摘要:
Integrated circuit devices include a first dielectric layer, an electrically insulating layer on the first dielectric layer and an an aluminum oxide buffer layer formed by atomic layer deposition (ALD) and stabilized by heat treatment at a temperature of less than about 600.degree. C., between the first dielectric layer and the electrically insulating layer. The first dielectric layer may comprise a high dielectric material such as a ferroelectric or paraelectric material. The electrically insulating layer may also comprise a material selected from the group consisting of silicon dioxide, borophosphosilicate glass (BPSG) and phosphosilicate glass (PSG). To provide a preferred integrated circuit capacitor, a substrate may be provided and an interlayer dielectric layer may be provided on the substrate. Here, a metal layer may also be provided between the interlayer dielectric layer and the first dielectric layer. The metal layer may comprise a material selected from the group consisting of Pt, Ru, Ir, and Pd.
摘要:
A wiring layer of a semiconductor device having a novel contact structure is disclosed. The semiconductor device includes a semiconductor substrate, an insulating layer having an opening (contact hole or via), a reactive spacer formed on the sidewall of the opening or a reactive layer formed on the sidewall and on the bottom surface of the opening and a first conductive layer formed on the insulating layer which completely fills the opening. Since the reactive spacer or layer is formed on the sidewall of the opening, when the first conductive layer material is deposited, large islands will form to become large grains of the sputtered Al film. Also, providing the reactive spacer or layer improves the reflow of the first conductive layer during a heat-treating step for filling the opening at a high temperature below a melting temperature. Thus, complete filling of the opening with sputtered Al can be ensured. All the contact holes, being less than 1 .mu.m in size and having an aspect ratio greater than 1.0, can be completely filled with Al, to thereby enhance the reliability of the wiring of a semiconductor device.
摘要:
An apparatus for measuring the linewidth of a laser is disclosed in which the linewidth of a laser is measured in a wide range from a narrow linewidth to a wide linewidth by utilizing frequency-shifted rays based on a stimulated Brillouin scattering within an optical fiber in an easy and efficient manner. The apparatus according to the present invention includes: an optical signal generating and splitting means for generating optical signals under test, and for splitting them into two sets of signals; a frequency shifting means for amplifying the optical frequency of the optical source of the optical signal generating and splitting means, and then, irradiating the amplified signals into an optical fiber so as to shift the frequency based on a stimulated Brillouin phenomenon; a leading means for minimizing a loss of the frequency shifted rays outputted in a direction opposite to that of original laser beams of the frequency shifting means so as to leading them in a certain direction; and a spectrum analyzing means for receiving the original rays from the optical signal generating and splitting means and for receiving the frequency-shifted rays from the leading means so as to stimulate beatings and to analyze the beaten spectra. The apparatus is applied to measuring the linewidth and channel interval of a laser used in wavelength division multiplexing optical communications.
摘要:
In a method for forming a metal wiring layer of a semiconductor device an insulating layer is formed on a semiconductor substrate having impurity-doped regions. A contact hole is formed in the insulating layer to expose an impurity-doped semiconductor region. Thereafter, a diffusion barrier layer is formed on the inner surface of the contact holes and on the surface of the semiconductor substrate exposed by the contact holes. The diffusion barrier layer is heat-treated for two minutes to one hour in a vacuum at a temperature of 450.degree. C. to 650.degree. C. Then, a metal wiring layer of a semiconductor device is formed on the diffusion barrier layer.
摘要:
An optical modulator, methods of manufacturing and operating the same, and an optical apparatus including the optical modulator are disclosed. The optical modulator includes an electro-optical converter and an optical-electric converter, stacked perpendicular to a substrate, and a gate transistor. The gate transistor gates a signal transmitted to the electro-optical converter from the optical-electric converter and allows charges generated in the optical-electric converter and charges remaining in the electro-optical converter to flow while bypassing the electro-optical converter when gating ON is performed.
摘要:
The present invention relates to a method for producing a bone transplant material using an extracted tooth, and to a bone transplant material produced by same, and particularly, to a method for producing a bone transplant material which enables the production of bone transplant material in a short amount of time using an extracted tooth of a patient or a similar tooth.
摘要:
Optical modulator having wide bandwidth based on Fabry-Perot resonant reflection is disclosed. The optical modulator includes: a bottom Distributed Bragg Reflector (DBR) layer; a top DBR layer including at least one layer, and a modified layer; and an active layer disposed between bottom and top DBR layers, wherein the at least one layer includes at least one pair of a first refractive index layer having a first refractive index and a second refractive index layer having a second refractive index, the modified layer includes at least one pair of a third refractive index layer having a third refractive index and a fourth refractive index layer having a fourth refractive index, the third and the fourth refractive indexes being different, and at least one of the third and the fourth refractive index layers has a second optical thickness that is not λ/4 or that is not an odd multiple thereof.
摘要:
An all-optical carrier sense multiple access collision detection apparatus and method for checking by using mutual gain saturation whether distortion occurs in two or more optical signals due to mutual interference when the optical signals pass through a semiconductor optical amplifier.
摘要:
The present invention related to a method for manufacturing a semiconductor device. More particularly, this method describes how to manufacture a semiconductor device having a porous, low dielectric constant layer formed between metal lines, comprising an insulation layer enveloping fillers.
摘要:
Disclosed are an optical image modulator, an optical apparatus including the same, and methods of manufacturing and operating the optical image modulator. The optical image modulator includes a light amount increasing unit increasing the amount of forward light emission of an electric-optical unit. The light amount increasing unit includes a first reflector reflecting light, which travels from the inside of the electric-optical unit toward the optical-electric unit, to the electric-optical unit. The light amount increasing unit may further include a second light reflector reflecting light, which passes through the optical-electric unit without optical-electric conversion, to the optical-electric unit.