组件 在测试之前进行治愈。 在任一种情况下，骰子或骰子与基板之间的互连中的任何故障都可以很容易地固定，并且消除了在维修期间使用已知好模具（KGD）返工程序的需要。

公开(公告)号：US20050285279A1

公开(公告)日：2005-12-29

申请号：US11146889

申请日：2005-06-06

Applicant: Tongbi Jiang

Inventor： Tongbi Jiang

IPC: H01L23/12 ,  H01L21/44 ,  H01L21/58 ,  H01L21/60 ,  H01L23/48 ,  H01L23/498

CPC classification number: H01L24/16 ,  H01L23/49827 ,  H01L24/11 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/13099 ,  H01L2224/16237 ,  H01L2224/29013 ,  H01L2224/29036 ,  H01L2224/2919 ,  H01L2224/30131 ,  H01L2224/32014 ,  H01L2224/48 ,  H01L2224/73203 ,  H01L2224/81136 ,  H01L2224/81192 ,  H01L2224/81903 ,  H01L2224/83194 ,  H01L2224/8385 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01045 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2224/45099

Abstract: A semiconductor package structure for a ball grid array type package using a plurality of pieces of adhesive elastomer film to attach a semiconductor die to a substrate having conductive traces in order to alleviate thermal mismatch stress between the semiconductor die and the printed circuit board to which the packaged device is soldered, while maintaining the reliability of the packaged device itself.

公开(公告)号：US20050274993A1

公开(公告)日：2005-12-15

申请号：US10373785

申请日：2003-02-27

Applicant: Tongbi Jiang ,  Michael Connell ,  Jin Li

Inventor： Tongbi Jiang ,  Michael Connell ,  Jin Li

IPC: H01L27/146 ,  H01L31/062 ,  H01L31/113

CPC classification number: H01L27/14625 ,  H01L27/14621 ,  H01L27/14623 ,  H01L27/14643 ,  H01L27/14685

Abstract: The subject invention is directed to use of photoconductors as conductors of light to photo diodes in a CMOS chip, wherein said photoconductors are separated by at least one low refractive index material (i.e. air). The present invention offers advantages over previous CMOS imaging technology, including enhanced light transmission to photo diodes. The instant methods for producing a CMOS imaging device and CMOS imager system involve minimal power loss. Since no lens is required, the invention eliminates concerns about radius limitation and about damaging lenses during die attach, backgrind, and mount. The invention also provides little or no cross talk between photo diodes.

Abstract translation: 本发明涉及使用光电导体作为CMOS芯片中的光导体的光导体，其中所述光导体由至少一种低折射率材料（即空气）分开。 本发明提供了优于先前CMOS成像技术的优点，包括对光电二极管的增强的光传输。 用于制造CMOS成像装置和CMOS成像器系统的即时方法涉及最小的功率损耗。 由于不需要镜头，本发明消除了对于半径限制以及关于在芯片附着，后研磨和安装期间损坏的透镜的担忧。 本发明还提供了很少或没有光二极管之间的串扰。

公开(公告)号：US06962826B2

公开(公告)日：2005-11-08

申请号：US10900771

申请日：2004-07-27

Applicant: Chad A. Cobbley ,  John VanNortwick ,  Bret K. Street ,  Tongbi Jiang

Inventor： Chad A. Cobbley ,  John VanNortwick ,  Bret K. Street ,  Tongbi Jiang

IPC: G01R1/04 ,  H01L21/66

CPC classification number: G01R1/0483 ,  Y10T29/4913 ,  Y10T29/49144

Abstract: Flip-chip semiconductor assemblies, each including integrated circuit (IC) dice and an associated substrate, are electrically tested before encapsulation using an in-line or in situ test socket or probes at a die-attach station. Those assemblies using “wet” quick-cure epoxies for die attachment may be tested prior to the epoxy being cured by pressing the integrated circuit (IC) dice against interconnection points on the substrate for electrical connection, while those assemblies using “dry” epoxies may be cured prior to testing. In either case, any failures in the dice or in the interconnections between the dice and the substrates can be easily fixed, and the need for the use of known-good-die (KGD) rework procedures during repair is eliminated.

