公开(公告)号：US5435733A

公开(公告)日：1995-07-25

申请号：US152342

申请日：1993-11-12

Applicant: Gerald P. Chernicky ,  Christopher M. Schreiber ,  Alan L. Kovacs ,  Bao Q. Le ,  Haim Feigenbaum

Inventor： Gerald P. Chernicky ,  Christopher M. Schreiber ,  Alan L. Kovacs ,  Bao Q. Le ,  Haim Feigenbaum

IPC: H05K3/32 ,  H01L21/60

CPC classification number: H05K3/325 ,  H01L2224/48091 ,  H01L2924/30107 ,  H01L2924/3011

Abstract: A Multi-Chip-Module or MCM (66) is mounted on a supporting motherboard (64). A plurality of first contact pads (99) are formed on the module (66) adjacent to its peripheral edge for interconnection with microelectronic components (70,72,74,76,78) mounted on the module (66). Second contact pads (94) are formed on the motherboard (64) adjacent to respective first contact pads (99). A flexible cable (96) includes controlled impedance microstrip or stripline conductor (98) with first and second gold dots (100,102) at their ends. A frame (104) resiliently presses the first and second gold dots (100, 102) into connection with respective first and second contacts (99,94) for interconnection thereof. The components (70, 72,74,76,78) on the module (66) can be hermetically sealed by a cover (80), and the module (66) and cable (96) can be hermetically sealed by a first resilient ring (112) which is compressed between the frame (104) and the cover (80), and a second resilient ring (114) which is compressed between the frame (104) and the motherboard (64). Alternatively, the cover (80) and the first ring (112) can be replaced by a cover (104a) which is integral with a frame (104'). An alternative connector (136) includes a flexible cable (146) which extends around an edge of a frame (144) to enable vertical stacking of MCMs (164) and/or backplanes (138) in any combination.

Abstract translation: 多芯片模块或MCM（66）安装在支撑主板（64）上。 多个第一接触焊盘（99）在与其外围边缘相邻的模块（66）上形成，用于与安装在模块（66）上的微电子部件（70,72,74,76,78）互连。 第二接触焊盘（94）形成在与相应的第一接触焊盘（99）相邻的母板（64）上。 柔性电缆（96）包括在其端部具有第一和第二金点（100,102）的受控阻抗微带线或带状线导体（98）。 框架（104）将第一和第二金点（100,102）弹性地按压以与相应的第一和第二触点（99,94）连接，用于互连。 模块（66）上的组件（70,72,74,76,78）可以被盖（80）气密地密封，并且模块（66）和电缆（96）可以被第一弹性环气密地密封 被压缩在框架（104）和盖（80）之间的第二弹性环（112）和压缩在框架（104）和母板（64）之间的第二弹性环（114）。 或者，盖（80）和第一环（112）可以由与框架（104'）成一体的盖（104a）代替。 替代连接器（136）包括围绕框架（144）的边缘延伸的柔性电缆（146），以实现任何组合的MCM（164）和/或背板（138）的垂直堆叠。

公开(公告)号：US5364277A

公开(公告)日：1994-11-15

申请号：US106975

申请日：1993-08-16

Applicant: William R. Crumly ,  Christopher M. Schreiber ,  Haim Feigenbaum

Inventor： William R. Crumly ,  Christopher M. Schreiber ,  Haim Feigenbaum

IPC: C07J61/00 ,  H01R9/09

CPC classification number: C07J61/00

Abstract: A pressure-type contact for flexible or conventional wire cable terminations is fabricated from electroformed thin metallic wafers (100) in which one wafer is plated with a raised conductive interconnection feature (122). The electrical circuitry (118, 120) is made on a stainless steel mandrel (10, 10a) having a Teflon pattern (16, 16a) on its surface that allows the desired electrical circuit (30, 32, 34, 30a, 32a, 34a, 78) to be electrolytically plated upon the conductive mandrel surface. The mandrel surface is formed with projecting features in the form of depressions (24, 24a) that will form a series of dots or raised interconnection features on the termination wafers. The mandrel also has projecting posts (76) for providing electrical connection through the substrate.

