公开(公告)号：US20050072358A1

公开(公告)日：2005-04-07

申请号：US10712348

申请日：2003-11-14

申请人： Seiji Katsuoka ,  Masahiko Sekimoto ,  Toshio Yokoyama ,  Teruyuki Watanabe ,  Takahiro Ogawa ,  Kenichi Kobayashi ,  Mitsuru Miyazaki ,  Yasuyuki Motoshima ,  Akira Owatari ,  Naoki Dai

发明人： Seiji Katsuoka ,  Masahiko Sekimoto ,  Toshio Yokoyama ,  Teruyuki Watanabe ,  Takahiro Ogawa ,  Kenichi Kobayashi ,  Mitsuru Miyazaki ,  Yasuyuki Motoshima ,  Akira Owatari ,  Naoki Dai

IPC分类号： C23C18/16 ,  C25D7/12 ,  C25D17/00 ,  H01L21/00 ,  H01L21/677 ,  H01L21/687 ,  C23C16/00

CPC分类号： H01L21/67161 ,  C23C18/1628 ,  C23C18/1893 ,  C25D7/123 ,  C25D17/001 ,  C25D17/08 ,  H01L21/67051 ,  H01L21/67126 ,  H01L21/67173 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/6723 ,  H01L21/67742 ,  H01L21/67751 ,  H01L21/67766 ,  H01L21/67781 ,  H01L21/68707 ,  H01L21/68721 ,  Y10S134/902 ,  Y10T279/11

摘要： The present invention relates to a substrate processing apparatus useful for plating a substrate or processing a substrate by dipping a substrate in a processing liquid. A substrate processing apparatus of the present invention includes: a loading/unloading area for carrying in and out a substrate; a cleaning area for cleaning the substrate; and a plating area for plating the substrate, wherein the loading/unloading area is provided with a substrate transfer robot having a plurality of hands of dry-use design, a loading port mounted with a cassette for housing substrates, and a reversing machine of dry-use design for reversing the substrate from face up to face down.

摘要翻译： 本发明涉及通过将基板浸渍在处理液中而用于电镀基板或加工基板的基板处理装置。 本发明的基板处理装置包括：用于搬入和取出基板的装载/卸载区域; 用于清洁衬底的清洁区域; 以及用于电镀基板的电镀区域，其中装载/卸载区域设置有具有多个干用设计的手的基板传送机器人，安装有用于容纳基板的盒的装载端口和干燥的反转机器 - 用于将基板从正面朝下翻转的设计。

公开(公告)号：US06629883B2

公开(公告)日：2003-10-07

申请号：US09855677

申请日：2001-05-16

申请人： Seiji Katsuoka ,  Masahiko Sekimoto ,  Mitsuru Miyazaki ,  Naoki Noji ,  Kazuki Chiba ,  Kenji Fujimoto

发明人： Seiji Katsuoka ,  Masahiko Sekimoto ,  Mitsuru Miyazaki ,  Naoki Noji ,  Kazuki Chiba ,  Kenji Fujimoto

IPC分类号： B24B700

CPC分类号： H01L21/67219 ,  B24B37/345 ,  B24B41/061 ,  H01L21/67745 ,  H01L21/68792

摘要： A multi-head type polishing apparatus includes a polishing table having a polishing surface, a plurality of top rings for holding workpieces and pressing the workpieces against the polishing surface, and a carousel for supporting the top rings and indexing the top rings. The polishing apparatus further includes a rotary transporter disposed in a position which can be accessed by the top rings, and having a plurality of portions positioned on a predetermined circumference from a center of rotation of the rotary transporter for holding the workpieces. The polishing apparatus also has a pusher for transferring the workpieces between the rotary transporter and the top rings.

