WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
    23.
    发明申请
    WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME 审中-公开
    接线基板及其制造方法

    公开(公告)号:US20090288870A1

    公开(公告)日:2009-11-26

    申请号:US12469952

    申请日:2009-05-21

    IPC分类号: H05K1/11 H01B13/00 C25D5/02

    摘要: A method of manufacturing a wiring substrate of the present invention, includes a step of forming a first wiring layer on an underlying layer, a step of forming a stacked body in which a protection layer is provided on an insulating layer, on the first wiring layer, a step of forming a via hole reaching the first wiring layer by processing the protection layer and the insulating layer, a step of roughening a side surface of the via hole by applying a desmear process to an inside of the via hole while using the protection layer as a mask, a step of removing the protection layer, and a step of forming a second wiring layer, which is connected to the first wiring layer via the via hole, on the insulating layer. The second wiring layer may be formed after the surface of the insulating layer is roughened, or the second wiring layer may be formed without roughening of the surface of the insulating layer.

    摘要翻译: 制造本发明的布线基板的方法包括在下层上形成第一布线层的步骤,在绝缘层上形成保护层的层叠体的形成工序,第一布线层 通过加工保护层和绝缘层形成到达第一布线层的通孔的步骤;通过在使用保护层的同时对通孔的内部进行去污处理而使通孔的侧面粗糙化的步骤 作为掩模的层,去除保护层的步骤,以及在绝缘层上形成经由通孔连接到第一布线层的第二布线层的步骤。 第二布线层可以在绝缘层的表面粗糙化之后形成,或者可以在不使绝缘层的表面变粗糙的情况下形成第二布线层。

    METHOD OF MANUFACTURING WIRING SUBSTRATE
    24.
    发明申请
    METHOD OF MANUFACTURING WIRING SUBSTRATE 有权
    制造接线基板的方法

    公开(公告)号:US20090283497A1

    公开(公告)日:2009-11-19

    申请号:US12425668

    申请日:2009-04-17

    申请人: Hitoshi KONDO

    发明人: Hitoshi KONDO

    IPC分类号: B44C1/22

    摘要: A method of manufacturing a wiring substrate of the present invention, includes the steps of forming a seed layer on an underlying layer, forming a plating resist in which an opening portion is provided on the seed layer, forming a copper plating layer in the opening portion by an electroplating, removing the plating resist, wet-etching the seed layer using the copper plating layer as a mask to obtain the wiring layer, roughening a surface of the wiring layer by a blackening process, and forming an insulating layer on the wiring layer, wherein a surface of the copper plating layer is soft-etched simultaneously in the step of etching the seed layer, whereby a soft etching step of the wiring layer carried out prior to the step of the blackening process is omitted.

    摘要翻译: 制造本发明的布线基板的方法包括以下步骤:在下层上形成种子层,形成在种子层上形成开口部的电镀抗蚀剂,在开口部形成铜镀层 通过电镀,除去电镀抗蚀剂,使用铜镀层作为掩模对种子层进行湿法蚀刻以获得布线层,通过黑化处理使布线层的表面粗糙化,以及在布线层上形成绝缘层 其中,在蚀刻种子层的步骤中,同时对铜镀层的表面进行软蚀刻,由此省略在黑化处理之前执行的布线层的软蚀刻步骤。

    Foamed rubber extruded product
    27.
    发明授权
    Foamed rubber extruded product 失效
    发泡橡胶挤出产品

    公开(公告)号:US6132847A

    公开(公告)日:2000-10-17

    申请号:US186881

    申请日:1998-11-06

    摘要: A formed rubber extruded product which is formed of a vulcanizate of a rubber blend comprising a sulfur-vulcanizable ethylene-propylene-type rubber (EPDM) as a starting rubber and a pyrolytic foaming agent. The vulcanizate has a specific gravity of from 0.9 to 1.0 and a surface roughness (RZD) of 14 micrometers or less. The rubber blend contains the pyrolytic foaming agent in the form of an inorganic powder-supported foaming agent. A particle diameter of the inorganic powder in the inorganic powder-supported foaming agent is approximately 9 micrometers or less, and a particle diameter of the pyrolytic foaming agent is approximately 8 micrometers or less. Further, crystalline PE is contained in an amount of from 6 to 30 parts per 100 parts of EPDM. The foamed rubber extruded product of the present invention can be produced by the extrusion at a high rate.

    摘要翻译: 一种形成的橡胶挤出产品,由橡胶混合物硫化橡胶制成,该橡胶混合物含有作为起始橡胶的可硫化乙烯 - 丙烯类橡胶(EPDM)和热解发泡剂。 硫化橡胶的比重为0.9〜1.0,表面粗糙度(RZD)为14微米以下。 橡胶混合物含有无机粉末负载发泡剂形式的热解发泡剂。 无机粉末负载发泡剂中的无机粉末的粒径为约9微米以下,热解发泡剂的粒径为约8微米以下。 此外,结晶PE的含量为每100份EPDM为6〜30份。 本发明的发泡橡胶挤出产品可以通过高速挤出制造。

    Reagent for measuring direct bilirubin
    30.
    发明授权
    Reagent for measuring direct bilirubin 失效
    用于测量直接胆红素的试剂

    公开(公告)号:US5599661A

    公开(公告)日:1997-02-04

    申请号:US365158

    申请日:1994-12-28

    CPC分类号: C12Q1/26 Y10T436/146666

    摘要: A reagent system and method are described for optically measuring direct bilirubin by the reaction of a bilirubin oxidase, oxidizing agent or diazonium salt, with the direct bilirubin, wherein a tetrapyrrole compound is provided in the presence of the bilirubin oxidase, oxidizing agent or diazonium salt. It is possible to accurately measure the direct bilirubin, which is known to increase considerably in the biological fluids of patients having obstructive jaundice, etc. The reagent system and method are useful in clinical settings, etc.

    摘要翻译: 描述了通过胆红素氧化酶,氧化剂或重氮盐与直接胆红素的反应来光学测量直接胆红素的试剂系统和方法,其中在胆红素氧化酶,氧化剂或重氮盐存在下提供四吡咯化合物 。 可以准确测量直接胆红素,已知在具有阻塞性黄疸的患者的生物液体中显着增加。试剂系统和方法在临床环境等中是有用的。