Abstract translation: 用于柔性或常规电缆电缆终端的压力接触由电铸薄金属晶片（100）制成，其中一个晶片被电镀有升高的导电互连特征（122）。 电路（118,120）在其表面上具有特氟隆图案（16,16a）的不锈钢心轴（10,10a）上制成，其允许所需的电路（30,32,34,30a，32a，34a） ，78）电解镀在导电芯棒表面上。 心轴表面形成有凹陷（24,24aa）形式的突出特征，其将在端接晶片上形成一系列点或凸起的互连特征。 心轴还具有用于提供通过基底的电连接的突出柱（76）。

公开(公告)号：US5197184A

公开(公告)日：1993-03-30

申请号：US580758

申请日：1990-09-11

Applicant: William R. Crumly ,  Christopher M. Schreiber ,  Haim Feigenbaum

Inventor： William R. Crumly ,  Christopher M. Schreiber ,  Haim Feigenbaum

IPC: H05K1/11 ,  H05K3/20 ,  H05K3/40 ,  H05K3/46

CPC classification number: H05K3/205 ,  H05K3/4007 ,  H05K3/4647 ,  H05K3/4682 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/09509 ,  H05K2203/0108 ,  H05K2203/0113 ,  H05K2203/0117 ,  H05K2203/0726 ,  Y10T29/49155 ,  Y10T29/49158

Abstract: A pressure-type contact for flexible or conventional wire cable terminations is fabricated from electroformed thin metallic wafers (100) in which one wafer is plated with a raised conductive interconnection feature (122). The electrical circuitry (118, 120) is made on a stainless steel mandrel (10, 10a) having a TEFLON pattern (16, 16a) on its surface that allows the desired electrical circuit (30, 32, 34, 30a, 32a, 34a, 78) to be electrolytically plated upon the conductive mandrel surface. The mandrel surface is formed with projecting features in the form of depressions (24, 24a) that will form a series of dots or raised interconnection features on the termination wafers. The mandrel also has projecting posts (76) for providing electrical connection through the substrate.

公开(公告)号：US4463068A

公开(公告)日：1984-07-31

申请号：US430155

申请日：1982-09-30

Applicant: J. Gunther Cohn ,  Haim Feigenbaum ,  Arthur Kaufman

Inventor： J. Gunther Cohn ,  Haim Feigenbaum ,  Arthur Kaufman

IPC: H01M2/38 ,  H01M8/04 ,  H01M8/24

CPC classification number: H01M2/38 ,  H01M8/04283 ,  H01M8/2415

Abstract: An electrolyte distribution and supply system for use with a fuel cell having a means for drawing electrolyte therein is formed by a set of containers of electrolyte joined to respective fuel cells in a stack of such cells. The electrolyte is separately stored so as to provide for electrical isolation between electrolytes of the individual cells of the stack. Individual storage compartments are coupled by tubes containing wicking fibers, the ends of the respective tubes terminating on the means for drawing electrolyte in each of the respective fuel cells. Each tube is heat shrunk to tightly bind the fibers therein.

Abstract translation: 一种与燃料电池一起使用的电解质分配和供给系统，其具有用于在其中抽吸电解质的装置，其通过一组电解质形成，该组电容器连接到这种电池堆中的各个燃料电池。 电解液分开存储，以提供堆叠单个电池的电解质之间的电隔离。 单独的储存室通过含有芯吸纤维的管连接，相应管的端部终止于用于在每个相应的燃料电池中抽取电解质的装置。 每个管被热收缩以将纤维紧密地结合在其中。

公开(公告)号：US06547944B2

公开(公告)日：2003-04-15

申请号：US09733735

申请日：2000-12-08

Applicant: Chris M. Schreiber ,  Mordechay Schlesinger ,  Robert Martinez ,  Haim Feigenbaum ,  William Robert Crumly

Inventor： Chris M. Schreiber ,  Mordechay Schlesinger ,  Robert Martinez ,  Haim Feigenbaum ,  William Robert Crumly

IPC: C25D500

CPC classification number: C25D5/10 ,  C25D1/006 ,  C25D5/12 ,  C25D5/18

Abstract: A method for forming a nanolaminate structure is provided which comprises plating a substrate with layers of substantially a first metal and substantially a second metal using an electrolytic plating process and controlling the plating current to obtain a desired current density at the cathode, which is maintained within a predefined range.

