公开(公告)号：US06799490B1

公开(公告)日：2004-10-05

申请号：US10440343

申请日：2003-05-15

Applicant: Kuo-Chih Chu

Inventor： Kuo-Chih Chu

IPC: B67B762

CPC classification number: B67B7/063 ,  B67B7/0441

Abstract: A lever corkscrew has a body and a central spindle received inside the body. A transport assembly is slidably mounted inside the body, and two anchors securely are mounted on the one side of the transport assembly. Two arms with tooth-like protrusions are pivoted with the body and the protrusions are engaged with the central spindle. The central spindle is securely mounted on the transport assembly on the one side different with the side mounted with the anchors. When turning up the arms or turning down the arms, the central spindle will be driven up or down and also drive the transport assembly with the anchors to pull out the cork.

Abstract translation: 杠杆开瓶器具有容纳在体内的主体和中心心轴。 运输组件可滑动地安装在主体内部，并且两个锚定件牢固地安装在运输组件的一侧上。 具有齿状突起的两个臂与本体枢转并且突起与中心心轴接合。 中心主轴牢固地安装在运输组件上，其一侧与安装锚固件的侧面不同。 当抬起手臂或转动手臂时，中心主轴将被上下驱动，并且还可以用锚定器驱动运输组件以拉出软木塞。

公开(公告)号：US20140024330A1

公开(公告)日：2014-01-23

申请号：US13551386

申请日：2012-07-17

Applicant: Kang Chih Chu ,  Gregory Jason Fields

Inventor： Kang Chih Chu ,  Gregory Jason Fields

IPC: H04W4/22

CPC classification number: H04M1/72541 ,  G06F3/0484 ,  G06F3/04883 ,  G06F2203/04808 ,  H04M1/67 ,  H04M2250/22

Abstract: A portable device and method of providing information stored in a memory is provided. A portable device may be capable of storing In Case of Emergency (ICE) information comprising a number of ICE entries and which may be placed in a locked condition, the portable device comprising: a man-machine interface; a display; and, a processor coupled to the display and to the man-machine interface, wherein the processor is adapted to cause the display, in response to detection of one or more predetermined gestures on the man-machine interface, to display at least one ICE entry; and wherein the display displays the at least one ICE entry even if the portable device is in the locked condition, and if the at least one ICE entry is displayed while the portable device is in the locked condition, other information stored on the portable device remains protected.

Abstract translation: 提供了提供存储在存储器中的信息的便携式设备和方法。 便携式设备可以能够存储包括多个ICE条目并且可以被置于锁定状态的紧急情况（ICE）信息，所述便携式设备包括：人机界面; 一个显示器 以及耦合到所述显示器和所述人机界面的处理器，其中所述处理器适于使所述显示器响应于所述人机界面上的一个或多个预定手势的检测而显示至少一个ICE输入 ; 并且其中所述显示器即使所述便携式设备处于锁定状态，也显示所述至少一个ICE入口，并且如果在所述便携式设备处于锁定状态时显示所述至少一个ICE入口，则存储在所述便携式设备上的其他信息保持 保护。

公开(公告)号：US08446546B2

公开(公告)日：2013-05-21

申请号：US12416302

申请日：2009-04-01

Applicant: Ya-Ting Ho ,  Chi-Chih Chu ,  Keng-Ju Liu

Inventor： Ya-Ting Ho ,  Chi-Chih Chu ,  Keng-Ju Liu

IPC: G02F1/1335 ,  G02F1/1333 ,  G09F13/04 ,  G09F13/08 ,  F21V21/00 ,  F21V7/04

CPC classification number: G02F1/133605 ,  G02F2202/22 ,  G09F13/04 ,  G09F13/14

Abstract: A backlight module and a display panel device using the same are provided. The backlight module includes a light source module, an open frame, and a reflector sheet. The open frame is disposed around the light source module and has a first free-end and a second free-end. A space interval exists between the first and second free-ends. The reflector sheet is disposed on a rear side of the light source module and has a body and a sidewall. The sidewall corresponds to the space interval between the first and second free-ends and extends over the light source module. The display panel further includes a liquid crystal display panel (LCD panel) on the light source module and a front frame which is disposed on the LCD panel enclosing a lateral side of the LCD panel. The sidewall of the reflector sheet extends between the lateral side of the LCD panel and the front frame to provide insulation.

