Abstract:
Enhancement mode transistors are described where a Group III-N compound is used in the source and drain regions to place tensile strain on the channel. The source and drain regions may be raised or embedded, and fabricated in conjunction with recessed or raised compression regions for p channel transistors.
Abstract:
A device grade III-V quantum well structure and method of manufacture is described. Embodiments of the present invention enable III-V InSb quantum well device layers with defect densities below 1×108 cm−2 to be formed. In an embodiment of the present invention, a delta doped layer is disposed on a dopant segregation barrier in order to confine delta dopant within the delta doped layer and suppress delta dopant surface segregation.
Abstract:
Embodiments of the invention include apparatuses and methods relating to directed carbon nanotube growth using a patterned layer. In some embodiments, the patterned layer includes an inhibitor material that directs the growth of carbon nanotubes.
Abstract:
Techniques and structures for increasing body dopant uniformity in multi-gate transistor devices are generally described. In one example, an electronic device includes a semiconductor substrate, a multi-gate fin coupled with the semiconductor substrate, the multi-gate fin comprising a source region, a drain region, and a gate region wherein the gate region is disposed between the source region and the drain region, the gate region being body-doped after a sacrificial gate structure is removed from the multi-gate fin and before a subsequent gate structure is formed, a dielectric material coupled with the source region and the drain region of the multi-gate fin, and the subsequent gate structure coupled to the gate region of the multi-gate fin.
Abstract:
Enhancement mode transistors are described where a Group III-N compound is used in the source and drain regions to place tensile strain on the channel. The source and drain regions may be raised or embedded, and fabricated in conjunction with recessed or raised compression regions for p channel transistors.
Abstract:
A transistor structure and a system including the transistor structure. The transistor structure comprises: a substrate including a first layer comprising a first crystalline material; a tensile strained channel formed on a surface of the first layer and comprising a second crystalline material having a lattice spacing that is smaller than a lattice spacing of the first crystalline material; a metal gate on the substrate; a pair of sidewall spacers on opposite sides of the metal gate; and a source region and a drain region on opposite sides of the metal gate adjacent a corresponding one of the sidewall spacers.
Abstract:
A method for selectively relieving channel stress for n-channel transistors with recessed, epitaxial SiGe source and drain regions is described. This increases the electron mobility for the n-channel transistors without affecting the strain in p-channel transistors. The SiGe provides lower resistance when a silicide is formed.
Abstract:
Independent n-tips for multi-gate transistors are generally described. In one example, an apparatus includes a semiconductor fin, one or more multi-gate pull down (PD) devices coupled with the semiconductor fin, the one or more PD devices having an n-tip dopant concentration in the semiconductor fin material adjacent to the one or more PD devices, and one or more multi-gate pass gate (PG) devices coupled with the semiconductor fin, the one or more PG devices having an n-tip dopant concentration in the semiconductor fin material adjacent to the one or more PG devices, wherein the n-tip dopant concentration for the PG device is lower than the n-tip dopant concentration for the PD device.
Abstract:
Embodiments of the invention include apparatuses and methods relating to three dimensional transistors having high-k dielectrics and metal gates with fins protected by a hard mask layer on their top surface. In one embodiment, the hard mask layer includes an oxide.
Abstract:
A Group III-V Semiconductor device and method of fabrication is described. A high-k dielectric is interfaced to a confinement region by a chalcogenide region.