公开(公告)号：US4943666A

公开(公告)日：1990-07-24

申请号：US337886

申请日：1989-04-14

Applicant: Taiiti Okada ,  Toru Ishida

Inventor： Taiiti Okada ,  Toru Ishida

IPC: C07C201/08 ,  C07C67/00 ,  C07C201/00 ,  C07C205/26

CPC classification number: C07C201/08

Abstract: An improved industrial process for producing a compound of the general formula: ##STR1## wherein R is an alkyl group having 1 to 4 carbon atoms which comprises reacting a compound of the general formula: ##STR2## wherein R is as defined above with nitrous acid in a mixed solvent of water and a water-insoluble or slightly soluble organic solvent.

公开(公告)号：US4863683A

公开(公告)日：1989-09-05

申请号：US66182

申请日：1987-06-24

Applicant: Seiichi Nakatani ,  Satoru Yuhaku ,  Hideyuki Okinaka ,  Toru Ishida ,  Osamu Makino ,  Tatsuro Kikuchi

Inventor： Seiichi Nakatani ,  Satoru Yuhaku ,  Hideyuki Okinaka ,  Toru Ishida ,  Osamu Makino ,  Tatsuro Kikuchi

IPC: C04B41/51 ,  H01B1/20 ,  H01L21/48 ,  H01L23/482 ,  H05K1/09

CPC classification number: H05K1/092 ,  C04B41/5127 ,  C04B41/5144 ,  H01B1/20 ,  H01L21/4867 ,  H01L23/4828 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K3/4629

Abstract: A manufacturing method for a multilayered ceramic body using Cu, Ni, Co or Fe as a conductor material, and a conductor forming paste of particular composition of CuO, NiO, CoO or Fe.sub.2 O.sub.3 as the main component, the paste being applied to the multilayered body. The manufacturing method comprises: a process of forming the multilayered body with conductor paste of CuO, NiO, CoO or Fe.sub.2 O.sub.3 as the main component and insulating paste formed of glass and/or ceramic, so that a binder is removed from the laminate by heat treatment in an oxidizing atmosphere; a process of heat treatment for reducing the oxide; and a sintering process for sintering the laminate in a nitrogen atmosphere.

Abstract translation: 使用Cu，Ni，Co或Fe作为导体材料的多层陶瓷体的制造方法，以CuO，NiO，CoO或Fe2O3为特征的导体形成膏为主要成分，将该糊剂涂敷于多层体 。 该制造方法包括：以CuO，NiO，CoO或Fe2O3的导体浆料为主要成分的多层体和由玻璃和/或陶瓷形成的绝缘膏形成多层体的方法，通过热处理从粘合剂中除去粘合剂 在氧化气氛中 一种用于还原氧化物的热处理方法; 以及在氮气气氛中烧结层压体的烧结工艺。

公开(公告)号：US4732798A

公开(公告)日：1988-03-22

申请号：US898892

申请日：1986-08-21

Applicant: Toru Ishida ,  Yasuharu Kikuchi ,  Tatsurou Kikuchi ,  Yasuhiko Horio

Inventor： Toru Ishida ,  Yasuharu Kikuchi ,  Tatsurou Kikuchi ,  Yasuhiko Horio

IPC: H05K3/46 ,  H01L21/70 ,  H01L23/538 ,  H05K1/03 ,  H05K1/16 ,  H05K3/24 ,  H05K3/40 ,  B32B3/00

CPC classification number: H05K3/4061 ,  H01L21/705 ,  H01L23/5383 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K1/167 ,  H05K2201/035 ,  H05K3/248 ,  H05K3/4629 ,  H05K3/4667 ,  Y10S428/901 ,  Y10T428/24322 ,  Y10T428/24917

Abstract: The present invention relates to a base metal conductor multilayered substrate capable of being integral with thick film components such as thick film resistors and to a method for producing such substrate.