Abstract translation: 提供背光模块和使用其的显示面板装置。 背光模块包括光源模块，开放框架和反射板。 开放框架设置在光源模块周围，并且具有第一自由端和第二自由端。 在第一和第二自由端之间存在空间间隔。 反射片设置在光源模块的后侧，具有主体和侧壁。 侧壁对应于第一自由端和第二自由端之间的间隔，并且在光源模块上延伸。 显示面板还包括在光源模块上的液晶显示面板（LCD面板）和设置在LCD面板上的前框架，该框架包围LCD面板的侧面。 反射片的侧壁在LCD面板的侧面和前框架之间延伸以提供绝缘。

公开(公告)号：US08198131B2

公开(公告)日：2012-06-12

申请号：US12846630

申请日：2010-07-29

Applicant: Cheng-Yi Weng ,  Chi-Chih Chu ,  Chien-Yuan Tseng

Inventor： Cheng-Yi Weng ,  Chi-Chih Chu ,  Chien-Yuan Tseng

IPC: H01L21/02

CPC classification number: H01L24/97 ,  H01L21/56 ,  H01L21/561 ,  H01L23/3128 ,  H01L23/49816 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L25/50 ,  H01L2223/54426 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45664 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3511 ,  H01L2924/00014 ,  H01L2224/81 ,  H01L2224/85 ,  H01L2924/00012 ,  H01L2924/00

Abstract: Described herein are stackable semiconductor device packages and related stacked package assemblies and methods. In one embodiment, a manufacturing method includes: (1) providing a substrate including contact pads disposed adjacent to an upper surface of the substrate; (2) applying an electrically conductive material to form conductive bumps disposed adjacent to respective ones of the contact pads; (3) electrically connecting a semiconductor device to the upper surface of the substrate; (4) applying a molding material to form a molded structure covering the conductive bumps and the semiconductor device; (5) forming a set of cutting slits extending partially through the molded structure and the conductive bumps to form truncated conductive bumps; and (6) reflowing the truncated conductive bumps to form reflowed conductive bumps.

Abstract translation: 这里描述的是可堆叠的半导体器件封装和相关的堆叠封装组件和方法。 在一个实施例中，制造方法包括：（1）提供包括邻近衬底的上表面设置的接触焊盘的衬底; （2）施加导电材料以形成邻近相应接触焊盘设置的导电凸块; （3）将半导体器件电连接到衬底的上表面; （4）施加模塑材料以形成覆盖导电凸块和半导体器件的模制结构; （5）形成一组切割狭缝，其部分地延伸穿过模制结构和导电凸块以形成截断的导电凸块; 和（6）回流截断的导电凸块以形成回流的导电凸块。

公开(公告)号：US20100171207A1

公开(公告)日：2010-07-08

申请号：US12547063

申请日：2009-08-25

Applicant: Chi-Chih Shen ,  Jen-Chuan CHEN ,  Wen-Hsiung CHANG ,  Chi-Chih CHU ,  Cheng-Yi WENG

Inventor： Chi-Chih Shen ,  Jen-Chuan CHEN ,  Wen-Hsiung CHANG ,  Chi-Chih CHU ,  Cheng-Yi WENG

IPC: H01L25/11 ,  H01L21/56

CPC classification number: H01L21/565 ,  H01L21/4853 ,  H01L23/3128 ,  H01L23/49816 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45664 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3511 ,  H01L2224/85 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2224/45015 ,  H01L2924/207

Abstract: In one embodiment, a manufacturing method includes: (1) applying a first electrically conductive material to an upper surface of a substrate to form first conductive bumps; (2) electrically connecting a semiconductor device to the upper surface of the substrate; (3) applying a molding material to form a molded structure covering the first conductive bumps and the semiconductor device, upper ends of the first conductive bumps being recessed below an upper surface of the molded structure; (4) forming openings adjacent to the upper surface of the molded structure, the openings exposing the upper ends of the first conductive bumps; (5) applying, through the openings, a second electrically conductive material to form second conductive bumps; and (6) forming cutting slits extending through the molded structure and the substrate.

