Abstract:
A drive circuit for a field-effect transistor is disclosed, the field-effect transistor having a drain terminal connected to the positive pole of a voltage supply and a source terminal connected to a load. The drive circuit comprises a first transistor connected between the gate terminal of the field-effect transistor and the negative pole of the voltage supply for turning off the field-effect transistor. The first transistor is driven by an operational amplifier which has inverting and non-inverting teminals connected to the gate and source terminals of the field-effect transistor, respectively. Switches alternatively intercouple the field-effect transistor to either another voltage supply or the first transistor.
Abstract:
The switching noise generated by a data output buffer is greatly reduced by "precharging" the output node to an intermediate voltage during a system's "dead" time. This is done with a precharging output current pulse having a constant time derivative during a first time interval and a constant time derivative of opposite sign during a second time interval, before performing the actual switching with an output current having a constant time derivative, during a third time interval. The partial precharging with a controlled, triangular-shaped, output current pulse, avoids any abrupt change of output current and thus limits switching noise. The buffer of the invention is particularly useful in high-speed memory devices.
Abstract:
The discriminating sensitivity of a sense amplifier and the speed of the circuit are increased by exploiting the difference of potential which develops across the output nodes of the two control circuits, employed for enabling/disabling current paths of the input network of the differential amplifier, as a virtual additional signal for the sensing differential amplifier, by employing said output potentials of the two control circuits as virtual reference potentials for the pair of input transistors of the differential amplifier during a discriminating phase of the reading cycle. Two pass-transistors driven by a control signal provide to force to ground potential the output nodes of said control circuits, thus reestablishing a correct ground reference potential of the amplifier, during the final phase of amplification and storage of the extracted datum in an output latch, as well as during the successive standby period. Alternative embodiments also include various anti-overshoot circuits.
Abstract:
ROM memories made in MOS or CMOS technology with LDD cells may be programmed advantageously in a relatively advanced stage of fabrication by decoupling an already formed drain region from the channel region of cells to be permanently made nonconductive (programmed) by implanting a dopant in an amount sufficient to invert the type of conductivity in a portion of the drain region adjacent to the channel region. In CMOS processes, the programming mask may be a purposely modified mask commonly used for implanting source/drain regions of transistors of a certain type of conductivity. By using high-energy implantation and a dedicated mask, the programming may be effected at even later stages of the fabrication process.
Abstract:
An operational amplifier, of a type which comprises a differential cell transconductor input stage (2) incorporating a current mirror (5) provided with a pair of degenerative resistors (R9,R10) and a gain stage (7), driven directly by a transistor (Q12) of said mirror (5), has each degenerative resistor (R9,R10) formed within an epitaxial well wherewith a parasitic diode (D1,D2) is associated. Each diode (D1,D2) is connected in parallel with its corresponding resistor (R9,R10) to prevent the transistor (Q12) which drives the gain stage (7) from becoming saturated.
Abstract:
An integrated circuit transconductor stage which suppresses the dependence on temperature and production process variables of a differential transconductor stage. A negative feedback relation is used, where the output of the transconductor stage is connected to an additional current generator (which is referenced to a precision external resistor), to a capacitor, and also to the gate of a PMOS transistor which sources current to a polarization stage, which in turn sources current to the transconductor stage, or to multiple transconductor stages.
Abstract:
A method for forming thin oxide portions in electrically erasable and programmable read-only memory cells, including the use of the enhanced oxidation effect and the lateral diffusion of heavy doping, for obtaining a tunnel portion whose dimensions are smaller than the resolution of the photolithographic method used.
Abstract:
A drive circuit includes a voltage source supplying a reference voltage at its output; a voltage elevating circuit connected to a supply voltage and to the output of the voltage source, and supplying at its output, under normal operating conditions, a drive voltage greater than the supply voltage and increasing with the reference voltage. The input of the voltage source is connected to the output of the voltage elevating circuit, and defines a positive feedback path resulting in an increase in the reference voltage corresponding to an increase in the drive voltage, and therefore results in a corresponding increase in the drive voltage up to a maximum permissible value, thus providing for a sufficient drive voltage for driving the gate-source junction of power MOS transistors, even in the presence of a low supply voltage.
Abstract:
A bipolar power transistor and a low voltage bipolar transistor are combined in an emitter switching or a semibridge configuration in an integrated structure. In a version with non-isolated components, the components of the structure are totally or partially superimposed on each other, partly in a first epitaxial layer and partly in a second epitaxial layer, and the low voltage bipolar transistor is situated above the emitter region of the bipolar power transistor which is thus a completely buried active structure. In a version with isolated components, there are two P+ regions in an N-epitaxial layer. The first P+ region constitutes the power transistor base and encloses the N+ emitter region of the power transistor. The second P+ region encloses two N+ regions and one P+ region, constituting the collector, emitter, and base regions respectively of the low voltage transistor. A metallization on the front of the chip provides a connection between the collector contact of the low voltage transistor and the emitter contact of the power transistor.
Abstract:
This package for integrated devices, to be fixed on supporting plates, in particular on printed circuits, comprises contact pins to be inserted in holes of the supporting plates and to be soldered thereto. To prevent overturning of the package, which may lead to short circuits among the components, at least some of the contact pins are provided with protruding portions defining abutments cooperating with the supporting plate to limit the inclination of the package with respect to the plate.