Abstract translation: 每个包括集成电路（IC）裸片和相关衬底的倒装芯片半导体组件在封装之前使用在线或原位测试插座或芯片附着站的探针进行电测试。 在通过将集成电路（IC）芯片压在基板上的互连点以进行电连接的环氧树脂固化之前，可以测试使用“湿”快速固化环氧树脂进行芯片附接的那些组件，而使用“干”环氧树脂的那些组件 在测试之前进行治愈。 在任一种情况下，骰子或骰子与基板之间的互连中的任何故障都可以很容易地固定，并且消除了在维修期间使用已知好模具（KGD）返工程序的需要。

公开(公告)号：US06954081B2

公开(公告)日：2005-10-11

申请号：US10338530

申请日：2003-01-08

Applicant: Chad A. Cobbley ,  John VanNortwick ,  Bret K. Street ,  Tongbi Jiang

Inventor： Chad A. Cobbley ,  John VanNortwick ,  Bret K. Street ,  Tongbi Jiang

IPC: G01R1/04 ,  G01R31/26 ,  G01R31/02

CPC classification number: G01R1/0483 ,  Y10T29/4913 ,  Y10T29/49144

Abstract: Flip-chip semiconductor assemblies, each including integrated circuit (IC) dice and an associated substrate, are electrically tested before encapsulation using an in-line or in-situ test socket or probes at a die-attach station. Those assemblies using “wet” quick-cure epoxies for die attachment may be tested prior to the epoxy being cured by pressing the integrated circuit (IC) dice against interconnection points on the substrate for electrical connection, while those assemblies using “dry” epoxies may be cured prior to testing. In either case, any failures in the dice or in the interconnections between the dice and the substrates can be easily fixed, and the need for the use of known-good-die (KGD) rework procedures during repair is eliminated.

公开(公告)号：US06953700B2

公开(公告)日：2005-10-11

申请号：US10927546

申请日：2004-08-25

Applicant: Chad A. Cobbley ,  John VanNortwick ,  Bret K. Street ,  Tongbi Jiang

Inventor： Chad A. Cobbley ,  John VanNortwick ,  Bret K. Street ,  Tongbi Jiang

IPC: G01R1/04 ,  G01R31/26

CPC classification number: G01R1/0483 ,  Y10T29/4913 ,  Y10T29/49144

Abstract: Flip-chip semiconductor assemblies, each including integrated circuit (IC) dice and an associated substrate, are electrically tested before encapsulation using an in-line or in-situ test socket or probes at a die-attach station. Those assemblies using “wet” quick-cure epoxies for die attachment may be tested prior to the epoxy being cured by pressing the integrated circuit (IC) dice against interconnection points on the substrate for electrical connection, while those assemblies using “dry” epoxies may be cured prior to testing. In either case, any failures in the dice or in the interconnections between the dice and the substrates can be easily fixed, and the need for the use of known-good-die (KGD) rework procedures during repair is eliminated.

公开(公告)号：US06949943B2

公开(公告)日：2005-09-27

申请号：US10900609

申请日：2004-07-27

Applicant: Chad A. Cobbley ,  John VanNortwick ,  Bret K. Street ,  Tongbi Jiang

Inventor： Chad A. Cobbley ,  John VanNortwick ,  Bret K. Street ,  Tongbi Jiang

IPC: G01R1/04 ,  G01R31/26

CPC classification number: G01R1/0483 ,  Y10T29/4913 ,  Y10T29/49144

Abstract: Flip-chip semiconductor assemblies, each including integrated circuit (IC) dice and an associated substrate, are electrically tested before encapsulation using an in-line or in-situ test socket or probes at a die-attach station. Those assemblies using “wet” quick-cure epoxies for die attachment may be tested prior to the epoxy being cured by pressing the integrated circuit (IC) dice against interconnection points on the substrate for electrical connection, while those assemblies using “dry” epoxies may be cured prior to testing. In either case, any failures in the dice or in the interconnections between the dice and the substrates can be easily fixed, and the need for the use of known-good-die (KGD) rework procedures during repair is eliminated.