Abstract translation: 在一个实施例中，制造方法包括：（1）将第一导电材料施加到衬底的上表面以形成第一导电凸块; （2）将半导体器件电连接到衬底的上表面; （3）施加模塑材料以形成覆盖所述第一导电凸块和所述半导体器件的模制结构，所述第一导电凸块的上端在所述模制结构的上表面下方凹入; （4）形成与模制结构的上表面相邻的开口，所述开口暴露第一导电凸块的上端; （5）通过所述开口施加第二导电材料以形成第二导电凸块; 和（6）形成延伸穿过模制结构和基底的切割狭缝。

公开(公告)号：US20080076208A1

公开(公告)日：2008-03-27

申请号：US11828352

申请日：2007-07-26

Applicant: Yen-Yi Wu ,  Wei-Yueh Sung ,  Pao-Huei Chang Chien ,  Chi-Chih Chu ,  Cheng-Yin Lee ,  Gwo-Liang Weng

Inventor： Yen-Yi Wu ,  Wei-Yueh Sung ,  Pao-Huei Chang Chien ,  Chi-Chih Chu ,  Cheng-Yin Lee ,  Gwo-Liang Weng

IPC: H01L21/00

CPC classification number: H01L24/14 ,  H01L21/56 ,  H01L23/3128 ,  H01L23/49816 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/1405 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/15321 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: The present invention relates to a semiconductor package and a semiconductor device and a method of making the same. The method of making the semiconductor package comprises: providing a substrate; attaching a chip to a surface of the substrate; forming a plurality of connecting elements for electrically connecting the chip and the substrate; forming a plurality of first conductive bodies on the surface of the substrate; forming a molding compound for encapsulating the surface of the substrate, the chip, the connecting elements and the first conductive bodies; and removing a part of a border portion of the molding compound, so that the molding compound has two heights and one end of each first conductive bodies is exposed. Thereby, the molding compound covers the entire surface of the substrate, so that the bonding pads on the surface of the substrate will not be polluted.

Abstract translation: 本发明涉及半导体封装和半导体器件及其制造方法。 制造半导体封装的方法包括：提供衬底; 将芯片附接到所述基板的表面; 形成用于电连接所述芯片和所述基板的多个连接元件; 在所述基板的表面上形成多个第一导电体; 形成用于封装基板，芯片，连接元件和第一导电体的表面的模塑料; 并且除去模塑料的边界部分的一部分，使得模塑料具有两个高度，并且暴露出每个第一导电体的一端。 因此，成型化合物覆盖基板的整个表面，使得基板表面上的接合焊盘不会被污染。

公开(公告)号：US20080001272A1

公开(公告)日：2008-01-03

申请号：US11561903

申请日：2006-11-21

Applicant: Chi-Chih Chu

Inventor： Chi-Chih Chu

IPC: H01L23/02

CPC classification number: H01L23/13 ,  H01L23/3128 ,  H01L23/49816 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/83385 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A system-in-package structure for preventing a solder ball pad from being polluted and a method of fabricating the same are disclosed. The package structure includes a first package and a second package welded with each other. The first package has a carrier with plural solder ball pads and at least one integrated circuits (ICs) electrically connected to the carrier. A groove is formed around each solder ball pad and used to contain the overflowed sealing compound when the ICs are packaged on the first package by a sealing compound, so that the solder ball pad can avoid being polluted by the sealing compound. Thereby, the first package and second package are exactly electrical connected to each other and form a stacking structure.

Abstract translation: 公开了一种用于防止焊球垫被污染的系统级封装结构及其制造方法。 封装结构包括彼此焊接的第一封装和第二封装。 第一封装具有多个焊球焊盘和至少一个电连接到载体的集成电路（IC）的载体。 在每个焊球垫周围形成凹槽，并且当IC通过密封化合物封装在第一封装上时用于容纳溢出的密封化合物，使得焊球垫可以避免被密封化合物污染。 由此，第一封装和第二封装彼此精确电连接并形成堆叠结构。

公开(公告)号：US20050275074A1

公开(公告)日：2005-12-15

申请号：US10868495

申请日：2004-06-14

Applicant: Gwo-Liang Weng ,  Yung-Li Lu ,  Chi-Chih Chu ,  Shih-Chang Lee

Inventor： Gwo-Liang Weng ,  Yung-Li Lu ,  Chi-Chih Chu ,  Shih-Chang Lee

IPC: H01L23/02 ,  H05K3/30

CPC classification number: H05K3/305 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15311 ,  H05K2201/10734 ,  H05K2203/0545 ,  Y02P70/613 ,  H01L2924/00014

Abstract: A semiconductor package comprising a substrate and a semiconductor device disposed on the substrate by flip-chip bonding. The present invention is characterized by a connection structure disposed between the semiconductor device and the substrate that extends along the periphery of the bottom surface of the semiconductor device. As a result, it can preferably provide additional mounting support between the two. The connection structure can be formed from cured adhesive. The present invention also provides a method of manufacturing the semiconductor package.

