公开(公告)号：US20050023583A1

公开(公告)日：2005-02-03

申请号：US10928596

申请日：2004-08-26

申请人： Todd Bolken

发明人： Todd Bolken

IPC分类号： B29C45/14 ,  H01L21/56 ,  H01L23/31 ,  H05K3/00 ,  H05K3/28 ,  H01L29/76

CPC分类号： H05K3/284 ,  B29C45/1418 ,  B29C45/14647 ,  B29C45/14655 ,  H01L21/565 ,  H01L23/3121 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05599 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K3/0052 ,  Y10T29/49144 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor card is made by a method which in one molding step forms a plastic body on a substrate attached to a surrounding frame by narrow connecting segments spanning a peripheral opening. The connecting segments are motivated downward by pins outside of the card periphery, holding the substrate against a lower level of the mold cavity during molding. Molded wings extending laterally from the card periphery are also formed. Following molding and curing, the casting is removed and the card singulated by excising the wings from the card. The resulting card has smooth edge surfaces and precise dimensions. Separate glob top encapsulation is avoided.

摘要翻译： 通过以下方法制造半导体卡：在一个模制步骤中，通过跨越周边开口的窄连接段，在附接到周围框架的基板上形成塑料体。 连接段通过卡周围的销钉向下推动，在模制期间将基板保持在模腔的较低水平面上。 还形成了从卡周边横向延伸的成型翼。 在模制和固化之后，移除铸件并且通过从卡片上切下翅膀将卡片分割开来。 所得到的卡片具有光滑的边缘表面和精确的尺寸。 避免了单独的球顶封装。

公开(公告)号：US20060157838A1

公开(公告)日：2006-07-20

申请号：US11386154

申请日：2006-03-21

申请人： Todd Bolken

发明人： Todd Bolken

IPC分类号： H01L23/28 ,  H01L21/56

CPC分类号： H05K3/284 ,  B29C45/1418 ,  B29C45/14647 ,  B29C45/14655 ,  H01L21/565 ,  H01L23/3121 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05599 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K3/0052 ,  Y10T29/49144 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor card is made using a method which, in one molding step, forms a plastic body on a substrate attached to a surrounding frame by narrow connecting segments spanning a peripheral opening. The connecting segments are motivated downward by pins outside of the card periphery, holding the substrate against a lower level of the mold cavity during molding. Molded wings extending laterally from the card periphery are also formed. Following molding and curing, the casting is removed and the card singulated by excising the wings from the card. The resulting card has smooth edge surfaces and precise dimensions. Separate glob top encapsulation is avoided.

摘要翻译： 使用以下方法制造半导体卡，该方法在一个模制步骤中，通过跨越周边开口的窄连接段在附接到周围框架的基板上形成塑料体。 连接段通过卡周围的销钉向下推动，在模制期间将基板保持在模腔的较低水平面上。 还形成了从卡周边横向延伸的成型翼。 在模制和固化之后，移除铸件并且通过从卡片上切下翅膀将卡片分割开来。 所得到的卡片具有光滑的边缘表面和精确的尺寸。 避免了单独的球顶封装。

公开(公告)号：US20050287716A1

公开(公告)日：2005-12-29

申请号：US11216965

申请日：2005-08-31

申请人： Walter Moden ,  Todd Bolken

发明人： Walter Moden ,  Todd Bolken

IPC分类号： H01L21/56 ,  H01L23/31 ,  H01L21/44

CPC分类号： H01L21/565 ,  H01L23/3121 ,  H01L2924/0002 ,  H01L2924/00

摘要： A packaged assembly including an interposer or substrate supporting on a first side thereof a chip that is encased with an encapsulant is described. A second side of the interposer or substrate includes a barrier that blocks the flow of encapsulant to create a uniform encapsulant edge on the second side of the interposer. The uniform edge helps prevent flaking of the encapsulant off the interposer. The packaged assembly is adapted to be used with a further electronic device to expand the capablilities of the further electronic device.