公开(公告)号：US5777484A

公开(公告)日：1998-07-07

申请号：US720589

申请日：1996-09-30

Applicant: Blake F. Woith ,  Haim Feigenbaum ,  John Steven Szalay

Inventor： Blake F. Woith ,  Haim Feigenbaum ,  John Steven Szalay

IPC: G01R31/28 ,  G01R31/02

CPC classification number: G01R31/2881 ,  G01R31/2886

Abstract: The invention includes a testing apparatus for testing integrated circuit chips during vibration. The apparatus includes a vibration fixture base which is a table that can be vibrated vertically and/or horizontally. The base supports a holding fixture for supporting a flexible circuit having circuit traces whose ends terminate in raised dots or bumps. The flexible circuit is clamped to the holding fixture to properly position the raised features at the end of the circuit traces. A holder and clamp unit holds a plurality of integrated circuit chips and clamps the chips against the bumps on the flexible circuit with predetermined pressure to make electrical contact between pads on the integrated circuit chip and the bumps. The clamp unit can be raised and lower and rotated. Even pressure is assured by a compressible layer carried in the fixture and located beneath the bumps. The contact points of the bumps and the integrated circuit chip pads vibrate in unison during vibration testing. Firm clamping pressure provided by the compressible layer and the clamp eliminates damage to the chip under vibration testing.

Abstract translation: 本发明包括用于在振动期间测试集成电路芯片的测试装置。 该装置包括：振动台，其是可以垂直和/或水平地振动的台。 基座支撑固定夹具，用于支撑具有电路迹线的柔性电路，其末端终止于凸点或凸点。 柔性电路被夹紧到保持夹具上，以将电路迹线末端的凸起特征正确定位。 保持器和夹紧单元保持多个集成电路芯片，并以预定的压力将芯片夹紧在柔性电路上的凸块上，以在集成电路芯片上的焊盘和凸块之间进行电接触。 夹紧单元可以升高和降低并旋转。 通过在夹具中携带并位于凸块下方的可压缩层来确保均匀的压力。 凸块和集成电路芯片焊盘的接触点在振动测试期间一致振动。 可压缩层和夹具提供的牢固的夹紧压力可以消除振动试验对芯片的损坏。

公开(公告)号：US5708557A

公开(公告)日：1998-01-13

申请号：US703921

申请日：1996-08-22

Applicant: Haim Feigenbaum ,  Bao Le ,  Randy Lee Thomas ,  Dong Vo

Inventor： Haim Feigenbaum ,  Bao Le ,  Randy Lee Thomas ,  Dong Vo

IPC: H01L21/683 ,  H02N13/00

CPC classification number: H02N13/00 ,  H01L21/6831 ,  H01L21/6833 ,  Y10T279/23

Abstract: The invention includes a puncture-resistant electrostatic chuck with a flat surface and a method of making the same. The electrostatic chuck includes a conductive layer such as copper foil that is laminated to a first insulation layer such as a polyimide. A puncture-resistant layer is placed over the conductive layer and includes random or woven fibers held together by a resin. The puncture-resistant layer has an uneven topography on a top surface due to the fibers contained therein. A second insulation layer overlies the puncture-resistant layer and has a top surface which is substantially flat. The flat top surface of the second insulation layer is made by laminating layers together with a mandrel which is polished and free of irregularities such as pits, dents and high spots. Preferably the mandrel has a uniform thickness over its entire surface.

Abstract translation: 本发明包括具有平坦表面的耐刺穿静电卡盘及其制造方法。 静电卡盘包括层压到诸如聚酰亚胺的第一绝缘层的诸如铜箔的导电层。 抗穿刺层放置在导电层上，并且包括由树脂保持在一起的无规或编织纤维。 耐穿刺层由于其中包含的纤维而在顶表面上具有不平坦的形貌。 第二绝缘层覆盖在抗穿刺层上并且具有基本平坦的顶表面。 第二绝缘层的平坦顶表面通过将抛光并且没有诸如凹坑，凹痕和高点等凹凸的心轴层压在一起而制成。 优选地，心轴在其整个表面上具有均匀的厚度。

公开(公告)号：US5326412A

公开(公告)日：1994-07-05

申请号：US994801

申请日：1992-12-22

Applicant: Christopher M. Schreiber ,  Haim Feigenbaum

Inventor： Christopher M. Schreiber ,  Haim Feigenbaum

IPC: H05K3/20 ,  H05K3/28 ,  H05K3/40 ,  B32B31/12

CPC classification number: H05K3/4007 ,  B32B37/12 ,  B32B38/1833 ,  H05K3/205 ,  B32B2457/08 ,  H05K2201/0367 ,  H05K2203/0113 ,  H05K2203/0117 ,  H05K2203/063 ,  H05K2203/0726 ,  H05K3/281 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/4916

Abstract: A corrosion resistant barrier is provided for isolated circuity. An isolated circuit (10, 12) with raised interconnection features (16, 18) having a corrosion resistant gold coating (34) is formed on a reusable stainless steel mandrel (22) which is provided with indentations to define raised features. A seed layer (32) of copper is electroplated on the mandrel in a pattern of the isolated circuit to be formed. The copper seed layer (32) is then followed by electroplated layers of gold (34), nickel (36) and copper (38) until a total desired conductor thickness is achieved. A dielectric substrate (44, 46) is laminated on the multilayer conductive traces of the circuit. After removal of the multilayer circuit from the mandrel, a predrilled dielectric coverlay (50) is laminated to the circuit with holes in the coverlay receiving the raised circuit features (52). The finished part is then etched to remove the copper seed layer from the raised features.