Abstract translation: 本发明涉及能够与厚膜电阻等厚膜成分一体化的母金属导体多层基板及其制造方法。

公开(公告)号：US06820179B2

公开(公告)日：2004-11-16

申请号：US10000034

申请日：2001-12-04

Applicant: Nobuharu Kobayashi ,  Masanobu Kawamura ,  Toru Ishida ,  Masato Momii ,  Naoki Fujita

Inventor： Nobuharu Kobayashi ,  Masanobu Kawamura ,  Toru Ishida ,  Masato Momii ,  Naoki Fujita

IPC: G06F1200

CPC classification number: G11C16/22 ,  G11C7/1006 ,  G11C16/20

Abstract: A semiconductor device which has an internal circuit for performing a circuit operation corresponding to a signal inputted or outputted through an input/output interface circuit adapted to a serial bus. The semiconductor device has a non-volatile storage circuit for storing identification data. Internal identification data stored in the non-volatile storage circuit is compared with external identification data included in an input signal supplied through the serial bus by a comparator circuit. A control circuit is responsive to a match detecting signal generated by the comparator circuit to perform a circuit operation corresponding to an input signal subsequently supplied through the serial bus to change the internal identification data stored in the non-volatile storage circuit.

Abstract translation: 一种半导体器件，具有内部电路，用于执行与通过适用于串行总线的输入/输出接口电路输入或输出的信号相对应的电路操作。 半导体器件具有用于存储识别数据的非易失性存储电路。 存储在非易失性存储电路中的内部识别数据与由比较器电路通过串行总线提供的输入信号中包含的外部识别数据进行比较。 控制电路响应由比较器电路产生的匹配检测信号，以执行与随后通过串行总线提供的输入信号相对应的电路操作，以改变存储在非易失性存储电路中的内部识别数据。

公开(公告)号：US06783211B2

公开(公告)日：2004-08-31

申请号：US09471981

申请日：1999-12-23

Applicant: Emiko Igaki ,  Toru Ishida ,  Masakazu Tanahashi ,  Hidetomo Nagahara ,  Kiyohide Amemiya ,  Masahiko Hashimoto ,  Masayoshi Miura ,  Masaichiro Tatekawa

Inventor： Emiko Igaki ,  Toru Ishida ,  Masakazu Tanahashi ,  Hidetomo Nagahara ,  Kiyohide Amemiya ,  Masahiko Hashimoto ,  Masayoshi Miura ,  Masaichiro Tatekawa

IPC: B41J2045

CPC classification number: B41J2/14209 ,  B41J2002/14217

Abstract: An ink-jet recording head has nozzles capable of independent ejection and being arranged in high density, in which strength is high, fabricating yield is high, a cost is reduced, ejection efficiency is high, and ejection repeating frequency is high. In this ink-jet recording head, there are two-dimensionally arranged units, in each of which an ink pressure chamber, a partition wall serving as a driving portion, a pressure buffer chamber and a fixed wall are arranged in the same direction.

Abstract translation: 喷墨记录头具有能够独立排出的喷嘴，并且以高密度布置，其中强度高，制造成品率高，成本降低，喷射效率高，喷射重复频率高。 在这种喷墨记录头中，存在二维排列的单元，其中分别设置有墨压力室，作为驱动部分的隔壁，压力缓冲室和固定壁。

公开(公告)号：US06465082B1

公开(公告)日：2002-10-15

申请号：US09554502

申请日：2000-05-16

Applicant: Hiroaki Takezawa ,  Masahide Tsukamoto ,  Minehiro Itagaki ,  Yoshihiro Bessho ,  Hideo Hatanaka ,  Yasushi Fukumura ,  Kazuo Eda ,  Toru Ishida

Inventor： Hiroaki Takezawa ,  Masahide Tsukamoto ,  Minehiro Itagaki ,  Yoshihiro Bessho ,  Hideo Hatanaka ,  Yasushi Fukumura ,  Kazuo Eda ,  Toru Ishida

IPC: H05K100

CPC classification number: H05K3/3436 ,  H01L23/49816 ,  H01L2224/16225 ,  H05K1/0271 ,  H05K3/105 ,  H05K3/321 ,  H05K2201/0212 ,  H05K2201/0379 ,  H05K2201/10257 ,  H05K2201/10992 ,  H05K2203/121 ,  Y02P70/613 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/254 ,  Y10T428/31681

Abstract: A stress relaxation type electronic component which is to be mounted on a circuit board, wherein a stress relaxation mechanism member is disposed on a surface of said electronic component, said surface being on a side of a connection portion where said electronic component is to be connected to said circuit board, and said stress relaxation mechanism member is electrically conductive.