摘要翻译： 描述了包括在其第一侧上支撑有封装有密封剂的芯片的插入件或基板的封装组件。 插入器或衬底的第二侧包括阻挡密封剂的流动以在中介层的第二面上产生均匀的密封剂边缘的屏障。 均匀的边缘有助于防止密封剂从中介层剥落。 封装的组件适于与另外的电子设备一起使用以扩展另外的电子设备的可用性。

公开(公告)号：US20050280143A1

公开(公告)日：2005-12-22

申请号：US11210632

申请日：2005-08-24

申请人： Frank Hall ,  Todd Bolken

发明人： Frank Hall ,  Todd Bolken

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50 ,  H01L21/56 ,  H01L23/13 ,  H01L23/31 ,  H01L23/34 ,  H01L23/495 ,  H01L23/498

CPC分类号： H01L21/565 ,  H01L23/13 ,  H01L23/3107 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/4951 ,  H01L23/49816 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32014 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48465 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01087 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method and apparatus for assembling and packaging semiconductor die assemblies utilizes a coating element such as a wafer back side laminate formed on a back side of a semiconductor die is disclosed. The coating element may be formed from a somewhat compressible and, optionally, resilient material, which seals against a surface of a mold cavity while the semiconductor die assembly is being encapsulated. In this manner, the coating element prevents encapsulant material from covering at least a portion of the back side of the semiconductor die to prevent encapsulant flashing over the back side and thus improve heat dissipation characteristics of the packaged semiconductor die during operation.

摘要翻译： 公开了一种用于组装和封装半导体管芯组件的方法和装置，其利用了形成在半导体管芯的背面上的诸如晶片背面层叠体的涂层元件。 涂覆元件可以由稍微可压缩的和任选的弹性材料形成，其在半导体管芯组件被封装时密封模腔的表面。 以这种方式，涂覆元件防止密封剂材料覆盖半导体管芯的背面的至少一部分，以防止密封剂在背面闪烁，从而改善封装半导体管芯在操作期间的散热特性。

公开(公告)号：US20050191787A1

公开(公告)日：2005-09-01

申请号：US11118498

申请日：2005-04-29

申请人： Todd Bolken ,  Chad Cobbley

发明人： Todd Bolken ,  Chad Cobbley

IPC分类号： H01L21/50 ,  H01L23/31 ,  H01L31/0203 ,  H01L31/00

CPC分类号： H01L23/00 ,  B33Y80/00 ,  H01L21/50 ,  H01L23/02 ,  H01L23/3128 ,  H01L24/97 ,  H01L27/14618 ,  H01L27/14632 ,  H01L27/14636 ,  H01L27/14687 ,  H01L31/0203 ,  H01L2224/05573 ,  H01L2224/13025 ,  H01L2224/16235 ,  H01L2224/48091 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2924/16235 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2224/05599

摘要： Packaging assemblies for optically interactive devices and methods of forming the packaging assemblies in an efficient manner that eliminates or reduces the occurrence of process contaminants. In a first embodiment, a transparent cover is attached to a wafer of semiconductor material containing a plurality of optically interactive devices. The wafer is singulated, and the optically interactive devices are mounted on an interposer and electrically connected with wire bonds. In a second embodiment, the optically interactive devices are electrically connected to the interposer with backside conductive elements. In a third embodiment, the optically interactive devices are mounted to the interposer prior to attaching a transparent cover. A layer of encapsulant material is formed over the interposer, and the interposer and encapsulant material are cut to provide individual packaging assemblies. In a fourth embodiment, the optically interactive devices are mounted in a preformed leadless chip carrier.

摘要翻译： 用于光学交互式装置的包装组件和以有效方式形成包装组件的方法，其消除或减少工艺污染物的发生。 在第一实施例中，透明盖附着到包含多个光学交互装置的半导体材料的晶片上。 晶片被分离，并且光学交互设备安装在插入器上并与引线键合电连接。 在第二实施例中，光学交互式设备与背面导电元件电连接到插入器。 在第三实施例中，在附加透明盖之前，将光学交互式装置安装到插入器。 在该插入件上方形成一层密封材料，并且切断插入物和密封剂材料以提供单独的包装组件。 在第四实施例中，光学交互式装置安装在预先形成的无引线芯片载体中。

公开(公告)号：US20050116355A1

公开(公告)日：2005-06-02

申请号：US11002945

申请日：2004-12-02

申请人： Todd Bolken ,  Chad Cobbley

发明人： Todd Bolken ,  Chad Cobbley

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L23/02 ,  H01L23/48 ,  H01L27/146

CPC分类号： H01L27/14618 ,  B33Y80/00 ,  H01L23/293 ,  H01L23/3128 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L27/14603 ,  H01L27/14625 ,  H01L27/14683 ,  H01L31/0203 ,  H01L2224/05599 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/484 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2224/8592 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2225/06506 ,  H01L2225/06555 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/014 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/1815 ,  Y10S257/924 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00011