Abstract translation: 隔离电路提供了耐腐蚀屏障。 在可重复使用的不锈钢心轴（22）上形成具有具有耐腐蚀金涂层（34）的具有凸起的互连特征（16,18）的隔离电路（10,12），所述不锈钢心轴（22）设有压痕以限定凸起特征。 铜芯的种子层（32）以待形成的隔离电路的图案在心轴上电镀。 铜籽晶层（32）之后是金（34），镍（36）和铜（38）的电镀层，直到达到总的所需导体厚度。 电介质基板（44,46）层压在电路的多层导电迹线上。 在从心轴移除多层电路之后，预先填充的电介质覆盖层（50）被层压到电路上，其中覆盖层中的孔接收升高的电路特征（52）。 然后蚀刻成品部分以从凸起的特征​​中去除铜种子层。

公开(公告)号：US5245750A

公开(公告)日：1993-09-21

申请号：US843128

申请日：1992-02-28

Applicant: William R. Crumly ,  Haim Feigenbaum

Inventor： William R. Crumly ,  Haim Feigenbaum

IPC: H01L21/48 ,  H01L21/60 ,  H01L21/68 ,  H01L23/13 ,  H01L23/498 ,  H05K1/18 ,  H05K3/20 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40

CPC classification number: H01L21/6835 ,  H01L21/4853 ,  H01L23/13 ,  H01L23/49816 ,  H01L24/81 ,  H05K3/323 ,  H05K3/3436 ,  H05K3/4007 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2224/13111 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07811 ,  H01L2924/14 ,  H05K2201/0367 ,  H05K2201/10674 ,  H05K2203/0113 ,  H05K3/205 ,  H05K3/321 ,  Y02P70/613 ,  Y10T29/49144

Abstract: An integrated circuit chip (26, 34) is connected to a circuit trace by providing a raised feature on a circuit trace (17, 28) which is coated with a material capable of forming an electrical connection (23, 32), as well as an attachment when the pad (25, 33) of an integrated circuit chip (26, 34) is brought into engagement with it. This material may be solder (23) or it may be a Z-axis adhesive (32) which becomes conductive at areas where it is compressed. The raised feature or bump (18, 31) on the circuit trace (17, 28) may be produced by providing a mandrel (10) having a recess (12) complementary to the raised feature (18, 31) to be provided, and suitably plating the circuit trace (17, 28) on the mandrel (10) including the recessed area (12). Upon subsequent lamination of a dielectric layer (19, 30) and removal from the mandrel (10), there is produced a circuit trace (17, 28) on a dielectric with a raised feature (18, 31) which can be used to attach to an integrated circuit chip (26, 34).

公开(公告)号：US4467019A

公开(公告)日：1984-08-21

申请号：US430156

申请日：1982-09-30

Applicant: Haim Feigenbaum

Inventor： Haim Feigenbaum

IPC: H01M8/02 ,  H01M8/08 ,  H01M8/04

CPC classification number: H01M8/08 ,  H01M8/0293

Abstract: A fuel cell having a pair of electrodes at the sites of electrochemical reactions of hydrogen and oxygen and a phosphoric acid electrolyte provided with an electrolyte supporting structure in the form of a laminated matrix assembly disposed between the electrodes. The matrix assembly is formed of a central layer disposed between two outer layers, each being permeable to the flow of the electrolyte. The central layer is provided with relatively large pores while the outer layers are provided with relatively small pores. An external reservoir supplies electrolyte via a feed means to the central layer to compensate for changes in electrolyte volume in the matrix assembly during the operation of fuel cell.

Abstract translation: 一种在氢和氧的电化学反应位置具有一对电极的燃料电池和设置在电极之间的层叠基体组合物形式的电解质支撑结构的磷酸电解质。 基质组件由设置在两个外层之间的中心层形成，每个外层可透过电解液流。 中心层设置有相对较大的孔，而外层设置有相对较小的孔。 外部储存器通过进料装置向中心层供应电解质，以补偿燃料电池运行期间基体组件中的电解质体积的变化。