摘要翻译： 多头型抛光装置包括：具有研磨面的研磨台，多个用于保持工件的顶环，将工件压靠在研磨面上;以及转盘，用于支撑顶环，并使顶环分度。 抛光装置还包括设置在可由顶环接近的位置的旋转输送器，并且具有从旋转运送器的旋转中心位于预定圆周上的多个部分，用于保持工件。 抛光装置还具有用于在旋转运送器和顶环之间传送工件的推动器。

公开(公告)号：US06358128B1

公开(公告)日：2002-03-19

申请号：US09663417

申请日：2000-09-15

申请人： Kunihiko Sakurai ,  Tetsuji Togawa ,  Nobuyuki Takada ,  Satoshi Wakabayashi ,  Kenichiro Saito ,  Masahiko Sekimoto ,  Takuji Hayama ,  Daisuke Koga

发明人： Kunihiko Sakurai ,  Tetsuji Togawa ,  Nobuyuki Takada ,  Satoshi Wakabayashi ,  Kenichiro Saito ,  Masahiko Sekimoto ,  Takuji Hayama ,  Daisuke Koga

IPC分类号： B24B700

CPC分类号： B24B37/345 ,  B24B37/042 ,  H01L21/30625

摘要： A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus comprises a turntable having a polishing surface, a top ring for holding a workpiece and pressing the workpiece against the polishing surface to polish the workpiece, at least three cleaning apparatuses for cleaning polished workpieces, and a transfer structure for transferring the polished workpieces between at least three cleaning apparatuses. The polishing apparatus further includes a rotary transporter disposed in a position which can be accessed by said top rings and having a plurality of portions positioned on a predetermined circumference from a center of rotation of the rotary transporter for holding the workpieces.

公开(公告)号：US20130015075A1

公开(公告)日：2013-01-17

申请号：US13616050

申请日：2012-09-14

申请人： Masahiko SEKIMOTO ,  Yasuhiko Endo ,  Stephen Strausser ,  Takashi Takemura ,  Nobutoshi Saito ,  Fumio Kuriyama ,  Junichiro Yoshioka ,  Kuniaki Horie ,  Yoshio Minami ,  Kenji Kamoda

发明人： Masahiko SEKIMOTO ,  Yasuhiko Endo ,  Stephen Strausser ,  Takashi Takemura ,  Nobutoshi Saito ,  Fumio Kuriyama ,  Junichiro Yoshioka ,  Kuniaki Horie ,  Yoshio Minami ,  Kenji Kamoda

IPC分类号： C25D5/02 ,  C25D17/00

CPC分类号： C25D5/022 ,  C25D7/123 ,  C25D17/001 ,  H01L21/2885 ,  H01L21/67173 ,  H01L21/6723 ,  H01L24/11 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2224/05647 ,  H01L2924/00014

摘要： A plating apparatus has an ashing unit (300) configured to perform an ashing process on a resist (502) applied on a surface of a seed layer (500) formed on a substrate (W), and a pre-wetting section (26) configured to provide hydrophilicity to a surface of the substrate after the ashing process. The plating apparatus includes a pre-soaking section (28) configured to bring the surface of the substrate into contact with a treatment solution to clean or activate a surface of the seed layer formed on the substrate. The plating apparatus also includes a plating unit (34) configured to bring the surface of the substrate into a plating solution in a plating tank while the resist is used as a mask so as to form a plated film (504) on the surface of the seed layer formed on the substrate.

公开(公告)号：US07976362B2

公开(公告)日：2011-07-12

申请号：US12534465

申请日：2009-08-03

申请人： Seiji Katsuoka ,  Masahiko Sekimoto ,  Junji Kunisawa ,  Mitsuru Miyazaki ,  Teruyuki Watanabe ,  Kenichi Kobayashi ,  Masayuki Kumekawa ,  Toshio Yokoyama

发明人： Seiji Katsuoka ,  Masahiko Sekimoto ,  Junji Kunisawa ,  Mitsuru Miyazaki ,  Teruyuki Watanabe ,  Kenichi Kobayashi ,  Masayuki Kumekawa ,  Toshio Yokoyama

IPC分类号： B24B29/00

CPC分类号： B24B37/04 ,  B24B55/02 ,  Y10S451/914

摘要： A substrate polishing apparatus includes a substrate holding mechanism having a head for holding a substrate to be polished, and a polishing mechanism including a polishing table with a polishing pad mounted thereon. The substrate held by the head is pressed against the polishing pad on the polishing table to polish the substrate by relative movement of the substrate and the polishing pad. The substrate polishing apparatus also includes a substrate transfer mechanism for delivering the substrate to be polished to the head and receiving the polished substrate. The substrate transfer mechanism includes a substrate to-be-polished receiver for receiving the substrate to be polished, and a polished substrate receiver for receiving the substrate which has been polished.