摘要： The invention provides methods for packaging for electronic devices that are light or other radiation-sensitive, such as image sensors including CCD or CMOS chips. In one embodiment of the invention, an image sensor package is assembled by surrounding a chip with a barrier of transfer mold compound and covering the chip with a transparent lid. In another embodiment of the invention, the perimeter area of a chip, including interconnections such as wire bonds and bond pads, is encapsulated with a liquid dispensed epoxy, and a transparent lid is attached. In yet another embodiment of the invention, chip encapsulation is accomplished with a unitary shell of entirely transparent material. In yet another embodiment of the invention, a substrate-mounted chip and a transparent lid are loaded into a transfer mold that holds them in optimal alignment. The transfer mold is then filled with molding compound to encapsulate the chip and interconnections, and to retain the transparent lid.

摘要翻译： 本发明提供了用于轻或其它辐射敏感的电子设备的封装方法，例如包括CCD或CMOS芯片的图像传感器。 在本发明的一个实施例中，图像传感器封装通过围绕具有转移模具化合物的屏障的芯片组装并用透明盖覆盖芯片来组装。 在本发明的另一个实施例中，芯片的周边区域（包括诸如引线接合和接合焊盘的互连）用液体分配的环氧树脂封装，并且附着有透明盖。 在本发明的另一个实施例中，芯片封装通过完全透明材料的整体外壳完成。 在本发明的另一个实施例中，将衬底安装的芯片和透明盖子装载到转移模具中，以使它们保持最佳对准。 然后将转移模具填充模塑料以封装芯片和互连，并保持透明盖。

公开(公告)号：US20050012227A1

公开(公告)日：2005-01-20

申请号：US10919373

申请日：2004-08-17

申请人： Todd Bolken

发明人： Todd Bolken

IPC分类号： H01L21/56 ,  H01L23/31 ,  H01L21/48 ,  H01L29/40

CPC分类号： H01L24/97 ,  H01L21/565 ,  H01L23/3128 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/01005 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/09701 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2224/85 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/85399 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： An encapsulation mold for forming an encapsulation layer over a semiconductor assembly is disclosed. A semiconductor assembly with multiple semiconductor dies secured to a single semiconductor support structure is inserted into an encapsulation mold. The mold contains a first section and a second section, which form a cavity around the assembly. The mold contains an aperture for transferring encapsulating material into the mold cavity. One of the mold sections has a design feature, such as a raised rib or groove interconnecting at approximately the separation or saw-cut regions of the individual dies of the assembly. Encapsulation material is inserted into the mold cavity until the cavity is filled. The mold section design feature shapes the top surface of the encapsulation layer. The mold is removed leaving the exterior surface of the encapsulation layer patterned with the design feature. The assembly is then separated into individual dies along the design feature boundary of the encapsulation layer's exterior surface.

摘要翻译： 公开了一种用于在半导体组件上形成封装层的封装模具。 将具有固定到单个半导体支撑结构的多个半导体管芯的半导体组件插入到封装模具中。 模具包括第一部分和第二部分，其在组件周围形成空腔。 模具包含用于将包封材料转移到模腔中的孔。 模具部分之一具有设计特征，例如在组件的各个模具的大致分离或锯切区域处互相连接的凸肋或凹槽。 将包封材料插入模腔中，直到空腔被填充。 模具部分设计特征使包封层的顶表面成形。 去除模具，留下封装层的外表面用设计特征图案化。 然后将组件沿着封装层的外表面的设计特征边界分离成单独的模具。

公开(公告)号：US08709878B2

公开(公告)日：2014-04-29

申请号：US13367213

申请日：2012-02-06

申请人： Todd Bolken ,  Scott Willmorth ,  Bradley Bitz

发明人： Todd Bolken ,  Scott Willmorth ,  Bradley Bitz

IPC分类号： H01L21/00

CPC分类号： H01L27/14618 ,  H01L27/14625 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/15174 ,  H04N5/2254 ,  H04N5/2257 ,  H01L2224/05599

摘要： A method of packaging imager devices and optics modules is disclosed which includes positioning an imager device and an optics module in each of a plurality of openings in a carrier body, introducing an encapsulant material into each of the openings in the carrier body and cutting the carrier body to singulate the plurality of imager devices and optics modules into individual units, each of which comprise an imager device and an optics module. A device is also disclosed which includes an imager device comprising a plurality of photosensitive elements and an optics module coupled to the imager device, the optics module comprising at least one lens that, when the optics module is coupled to the imager device, is positioned a fixed, non-adjustable distance from the plurality of photosensitive elements.

