公开(公告)号：US20110116737A1

公开(公告)日：2011-05-19

申请号：US12761716

申请日：2010-04-16

Applicant: Sang-Hoon KIM ,  Han-Seo Cho ,  Joon-Sung Kim ,  Jae-Hyun Jung

Inventor： Sang-Hoon KIM ,  Han-Seo Cho ,  Joon-Sung Kim ,  Jae-Hyun Jung

IPC: G02B6/12 ,  H01R43/00

CPC classification number: G02B6/4201 ,  G02B6/4214 ,  G02B6/428 ,  G02B6/43 ,  Y10T29/49117

Abstract: An optical wiring board and a manufacturing method thereof are disclosed. In accordance with an embodiment of the present invention, the method includes providing a flexible optical waveguide layer, selectively forming a reinforcing clad on one surface of the optical waveguide layer and forming a mirror groove on the other surface of the optical waveguide layer in accordance with where the reinforcing clad is formed. Thus, the clad can be formed thick only on the place where the mirror groove is to be formed, and thus a flexible optical wiring board having flexibility can be manufactured even though the optical wiring board is generally made thin.

Abstract translation: 公开了一种光布线板及其制造方法。 根据本发明的实施例，该方法包括提供柔性光波导层，在光波导层的一个表面上选择性地形成加强包层，并在光波导层的另一个表面上根据 其中形成加强包层。 因此，只要在形成镜面凹槽的地方能够形成厚度的包层，即使光线路板通常薄，也可以制造具有挠性的挠性光布线板。

公开(公告)号：US20110103738A1

公开(公告)日：2011-05-05

申请号：US12910286

申请日：2010-10-22

Applicant: Joon-Sung KIM ,  Han-Seo CHO ,  Jae-Hyun JUNG ,  San-Hoon KIM

Inventor： Joon-Sung KIM ,  Han-Seo CHO ,  Jae-Hyun JUNG ,  San-Hoon KIM

IPC: G02B6/12 ,  B05D5/06

CPC classification number: G02B6/1221 ,  G02B6/138

Abstract: An optical wiring board and a manufacturing method thereof are disclosed. In accordance with an embodiment of the present invention, the method includes providing a base substrate having a wiring groove formed therein, forming a first clad layer by filling a first clad substance in the wiring groove, stacking an intermediate insulating layer on the base substrate, in which the intermediate insulating layer has a first through-hole formed therein and the first through-hole corresponds to the wiring groove, forming a core unit on the first clad layer, stacking a cover insulting layer on the intermediate insulating layer, in which the cover insulating layer has a second through-hole formed therein and the second through-hole corresponds to the first through-hole, and forming a second clad layer by filling a second clad substance in the second through-hole, in which the second clad layer covers the core unit.

Abstract translation: 公开了一种光布线板及其制造方法。 根据本发明的一个实施例，该方法包括提供其中形成有布线槽的基底基板，通过在布线槽中填充第一包层物质形成第一覆盖层，在基底基板上堆叠中间绝缘层， 其中中间绝缘层具有形成在其中的第一通孔，第一通孔对应于布线槽，在第一覆层上形成芯单元，在中间绝缘层上堆叠覆盖绝缘层，其中 覆盖绝缘层具有形成在其中的第二通孔，第二通孔对应于第一通孔，并且通过在第二通孔中填充第二包层物质形成第二包覆层，其中第二覆盖层 覆盖核心单元。

公开(公告)号：US07903410B2

公开(公告)日：2011-03-08

申请号：US12010879

申请日：2008-01-30

Applicant: Suk-Hyeon Cho ,  Je-Gwang Yoo ,  Min-Sang Lee ,  Seon-Goo Lee ,  Han-Seo Cho

Inventor： Suk-Hyeon Cho ,  Je-Gwang Yoo ,  Min-Sang Lee ,  Seon-Goo Lee ,  Han-Seo Cho

IPC: H05K7/20 ,  H01L23/34 ,  H01L33/00

CPC classification number: H01L23/3121 ,  H01L23/13 ,  H01L23/16 ,  H01L23/36 ,  H01L23/49833 ,  H01L24/48 ,  H01L24/49 ,  H01L27/14618 ,  H01L31/0203 ,  H01L33/64 ,  H01L2224/05599 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/49109 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012 ,  H01L2224/45099