Abstract translation: 一种要安装在电路板上的应力松弛型电子部件，其中应力松弛机构部件设置在所述电子部件的表面上，所述表面位于要连接所述电子部件的连接部分的一侧 到所述电路板，并且所述应力松弛机构构件是导电的。

公开(公告)号：US06461719B1

公开(公告)日：2002-10-08

申请号：US09720240

申请日：2000-12-22

Applicant: Naomi Ichikuni ,  Toru Ishida ,  Seitoku Kaya ,  Atsushi Funaki ,  Teruo Takakura

Inventor： Naomi Ichikuni ,  Toru Ishida ,  Seitoku Kaya ,  Atsushi Funaki ,  Teruo Takakura

IPC: B32B310

CPC classification number: C08L27/18 ,  C08L2205/02 ,  Y10T428/24 ,  Y10T428/24355 ,  Y10T428/24405 ,  C08L2666/04

Abstract: An agricultural covering material made of a fluorine-containing polymer film having a dynamic viscoelastic modulus of from 1 to 70 kg/mm2, a tensile strength of from 1.5 to 5.0 kg/mm2, a specific gravity of from 1.0 to 2.0 and a contact angle with water of at most 106°.

Abstract translation: 由动态粘弹性模量为1〜70kg / mm 2，拉伸强度为1.5〜5.0kg / mm 2，比重为1.0〜2.0的含氟聚合物膜制成的农业覆盖材料和接触角 水最多为106°。

公开(公告)号：US5090119A

公开(公告)日：1992-02-25

申请号：US605096

申请日：1990-10-30

Applicant: Toshio Tsuda ,  Yasuhiko Horio ,  Yoshihiro Bessho ,  Toru Ishida

Inventor： Toshio Tsuda ,  Yasuhiko Horio ,  Yoshihiro Bessho ,  Toru Ishida

IPC: H01L21/607 ,  H01L23/485

CPC classification number: H01L24/12 ,  H01L24/11 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  Y10T29/49149 ,  Y10T29/49151

Abstract: A substrate provided with conductive terminals and another substrate provided with electrode pads and two-stepped electrical contact bumps formed respectively on the electrode pads and each consisting of a first raised portion and a second raised portion formed on the first raised portion, are joined securely by bonding the second raised portions coated respectively with droplets of conductive adhesive and the corresponding conductive terminals by the droplets of the conducting adhesive. The ratio of the area of a section of the first raised portion in a plane parallel to the surface of the electrode pad is greater than the area of a section of the second raised portion parallel to the section of the first raised portion at a predetermined ratio. In an exemplary method of forming the electrical contact bump, the second raised portion is formed by bending a conductive wire in a loop by a ball bonding apparatus.

公开(公告)号：US5004715A

公开(公告)日：1991-04-02

申请号：US483462

申请日：1990-02-22

Applicant: Yasuhiko Hakotani ,  Seiichi Nakatani ,  Satoru Yuuhaku ,  Tsutomu Nishimura ,  Toru Ishida

Inventor： Yasuhiko Hakotani ,  Seiichi Nakatani ,  Satoru Yuuhaku ,  Tsutomu Nishimura ,  Toru Ishida