摘要翻译： 公开了一种封装成像器件和光学模块的方法，其包括将成像器装置和光学模块定位在载体主体中的多个开口中的每一个中，将密封剂材料引入载体主体中的每个开口中并切割载体 将多个成像器件和光学模块分成单独的单元，每个单元包括成像器装置和光学模块。 还公开了一种装置，其包括包括多个感光元件的成像器装置和耦合到成像器装置的光学模块，所述光学模块包括至少一个透镜，当所述光学模块耦合到所述成像器装置时， 固定的，不可调节的距离多个感光元件。

公开(公告)号：US20120135560A1

公开(公告)日：2012-05-31

申请号：US13367213

申请日：2012-02-06

申请人： Todd BOLKEN ,  Scott WILLMORTH ,  Bradley BITZ

发明人： Todd BOLKEN ,  Scott WILLMORTH ,  Bradley BITZ

IPC分类号： H01L31/18 ,  H01L21/52

CPC分类号： H01L27/14618 ,  H01L27/14625 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/15174 ,  H04N5/2254 ,  H04N5/2257 ,  H01L2224/05599

摘要： A method of packaging imager devices and optics modules is disclosed which includes positioning an imager device and an optics module in each of a plurality of openings in a carrier body, introducing an encapsulant material into each of the openings in the carrier body and cutting the carrier body to singulate the plurality of imager devices and optics modules into individual units, each of which comprise an imager device and an optics module. A device is also disclosed which includes an imager device comprising a plurality of photosensitive elements and an optics module coupled to the imager device, the optics module comprising at least one lens that, when the optics module is coupled to the imager device, is positioned a fixed, non-adjustable distance from the plurality of photosensitive elements.

摘要翻译： 公开了一种封装成像器件和光学模块的方法，其包括将成像器装置和光学模块定位在载体主体中的多个开口中的每一个中，将密封剂材料引入载体主体中的每个开口中并切割载体 将多个成像器件和光学模块分成单独的单元，每个单元包括成像器装置和光学模块。 还公开了一种装置，其包括包括多个感光元件的成像器装置和耦合到成像器装置的光学模块，所述光学模块包括至少一个透镜，当所述光学模块耦合到所述成像器装置时， 固定的，不可调节的距离多个感光元件。

公开(公告)号：US20060267169A1

公开(公告)日：2006-11-30

申请号：US11481273

申请日：2006-07-05

申请人： Todd Bolken ,  Chad Cobbley

发明人： Todd Bolken ,  Chad Cobbley

IPC分类号： H01L23/02

CPC分类号： H01L27/14618 ,  B33Y80/00 ,  H01L23/293 ,  H01L23/3128 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L27/14603 ,  H01L27/14625 ,  H01L27/14683 ,  H01L31/0203 ,  H01L2224/05599 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/484 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2224/8592 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2225/06506 ,  H01L2225/06555 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/014 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/1815 ,  Y10S257/924 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00011

摘要： The invention provides methods for packaging for electronic devices that are light or other radiation-sensitive, such as image sensors including CCD or CMOS chips. In one embodiment of the invention, an image sensor package is assembled by surrounding a chip with a barrier of transfer mold compound and covering the chip with a transparent lid. In another embodiment of the invention, the perimeter area of a chip, including interconnections such as wire bonds and bond pads, is encapsulated with a liquid dispensed epoxy, and a transparent lid is attached. In yet another embodiment of the invention, chip encapsulation is accomplished with a unitary shell of entirely transparent material. In yet another embodiment of the invention, a substrate-mounted chip and a transparent lid are loaded into a transfer mold that holds them in optimal alignment.

摘要翻译： 本发明提供了用于轻或其它辐射敏感的电子设备的封装方法，例如包括CCD或CMOS芯片的图像传感器。 在本发明的一个实施例中，图像传感器封装通过围绕具有转移模具化合物的屏障的芯片组装并用透明盖覆盖芯片来组装。 在本发明的另一个实施例中，芯片的周边区域（包括诸如引线接合和接合焊盘的互连）用液体分配的环氧树脂封装，并且附着有透明盖。 在本发明的另一个实施例中，芯片封装通过完全透明材料的整体外壳完成。 在本发明的另一个实施例中，将衬底安装的芯片和透明盖子装载到转移模具中，以使它们保持最佳对准。