Abstract: A package board and a method for the manufacturing of the package board are disclosed. A package board, which includes a first metal layer, a heat-release layer stacked on the first metal layer with a first insulation layer interposed in-between, a cavity formed in the heat-release layer, a mounting layer formed in the cavity in contact with the first insulation layer, a first component mounted on the mounting layer, and a second insulation layer covering at least a portion of the heat-release layer and the cavity, may offer improved heat release and smaller thickness.

Abstract translation: 公开了一种用于制造封装板的封装板和方法。 一种封装板，其包括第一金属层，堆叠在第一金属层上的隔热层，其间插入有第一绝缘层，形成在所述隔热层中的空腔，形成在所述空腔中的安装层 与第一绝缘层接触，安装在安装层上的第一部件和覆盖散热层和空腔的至少一部分的第二绝缘层可提供改进的散热和更小的厚度。

公开(公告)号：US20110039076A1

公开(公告)日：2011-02-17

申请号：US12923993

申请日：2010-10-19

Applicant: Joon-Sung Kim ,  Je-Gwang Yoo ,  Chang-Sup Ryu ,  Han-Seo Cho ,  Sang-Hoon Kim

Inventor： Joon-Sung Kim ,  Je-Gwang Yoo ,  Chang-Sup Ryu ,  Han-Seo Cho ,  Sang-Hoon Kim

IPC: B32B3/00

CPC classification number: B29D11/00663 ,  B29D11/00807 ,  G02B6/136 ,  H05K1/0274 ,  Y10T428/24612

Abstract: An optical wiring board having a core, the optical wiring board including: a lower cladding; a side cladding formed over the lower cladding and having an indentation formed therein, the indentation being in correspondence with the core; a core embedded in the indentation; and an upper cladding covering the core, wherein a height of the core is different from a depth of the indentation

Abstract translation: 一种具有芯的光布线板，所述光布线板包括：下包层; 在所述下包层上形成有在其中形成有凹陷的侧包层，所述凹陷与所述芯相对应; 嵌入缩进的核心; 以及覆盖所述芯的上包层，其中所述芯的高度不同于所述凹陷的深度

公开(公告)号：US20100316330A1

公开(公告)日：2010-12-16

申请号：US12553899

申请日：2009-09-03

Applicant: Sang Hoon Kim ,  Han Seo Cho ,  Jae Hyun Jung ,  Joon Sung Kim

Inventor： Sang Hoon Kim ,  Han Seo Cho ,  Jae Hyun Jung ,  Joon Sung Kim

IPC: G02B6/12 ,  G02B6/10 ,  G02B1/12

CPC classification number: G02B6/138

Abstract: Disclosed herein is a printed circuit board for an optical waveguide, including: a lower substrate; an insulation layer which has a through-hole and is formed on the lower substrate; an optical waveguide which is formed in the through-hole such that a clearance is present between the optical wave guide and an inner wall of the through-hole; and an adhesive material which is charged in the clearance. The printed circuit board for an optical waveguide is advantageous in that a lower clad material, a core material and an upper clad material are sequentially applied on the lower substrate partially, not entirely, based on the region in which a core is formed, and is then patterned to form an optical waveguide, so that the amounts of the lower and upper clad materials and the core material, which are used to form the optical waveguide, can be greatly decreased.