摘要翻译： 一种基板研磨装置，具备：具有保持被研磨基板的头部的基板保持机构，以及具备安装有研磨垫的研磨台的研磨机构。 由头部保持的基板被压靠在抛光台上的抛光垫上，以通过基板和抛光垫的相对运动来抛光基板。 基板抛光装置还包括用于将要抛光的基板输送到头部并且接收经抛光的基板的基板传送机构。 基板转印机构包括用于接收待抛光的基板的待抛光基板和用于接收被抛光的基板的抛光的基板接收器。

公开(公告)号：US07810897B2

公开(公告)日：2010-10-12

申请号：US11704594

申请日：2007-02-09

申请人： Arichika Tanaka ,  Hiroaki Satoh ,  Masahiko Sekimoto ,  Satoshi Mohri ,  Toru Nishida

发明人： Arichika Tanaka ,  Hiroaki Satoh ,  Masahiko Sekimoto ,  Satoshi Mohri ,  Toru Nishida

IPC分类号： B41J2/015

CPC分类号： B41J2/0057 ,  B41J11/007 ,  B41J29/17

摘要： A droplet ejection apparatus includes: a droplet ejection head that ejects droplets; a conveying member that retains a recording medium and conveys the recording medium with facing the recording medium to the droplet ejection head; a coating member that coats the conveying member with a lubricant; and a cleaning member that cleans the conveying member. The droplet ejection apparatus satisfies the following formulae (1) L2≧L1  (1) wherein, in the formulae (1): L1 is the width, in the direction orthogonal to the conveying direction, of the cleaning of the conveying member by the cleaning member; and L2 is the width, in the direction orthogonal to the conveying direction, of coating the lubricant on the conveying member by the coating member.

摘要翻译： 液滴喷射装置包括：喷射液滴的液滴喷射头; 输送构件，其保持记录介质并将记录介质面向记录介质传送到液滴喷射头; 用润滑剂涂覆所述输送部件的涂布部件; 以及清洁输送构件的清洁构件。 液滴喷射装置满足下列公式（1）L2≥L1（1）其中，在公式（1）中：L1是与传送方向正交的方向上的清洁通过清洁的传送部件的宽度 会员; L2是在与输送方向正交的方向上通过涂布部件将润滑剂涂布在输送部件上的宽度。

公开(公告)号：US07699434B2

公开(公告)日：2010-04-20

申请号：US11589455

申请日：2006-10-30

申请人： Takeshi Zengo ,  Masahiko Sekimoto ,  Toru Nishida ,  Satoshi Mohri

发明人： Takeshi Zengo ,  Masahiko Sekimoto ,  Toru Nishida ,  Satoshi Mohri

IPC分类号： B41J2/165

CPC分类号： B41J2/16585 ,  B41J11/007 ,  B41J29/17

摘要： There is provided a liquid droplet discharging device including: a liquid droplet discharging head, for discharging liquid droplets; an opposing member, opposing the liquid droplet discharging head; and a blade, cleaning the opposing member and in contact with the opposing member, a plurality of grooves being formed on the blade, and the grooves having a groove width increasing from a bottom portion thereof to an opening portion thereof, and a groove angle decreasing from the side of the opposing member to the side opposite to the opposing member.

摘要翻译： 提供了一种液滴排出装置，包括：用于排出液滴的液滴喷射头; 相对构件，与液滴排出头相对; 以及刀片，清洁相对构件并与相对构件接触，形成在刀片上的多个槽，并且槽宽度从其底部增加到其开口部分，并且槽角度减小 从相对构件的一侧到与相对构件相对的一侧。

公开(公告)号：US07585205B2

公开(公告)日：2009-09-08

申请号：US11905687

申请日：2007-10-03

申请人： Seiji Katsuoka ,  Masahiko Sekimoto ,  Junji Kunisawa ,  Mitsuru Miyazaki ,  Teruyuki Watanabe ,  Kenichi Kobayashi ,  Masayuki Kumekawa ,  Toshio Yokoyama

发明人： Seiji Katsuoka ,  Masahiko Sekimoto ,  Junji Kunisawa ,  Mitsuru Miyazaki ,  Teruyuki Watanabe ,  Kenichi Kobayashi ,  Masayuki Kumekawa ,  Toshio Yokoyama

IPC分类号： B24B49/00

CPC分类号： B24B37/04 ,  B24B55/02 ,  Y10S451/914

摘要： A substrate polishing apparatus includes a substrate holding mechanism having a head for holding a substrate to be polished, and a polishing mechanism including a polishing table with a polishing pad mounted thereon. The substrate held by the head is pressed against the polishing pad on the polishing table to polish the substrate by relative movement of the substrate and the polishing pad. The substrate polishing apparatus also includes a substrate transfer mechanism for delivering the substrate to be polished to the head and receiving the polished substrate. The substrate transfer mechanism includes a substrate to-be-polished receiver for receiving the substrate to be polished, and a polished substrate receiver for receiving the substrate which has been polished.

