Abstract:
The invention relates to a process for treating a portion of the surface of a substrate according to a first and second surface treatments which are different from each other and are intended respectively for a first group of regions and for a second group of regions of the surface portion, the two groups of regions being mutually complementary with respect to the surface portion, the process making it possible to use only a single operation of positioning a mask which differentiates the regions of the first and second groups of regions, using the same protective materials for the regions of each group of regions against the effects of the treatment intended for the regions of the other group of regions. Application to the fabrication of semiconductor products.
Abstract:
An integrated memory location structure includes an isolated semiconductor layer between the source region and the drain region of a transistor, and between the channel region and the control gate of the transistor. The isolated semiconductor layer includes two potential well zones separated by a potential barrier zone under the control gate of the transistor. A write circuit biases the memory location structure to confine charge carriers selectively in one of the two potential well zones. A read circuit biases the memory location structure to measure the drain current of the transistor and determine therefrom the stored logic state imposed by the position of the charges in one of the potential well zones.
Abstract:
A bias device includes a first branch and a second branch. The first branch includes a first bipolar device and a corresponding bias circuit. The second branch includes a second bipolar device and a corresponding bias circuit. A self-bias circuit is connected to the first and second branches. A first current generator injects a first auxiliary current into the first bipolar device. A second current generator injects a second current into the second bipolar device that is equal or proportional to the first auxiliary current. The bias device stabilizes the operating point of a circuit.
Abstract:
Transistor and method of manufacturing a bipolar transistor of the double-polysilicon, heterojunction-base type, in which a semiconducting layer with SiGe heterojunction is formed by non-selective epitaxy on an active region of a substrate and an insulating region surrounding the active region. At least one stop layer is formed on the semiconducting layer above a part of the active region. A layer of polysilicon and an upper insulating layer are formed on the semiconducting layer and on a part of the stop layer, leaving an emitter window free. An emitter region is formed by epitaxy in the emitter window, resting partially on the upper insulating layer and in contact with the semiconducting layer.
Abstract:
An integrated circuit having an identification code of M bits includes a communication interface circuit for receiving a selective identification request and a selection code, and a processing circuit connected thereto. The processing circuit includes a logic comparator having a first input for receiving the selection code and a second input for receiving the identification code, and an output for delivering an equal signal if the selection and identification codes are equal. A shift register has an output coupled to the first input of the logic comparator. A serial memory stores the identification code, and has a serial output coupled to the second input of the logic comparator and to a serial input of the shift register. A controller is connected to the shift register and to the serial memory for loading the selection code into the shift register, and for applying M shift pulses to the shift register and M read pulses to the serial memory. An inhibiting circuit inhibits the logic comparator when N shift and read pulses have been applied to the shift register and to the serial memory.
Abstract:
The vertical transistor includes, on a semiconductor substrate, a vertical pillar 5 having one of the source and drain regions at the top, the other of the source and drain regions being situated in the substrate at the periphery of the pillar, a gate dielectric layer 7 situated on the flanks of the pillar and on the top surface of the substrate, and a semiconductor gate resting on the gate dielectric layer. The gate includes a semiconductor block having a first region 800 resting on the gate dielectric layer 7 and a second region 90 facing at least portions of the source and drain regions and separated from those source and drain region portions by dielectric cavities 14S, 14D.
Abstract:
A FAMOS memory cell is electrically erased. The FAMOS memory cell may be electrically erased by applying to the substrate a voltage having a value at least 4 volts higher than the lower of a voltage applied to the source and a voltage applied to the drain. The voltage applied to the substrate is also less than a predetermined limit above which the memory cell is destroyed.
Abstract:
A multiplexed flip-flop electronic device includes a decoder logic circuit for providing a first switching signal, and a control circuit for receiving a clock signal and for providing a gated clock signal forming a second switching signal. The electronic device further includes a multiplexing circuit having N inputs and an output, and a flip flop circuit. The flip-flop circuit includes a first switching stage connected between the N inputs and the output of the multiplexing circuit, and includes N switches being individually controlled by the first switching signal. A first buffer stage is connected to the output of the multiplexing circuit, and a second switching stage is connected to an output of the first buffer stage. The second switching stage is controlled by the second switching signal. A second buffer stage is connected to an output of the second switching stage.
Abstract:
In an integrated circuit, a detection device detects a drop in the supply voltage of the core of the integrated circuit or an excessively slow build-up of this voltage with respect to a supply voltage of the input/output interface circuits of the integrated circuit. Outputs of the interface circuits are set to a high impedance state by the detection device to minimize their power consumption.
Abstract:
Reference cells are refreshed in a non-volatile memory that includes a plurality of memory cells. A selected reference cell and a non-used memory cell are read simultaneously, and a signal read from the reference cell is compared to a signal read from the non-used memory cell. A refresh signal for refreshing the reference cell is supplied when the signal read therefrom is less than the signal read from the non-used memory cell.