Abstract translation: 本文公开了一种用于光波导的印刷电路板，包括：下基板; 绝缘层，其具有通孔并形成在所述下基板上; 形成在所述通孔中的光波导，使得在所述光波导与所述通孔的内壁之间存在间隙; 以及在间隙中装入的粘合剂材料。 用于光波导的印刷电路板的优点在于，基于形成芯的区域，下包层材料，芯材料和上包层材料被部分地，不完全地部分地施加在下基板上，并且是 然后图案化以形成光波导，使得用于形成光波导的下包层材料和上覆层材料和芯材的量可以大大降低。

公开(公告)号：US07831116B2

公开(公告)日：2010-11-09

申请号：US12232899

申请日：2008-09-25

Applicant: Joon-Sung Kim ,  Jae-Hyun Jung ,  Han-Seo Cho ,  Sang-Hoon Kim

Inventor： Joon-Sung Kim ,  Jae-Hyun Jung ,  Han-Seo Cho ,  Sang-Hoon Kim

IPC: G02B6/12 ,  H01L21/00

CPC classification number: G02B6/43 ,  G02B6/4224 ,  H05K1/0269 ,  H05K1/0274 ,  H05K2201/0108 ,  H05K2201/09781 ,  H05K2201/09918

Abstract: An optical waveguide, an optical printed circuit board equipped with the optical waveguide, and methods of manufacturing the optical waveguide and the optical printed circuit board are disclosed. The optical waveguide can include: a first cladding layer; a core formed on the first cladding layer; an alignment pattern, having a predefined positional relationship to the core, formed on the first cladding layer; a target mark formed on the alignment pattern to indicate a position of the alignment pattern; and a second cladding layer formed on the first cladding layer to cover the core, the alignment pattern, and the target mark. In such an optical waveguide, circuit patterns, etc., formed over the second cladding layer may be precisely and efficiently aligned with the core.

Abstract translation: 公开了一种光波导，配备有光波导的光学印刷电路板以及制造光波导和光学印刷电路板的方法。 光波导可以包括：第一包层; 形成在第一包层上的芯; 形成在所述第一包层上的与所述芯部具有预定位置关系的对准图案; 形成在所述对准图案上以指示所述对准图案的位置的目标标记; 以及形成在所述第一包覆层上以覆盖所述芯，所述对准图案和所述目标标记的第二包层。 在这种光波导中，形成在第二覆层上的电路图案等可以精确且有效地与芯对准。

公开(公告)号：US07672547B2

公开(公告)日：2010-03-02

申请号：US12216995

申请日：2008-07-14

Applicant: Sang Hoon Kim ,  Je Gwang Yoo ,  Joon Sung Kim ,  Jae Hyun Jung ,  Han Seo Cho

Inventor： Sang Hoon Kim ,  Je Gwang Yoo ,  Joon Sung Kim ,  Jae Hyun Jung ,  Han Seo Cho

IPC: G02B6/12 ,  H01L21/00

CPC classification number: G02B6/43 ,  G02B6/132 ,  G02B6/4214 ,  H05K1/0274 ,  H05K3/4602

Abstract: A printed circuit board including an optical waveguide and a method of manufacturing the board. In the board, the optical waveguide includes a metal layer extending portion integrally connected to a metal layer constituting a mirror formed in the optical waveguide. Since the method creates the mirror using electroless plating, which is typically used in a process of manufacturing general printed circuit boards, it is suitable for the manufacture of printed circuit boards having a large area, and the mirror has high reflectivity and is efficient in terms of material consumption.

Abstract translation: 一种包括光波导的印刷电路板及其制造方法。 在该板中，光波导包括与构成在光波导中形成的反射镜的金属层一体连接的金属层延伸部。 由于该方法使用通常用于制造通用印刷电路板的工艺中的化学镀的反射镜，所以它适用于制造具有大面积的印刷电路板，并且反射镜具有高反射率并且有效率 的物质消耗。

公开(公告)号：US20100018052A1

公开(公告)日：2010-01-28

申请号：US12285423

申请日：2008-10-03

Applicant: Sang Hoon Kim ,  Han Seo Cho ,  Jae Hyun Jung ,  Joon Sung Kim

Inventor： Sang Hoon Kim ,  Han Seo Cho ,  Jae Hyun Jung ,  Joon Sung Kim

IPC: H05K3/02

CPC classification number: G02B6/43 ,  G02B6/132 ,  H05K1/0274 ,  H05K3/0032 ,  Y10T29/49155

Abstract: Disclosed herein is a method of manufacturing a printed circuit board for an optical waveguide which includes electrical and optical layers for transmitting electrical and optical signals to the printed circuit board. The method includes forming a lower clad layer on a base substrate, layering or applying a core material on the lower clad layer, machining a trench in the core material to form a core layer having a core pattern, and forming an upper clad layer on the lower clad layer and the core layer. The method enables an optical waveguide to be manufactured using a simple apparatus and process without the use of an additional photo mask.