Abstract translation: 一种半导体封装，包括通过倒装芯片接合设置在衬底上的衬底和半导体器件。 本发明的特征在于设置在半导体器件和基板之间的连接结构，该连接结构沿着半导体器件的底表面的周边延伸。 结果，它可以优选地在两者之间提供附加的安装支撑。 连接结构可以由固化的粘合剂形成。 本发明还提供一种半导体封装的制造方法。

公开(公告)号：US20050146054A1

公开(公告)日：2005-07-07

申请号：US11028718

申请日：2005-01-03

Applicant: Chi-Chih Chu ,  Gwo-Liang Weng ,  Shih-Chang Lee

Inventor： Chi-Chih Chu ,  Gwo-Liang Weng ,  Shih-Chang Lee

IPC: H01L21/48 ,  H01L21/56 ,  H01L21/60 ,  H01L23/00 ,  H01L23/28 ,  H01L23/48

CPC classification number: H01L23/564 ,  H01L21/563 ,  H01L24/83 ,  H01L24/90 ,  H01L2224/16 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/83102 ,  H01L2224/83851 ,  H01L2224/90 ,  H01L2224/92125 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/0665 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The present invention provides an electronic packaging process. The surface of the chip carrier includes at least a chip attachment region and a film attachment region adjacent to the chip attachment region. At least a baffle is formed on the surface of the chip carrier, between the chip attachment region and the film attachment region. After attaching the thin film to the film attachment region of the chip carrier through an affixture layer, the chip is electrically and physically connected to the chip attachment region of the chip carrier through an adhesive layer. The baffle can effectively prevent the gas that is released from the adhesive layer from damaging the bonding between the thin film and the affixture layer. Therefore, almost no bubbles are formed and good electrical connection between the thin film and the affixture layer is maintained.

Abstract translation: 本发明提供一种电子包装方法。 芯片载体的表面至少包括芯片附着区域和与芯片连接区域相邻的膜附着区域。 在芯片载体的表面上，在芯片安装区域和膜附着区域之间形成至少一个挡板。 在通过粘合层将薄膜附着到芯片载体的膜附着区域之后，芯片通过粘合剂层电连接并且物理地连接到芯片载体的芯片连接区域。 挡板可以有效地防止从粘合剂层释放的气体损害薄膜和固定层之间的粘结。 因此，几乎不形成气泡，并且保持薄膜和附着层之间良好的电连接。

公开(公告)号：US08666361B2

公开(公告)日：2014-03-04

申请号：US13551386

申请日：2012-07-17

Applicant: Kang Chih Chu ,  Gregory Jason Fields

Inventor： Kang Chih Chu ,  Gregory Jason Fields

IPC: H04M11/04

CPC classification number: H04M1/72541 ,  G06F3/0484 ,  G06F3/04883 ,  G06F2203/04808 ,  H04M1/67 ,  H04M2250/22

Abstract: A portable device and method of providing information stored in a memory is provided. A portable device may be capable of storing In Case of Emergency (ICE) information comprising a number of ICE entries and which may be placed in a locked condition, the portable device comprising: a man-machine interface; a display; and, a processor coupled to the display and to the man-machine interface, wherein the processor is adapted to cause the display, in response to detection of one or more predetermined gestures on the man-machine interface, to display at least one ICE entry; and wherein the display displays the at least one ICE entry even if the portable device is in the locked condition, and if the at least one ICE entry is displayed while the portable device is in the locked condition, other information stored on the portable device remains protected.

Abstract translation: 提供了提供存储在存储器中的信息的便携式设备和方法。 便携式设备可以能够存储包括多个ICE条目并且可以被置于锁定状态的紧急情况（ICE）信息，所述便携式设备包括：人机界面; 一个显示器 以及耦合到所述显示器和所述人机界面的处理器，其中所述处理器适于响应于所述人机界面上的一个或多个预定手势的检测而使所述显示器显示至少一个ICE入口 ; 并且其中所述显示器即使所述便携式设备处于锁定状态，也显示所述至少一个ICE入口，并且如果在所述便携式设备处于锁定状态时显示所述至少一个ICE入口，则存储在所述便携式设备上的其他信息保持 保护。