DROPLET INSPECTION MODULE AND DROPLET INSPECTION METHOD

    公开(公告)号:US20210122154A1

    公开(公告)日:2021-04-29

    申请号:US17079029

    申请日:2020-10-23

    Abstract: An inspection module is disclosed for inspecting a droplet from an ink jet head. The inspection module includes a sensor located under the ink jet head and measuring a distance between the droplet and the sensor in real time; a variable lens changing an operating distance based on the measured distance of the sensor; and a camera for capturing an image of the droplet. The inspection module further includes a droplet inspecting part inspecting the droplet image captured by the camera.

    APPARATUS AND METHOD FOR TREATING SUBSTRATE

    公开(公告)号:US20210111042A1

    公开(公告)日:2021-04-15

    申请号:US17132008

    申请日:2020-12-23

    Abstract: Provided are an apparatus and method for treating a substrate. Specifically, provided are an apparatus and method for treating a substrate through a supercritical process. The apparatus includes: a housing providing a space for performing a process; a support member disposed in the housing to support a substrate; a supply port configured to supply a process fluid to the housing; a shield member disposed between the supply port and the support member to prevent the process fluid from being directly injected to the substrate; and an exhaust port configured to discharge the process fluid from the housing.

    APPARATUS AND METHOD FOR TREATING SUBSTRATE

    公开(公告)号:US20210104417A1

    公开(公告)日:2021-04-08

    申请号:US17063820

    申请日:2020-10-06

    Abstract: The apparatus includes a support unit to support the substrate in a treatment space of a process chamber, a first fluid supply unit to supply a supercritical fluid having an organic solvent dissolved in the supercritical fluid, to the treatment space, a second fluid supply unit to supply the supercritical fluid having no organic solvent dissolved in the supercritical fluid, to the treatment space, an exhaust unit to exhaust the treatment space, a controller to control the first fluid supply unit, the second fluid supply unit, and the exhaust unit. The controller controls the first and second fluid supply units such that the supercritical fluid having no organic solvent dissolved in the supercritical fluid is supplied to the treatment space through the second fluid supply unit, after the supercritical fluid mixed with the organic solvent is supplied to the treatment space through the first fluid supply unit.

    Apparatus and method for treating substrate

    公开(公告)号:US10969700B2

    公开(公告)日:2021-04-06

    申请号:US16504092

    申请日:2019-07-05

    Abstract: A method for treating a substrate includes a substrate treating step of treating the substrate by dispensing a treating liquid onto the substrate supported on a support plate in a processing space of a processing vessel and a vessel cleaning step of cleaning the processing vessel by dispensing a cleaning solution onto a jig supported on the rotating support plate. In the vessel cleaning step, the jig is located such that the center of the jig is offset from the center of the support plate.

    SUBSTRATE TREATING APPARATUS AND TREATMENT LIQUID DISPENSING METHOD

    公开(公告)号:US20210094055A1

    公开(公告)日:2021-04-01

    申请号:US17028211

    申请日:2020-09-22

    Abstract: The inventive concept relates to an apparatus for treating a substrate. The apparatus includes a substrate support unit that supports the substrate, a nozzle unit that dispenses a treatment liquid onto the substrate supported on the substrate support unit, and a liquid supply unit that supplies the treatment liquid to the nozzle unit. The liquid supply unit includes a main supply line that is connected to the nozzle unit and that supplies the treatment liquid to the nozzle unit, wherein the treatment liquid is prepared by mixing a chemical with DIW at a first temperature and DIW at a second temperature higher than the first temperature, and temperature of the treatment liquid is adjusted by regulating a flow rate of the DIW at the first temperature and a flow rate of the DIW at the second temperature.

    Substrate treating apparatus and temperature control method for gas distribution plate

    公开(公告)号:US10957517B2

    公开(公告)日:2021-03-23

    申请号:US16695386

    申请日:2019-11-26

    Abstract: Disclosed is a substrate treating apparatus including a chamber having a process space therein in which a substrate is treated, a substrate support assembly located in the chamber and including a support plate that supports the substrate, a gas supply unit that supplies gas into the chamber, a gas distribution plate that distributes the gas and supplies the gas into the process space, and a temperature control unit that controls temperature of the gas distribution plate. The temperature control unit includes a heating member that heats the gas distribution plate, a cooling member that cools the gas distribution plate, and a control member that controls the heating member and the cooling member, based on a correlation coefficient regarding an interaction of the heating member and the cooling member and a disturbance coefficient regarding an external influence.

    Guide pin, photo mask supporting unit including the same, and photo mask cleaning apparatus including the same

    公开(公告)号:US10955758B2

    公开(公告)日:2021-03-23

    申请号:US16658215

    申请日:2019-10-21

    Inventor: Shi Hyun Park

    Abstract: Provided are a guide pin configured to support a corner of a photo mask using a double slide structure, a photo mask supporting unit including the same, and a photo mask cleaning apparatus including the same. The photo mask supporting unit includes a supporting plate, a supporting shaft which supports the supporting plate from under the supporting plate, a supporting plate driver configured to rotate the supporting plate, and a guide pin provided as a plurality of guide pins on the supporting plate to support a photo mask and including at least one column protruding upward from a flat surface and having a first sliding portion and a second sliding portion formed on a side surface of the column to be inclined downward to have different angles.

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