Abstract translation: 本文公开了一种制造用于光波导的印刷电路板的方法，该方法包括用于将电和光信号传输到印刷电路板的电和光层。 该方法包括在基底基板上形成下包覆层，在下包层上层叠或施加芯材，在芯材中加工沟槽以形成具有芯图案的芯层，并在其上形成上覆层 下包层和芯层。 该方法能够使用简单的装置和工艺制造光波导，而不需要使用附加的光掩模。

公开(公告)号：US20090304324A1

公开(公告)日：2009-12-10

申请号：US12232899

申请日：2008-09-25

Applicant: Joon-Sung Kim ,  Jae-Hyun Jung ,  Han-Seo Cho ,  Sang-Hoon Kim

Inventor： Joon-Sung Kim ,  Jae-Hyun Jung ,  Han-Seo Cho ,  Sang-Hoon Kim

IPC: G02B6/12 ,  G02B6/02

CPC classification number: G02B6/43 ,  G02B6/4224 ,  H05K1/0269 ,  H05K1/0274 ,  H05K2201/0108 ,  H05K2201/09781 ,  H05K2201/09918

Abstract: An optical waveguide, an optical printed circuit board equipped with the optical waveguide, and methods of manufacturing the optical waveguide and the optical printed circuit board are disclosed. The optical waveguide can include: a first cladding layer; a core formed on the first cladding layer; an alignment pattern, having a predefined positional relationship to the core, formed on the first cladding layer; a target mark formed on the alignment pattern to indicate a position of the alignment pattern; and a second cladding layer formed on the first cladding layer to cover the core, the alignment pattern, and the target mark. In such an optical waveguide, circuit patterns, etc., formed over the second cladding layer may be precisely and efficiently aligned with the core.

Abstract translation: 公开了一种光波导，配备有光波导的光学印刷电路板以及制造光波导和光学印刷电路板的方法。 光波导可以包括：第一包层; 形成在第一包层上的芯; 形成在所述第一包层上的与所述芯部具有预定位置关系的对准图案; 形成在所述对准图案上以指示所述对准图案的位置的目标标记; 以及形成在所述第一包覆层上以覆盖所述芯，所述对准图案和所述目标标记的第二包层。 在这种光波导中，形成在第二覆层上的电路图案等可以精确且有效地与芯对准。

公开(公告)号：US07529439B2

公开(公告)日：2009-05-05

申请号：US11889327

申请日：2007-08-10

Applicant: Joon-Sung Kim ,  Je-Gwang Yoo ,  Han-Seo Cho ,  Sang-Hoon Kim

Inventor： Joon-Sung Kim ,  Je-Gwang Yoo ,  Han-Seo Cho ,  Sang-Hoon Kim

IPC: G02B6/12 ,  G02B6/32

CPC classification number: G02B6/43 ,  G02B6/4214 ,  H05K1/0274

Abstract: An optical printed circuit board which can transfer optical signal and electric signals simultaneously, and a method of fabricating the optical printed circuit board. An optical printed circuit board which includes an upper cladding layer, a core layer positioned in the upper cladding layer that has a first reflecting surface and a second reflecting surface at both ends to guide optical signals, a lower cladding layer of which one side is in contact with the upper cladding layer and which has a circuit pattern and light connecting bumps on the other side corresponding to the first reflecting surface and the second reflecting surface, may provide the advantage of high optical connection efficiency.

Abstract translation: 可以同时传送光信号和电信号的光学印刷电路板，以及制造光学印刷电路板的方法。 一种光学印刷电路板，包括上包层，位于上包层中的芯层，其具有第一反射表面和两端的第二反射表面以引导光信号;一侧的下包层 与上包层接触并且具有电路图案和在与第一反射表面和第二反射表面相对应的另一侧上的光连接凸块可提供高的光连接效率的优点。