摘要翻译： 一种基板研磨装置，具备：具有保持被研磨基板的头部的基板保持机构，以及具备安装有研磨垫的研磨台的研磨机构。 由头部保持的基板被压靠在抛光台上的抛光垫上，以通过基板和抛光垫的相对运动来抛光基板。 基板抛光装置还包括用于将要抛光的基板输送到头部并且接收经抛光的基板的基板传送机构。 基板转印机构包括用于接收待抛光的基板的待抛光基板和用于接收被抛光的基板的抛光的基板接收器。

公开(公告)号：US20080178800A1

公开(公告)日：2008-07-31

申请号：US12076834

申请日：2008-03-24

申请人： Seiji Katsuoka ,  Masahiko Sekimoto ,  Teruyuki Watanabe ,  Ryo Kato ,  Toshio Yokoyama ,  Kenichi Suzuki ,  Kenichi Kobayashi

发明人： Seiji Katsuoka ,  Masahiko Sekimoto ,  Teruyuki Watanabe ,  Ryo Kato ,  Toshio Yokoyama ,  Kenichi Suzuki ,  Kenichi Kobayashi

IPC分类号： B05C3/02

CPC分类号： H01L21/288 ,  C23C2/003 ,  C23C18/1619 ,  C23C18/163 ,  C23C18/1642 ,  H01L21/6708 ,  H01L21/67742 ,  H01L21/6838 ,  H01L21/76849

摘要： A substrate processing unit includes: a vertically-movable substrate holder for holding a substrate; a pan surrounding a periphery of the substrate holder; a cell, located below the substrate holder and within the pan, having in its interior a chemical processing section; and a cell cover, capable of closing a top opening of the cell, having a plurality of spray nozzles for separately spraying at least two types of processing liquids, wherein the pan and the cell each have an individual liquid discharge line.

公开(公告)号：US20070257963A1

公开(公告)日：2007-11-08

申请号：US11703586

申请日：2007-02-07

申请人： Arichika Tanaka ,  Hiroaki Satoh ,  Masahiko Sekimoto ,  Satoshi Mohri ,  Toru Nishida

发明人： Arichika Tanaka ,  Hiroaki Satoh ,  Masahiko Sekimoto ,  Satoshi Mohri ,  Toru Nishida

IPC分类号： B41J2/145

CPC分类号： B41J2/0057 ,  B41J11/007 ,  B41J29/17

摘要： A droplet ejection apparatus includes: a droplet ejection head that ejects droplets; a conveying member that retains a recording medium and conveys the recording medium with facing the recording medium to the droplet ejection head; a coating member that coats the conveying member with a coating liquid having a repellant property to the liquid ejected from the droplet ejection head; and a cleaning member that cleans the conveying member. The droplet ejection apparatus satisfies the following formulae L3≧L1, L2≧L1   (1) wherein, in a direction orthogonal to the conveying direction; L1 is the width of ink droplet ejecting of the droplet ejection head; L2 is the width of coating the coating liquid on the conveying member by the coating member; and L3 is the width of the cleaning of the conveying member by the cleaning member.

摘要翻译： 液滴喷射装置包括：喷射液滴的液滴喷射头; 输送构件，其保持记录介质并将记录介质面向记录介质传送到液滴喷射头; 涂覆部件，其具有对从所述液滴喷射头喷射的液体具有排斥性的涂布液; 以及清洁输送构件的清洁构件。 液滴喷射装置满足下列公式<？in-line-formula description =“In-line formula”end =“lead”？> L3> = L1，L2> = L1（1）<？ =“在线公式”end =“tail”？>其中，在与传送方向正交的方向上; L1是液滴喷射头的墨滴喷射的宽度; L2是通过涂覆部件涂覆在输送部件上的涂布液的宽度; L3是清洁部件清洁输送部件的宽度。