摘要:
An apparatus for processing a workpiece can be exemplarily characterized as including a processing tool having a processing region within which a workpiece can be processed, and an illumination system configured to direct detection light into the processing region. In this embodiment, detection light directable by the illumination system has a wavelength to which the workpiece is at least partially opaque. The apparatus may further include an image sensor configured to detect a characteristic of the detection light transmitted through the processing region and a chuck configured to support a workpiece such that at least a portion of the workpiece is disposable within the processing region and is illuminatable by the detection light. Methods for processing a workpiece are also disclosed.
摘要:
An internal feature can be laser machined in strengthened glass sheets or panels by first laser machining a first scribe in a first surface proximate to the internal feature to be laser machined. The internal feature can be then laser machined by positioning a beam waist of a laser beam proximate to an opposite second surface by focusing the laser beam through the strengthened glass panel from the first surface. The internal feature is laser machined by repositioning the beam waist from the second surface to the first surface while removing material from a kerf surrounding the internal feature. When the laser beam waist is finally positioned proximate to the first surface material, the internal shape formed by the laser machining is easily and cleanly removed from the surrounding glass.
摘要:
Systems and methods for laser processing continuously moving sheet material include one or more laser processing heads configured to illuminate the moving sheet material with one or more laser beams. The sheet material may include, for example, an optical film continuously moving from a first roller to a second roller during a laser process. In one embodiment, a vacuum chuck is configured to removably affix a first portion of the moving sheet material thereto. The vacuum chuck controls a velocity of the moving sheet material as the first portion is processed by the one or more laser beams. In one embodiment, a conveyor includes a plurality of vacuum chucks configured to successively affix to different portions of the sheet material during laser processing.
摘要:
Systems and methods for laser processing continuously moving sheet material include one or more laser processing heads configured to illuminate the moving sheet material with one or more laser beams. The sheet material may include, for example, an optical film continuously moving from a first roller to a second roller during a laser process. In one embodiment, a vacuum chuck is configured to removably affix a first portion of the moving sheet material thereto. The vacuum chuck controls a velocity of the moving sheet material as the first portion is processed by the one or more laser beams. In one embodiment, a conveyor includes a plurality of vacuum chucks configured to successively affix to different portions of the sheet material during laser processing.
摘要:
A probe module for testing an electronic device comprises at least two contacts, each contact including a first end portion extending in a first direction along a first line, a second end portion extending linearly in a second direction opposite from the first direction and along a second line, and a third curved portion extending between the first end portion and the second end portion. The first line is spaced apart from and in parallel with the second line, and the at least two contacts are spaced apart from each other in a direction perpendicular to the first line and the second line. Methods for making such a probe module are also taught.
摘要:
Systems and methods reduce or prevent back-reflections in a laser processing system. A system includes a laser source to generate an incident laser beam, a laser beam output to direct the incident laser beam toward a work surface along a beam path, and a spatial filter. The system further includes a beam expander to expand a diameter of the incident laser beam received through the spatial filter, and a scan lens to focus the expanded incident laser beam at a target location on a work surface. A reflected laser beam from the work surface returns through the scan lens to the beam expander, which reduces a diameter of the reflected beam and increases a divergence angle of the reflected laser beam. The spatial filter blocks a portion of the diverging reflected laser beam from passing through the aperture and returning to the laser beam output.
摘要:
A laser ablation system includes a sample chamber 102 configured to accommodate a target 104 within an interior 106 thereof, a sample generator 108 configured to remove a portion of the target 104 (which may be subsequently captured as a sample) and an analysis system 110 configured to analyze a composition of the sample. A sample capture cell in the chamber proximate to the target has a capture cavity configured to receive target material, a first inlet configured to transmit a flow of a carrier gas from a first location adjacent to an exterior of the capture cell into a region of the capture cavity; and an outlet configured to receive carrier gas from another region of the capture cavity. The sample chamber 102 includes an injection nozzle 120 configured to introduce, into the interior 106, a fluid such as a carrier gas.
摘要:
A method and apparatus for filling a via with transparent material is presented, including the steps of providing a panel having a via, occluding the via with transparent material in a workable state so that a portion of the occluding material is internal to the via and a portion of the material is external to said via. The external and internal portions are separated so the transparent filler material, when set, forms a smooth and featureless surface. This causes the filled via to have a substantially even and uniform appearance over a wide range of viewing angles when lit.
摘要:
A method of and an apparatus for drilling blind vias with selectable tapers in multilayer electronic circuits permit forming electrical connections between layers while maintaining quality and throughput. The method relies on recognizing that the top diameter of the via and the bottom diameter of the via, which define the taper, are functions of two separate sets of equations. Simultaneous solution of these equations yields a solution space that enables optimization of throughput while maintaining selected taper and quality using temporally unmodified Q-switched CO2 laser pulses with identical pulse parameters. Real time pulse tailoring is not required; therefore, system complexity and cost may be reduced.
摘要:
A method and system increase processed specimen yield in the laser processing of target material that includes multiple specimens formed on a common substrate. Preferred embodiments implement a feature that enables storage in the laser processing system a list of defective specimens that have somehow been subject to error during laser processing. Once the common substrate has been completely processed, the system alerts an operator to the number of improperly processed specimens and gives the operator an opportunity to run a software routine, which in a preferred embodiment uses a laser to scribe a mark on the top surface of each improperly processed specimen.