IPC: C04B35/00 ,  C04B35/497 ,  C04B35/499 ,  H01B3/12 ,  H01G4/008 ,  H01G4/12

CPC classification number: H01G4/0085 ,  C04B35/497 ,  C04B35/499 ,  H01G4/1254

Abstract: A low temperature sintering dielectric ceramic composition, which exhibits high dielectric constant, low dielectric loss, high electrical resistivity, high mechanical strength and narrow grain size distribution, is disclosed. The ceramic composition is a binary system comprising lead magnesium niobate (Pb(Mg.sub.1/3 Nb.sub.2/3)O.sub.3) and copper oxide, or a ternary system comprising lead magnesium niobate (Pb(Mg.sub.1/3 Nb.sub.2/3)O.sub.3), lead titanate (PbTiO.sub.3) and copper oxide. A multilayer ceramic capacitor comprising internal copper electrodes and ceramic dielectric layers consisting of the dielectric ceramic composition is also disclosed. A method of readily manufacturing the multilayer ceramic capacitor with copper internal electrodes is also disclosed.This fabrication method comprises a stop of forming a multilayer laminate by the green tape multilayer laminating method using dielectric ceramic tapes and a conductor paste containing CuO as its main component; a step of heat-treatment for decomposing and removing organic binder in air (binder removing process); a step of reducing CuO in the internal electrode layers to copper by heat-treatment in a mixed gas atmosphere of nitrogen and hydrogen (reduction process); and a step of sintering the multilayer laminate in a nitrogen atmosphere (sintering process).

Abstract translation: 公开了一种具有高介电常数，低介电损耗，高电阻率，高机械强度和窄晶粒尺寸分布的低温烧结介电陶瓷组合物。 陶瓷组合物是包含铌酸铅镁（Pb（Mg1 / 3Nb2 / 3）O3）和氧化铜的二元体系，或包含铌酸铅镁（Pb（Mg1 / 3Nb2 / 3）O3），钛酸铅（PbTiO3） ）和氧化铜。 还公开了一种包括内部铜电极和由介电陶瓷组合物组成的陶瓷电介质层的多层陶瓷电容器。 还公开了一种容易地制造具有铜内部电极的多层陶瓷电容器的方法。 该制造方法包括通过使用电介质陶瓷带和含有CuO作为其主要成分的导体糊的生胶带多层层压法来形成多层层压体; 在空气中分解除去有机粘合剂的热处理步骤（粘合剂除去工艺）; 通过在氮气和氢气的混合气体气氛中通过热处理将内部电极层中的CuO还原成铜的步骤（还原过程）; 以及在氮气氛中烧结多层层叠体的工序（烧结工序）。

公开(公告)号：US4812422A

公开(公告)日：1989-03-14

申请号：US869904

申请日：1986-06-03

Applicant: Satoru Yuhaku ,  Seiichi Nakatani ,  Tsutomu Nishimura ,  Toru Ishida

Inventor： Satoru Yuhaku ,  Seiichi Nakatani ,  Tsutomu Nishimura ,  Toru Ishida

IPC: H01L21/31 ,  C03C3/091 ,  H01B3/02 ,  H01B3/10 ,  H05K1/03 ,  C03C8/16 ,  C03C8/14

CPC classification number: H05K1/0306 ,  C03C3/091 ,  H01B3/10 ,  H05K3/4629

Abstract: Disclosed is a dielectric paste for a ceramic multilayer wiring substrate, of which feature, among others, lies in the composition of inorganic components comprised of ceramics made of Al.sub.2 O.sub.3, SiO.sub.2, CaO and MgO, and a borosilicate glass. This can be prepared by mixing a part of the glass with the ceramic, calcining the mixture at a high temperature, and then adding the remaining glass to mix with the calcined product. The insulation layer is densely formed, and a dielectric paste excelling in electric insulating property can be obtained by mixing this composition with an organic liquid.

Abstract translation: 公开了一种用于陶瓷多层布线基板的电介质浆料，其特征在于其中包括由Al 2 O 3，SiO 2，CaO和MgO制成的陶瓷和硼硅酸盐玻璃组成的无机组分的组成。 这可以通过将玻璃的一部分与陶瓷混合，在高温下煅烧混合物，然后加入剩余的玻璃与煅烧产物混合来制备。 绝缘层密集地形成，并且通过将该组合物与有机液体混合，可以获得优异的电绝缘性能的电介质糊料。